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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Total Products: 76,658
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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CYT4BFBCHDQ0BZSGST
CYT4BFBCHDQ0BZSGSTInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 272BGAMicrocontrollers272-BGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (16×16)
Package / Case:
272-LFBGA
798
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CYT4BFBCJDQ0BZEGS
CYT4BFBCJDQ0BZEGSInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 272BGAMicrocontrollers272-BGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (16×16)
Package / Case:
272-LFBGA
389
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CYT4BFBCJDQ0BZEGST
CYT4BFBCJDQ0BZEGSTInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 272BGAMicrocontrollers272-BGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (16×16)
Package / Case:
272-LFBGA
1,030
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CYT4BFBCJDQ0BZSGS
CYT4BFBCJDQ0BZSGSInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 272BGAMicrocontrollers272-BGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (16×16)
Package / Case:
272-LFBGA
699
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CYT4BFBCJDQ0BZSGST
CYT4BFBCJDQ0BZSGSTInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 272BGAMicrocontrollers272-BGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (16×16)
Package / Case:
272-LFBGA
73
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CYT4BFCCHDQ0BZEGS
CYT4BFCCHDQ0BZEGSInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
1,035
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CYT4BFCCHDQ0BZEGST
CYT4BFCCHDQ0BZEGSTInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
51
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CYT4BFCCHDQ0BZSGS
CYT4BFCCHDQ0BZSGSInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
301
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CYT4BFCCHDQ0BZSGST
CYT4BFCCHDQ0BZSGSTInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
1,023
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CYT4BFCCHDR0BZEGSTN/ACYT4BFCCHDR0BZEGSTInfineon TechnologiesIC MCU 32BIT 8.188MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
195
Program Memory Size:
8.188MB (8.188M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
566
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CYT4BFCCJDQ0BZEGS
CYT4BFCCJDQ0BZEGSInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+/M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
739
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CYT4BFCCJDQ0BZEGST
CYT4BFCCJDQ0BZEGSTInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
1,341
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CYT4BFCCJDQ0BZSGS
CYT4BFCCJDQ0BZSGSInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
549
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CYT4BFCCJDQ0BZSGST
CYT4BFCCJDQ0BZSGSTInfineon TechnologiesIC MCU 32BT 8.1875MB FLSH 320BGAMicrocontrollers320-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Quad-Core
Speed:
100MHz, 350MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
240
Program Memory Size:
8.1875MB (8.1875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 114x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-BGA (17×17)
Package / Case:
320-LFBGA
425
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CYT4DNJBRCQ1BZSGSN/ACYT4DNJBRCQ1BZSGSInfineon TechnologiesIC MCU 32BIT 6.188MB FLSH 327BGAMicrocontrollers327-BGAN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Quad-Core
Speed:
320MHz
Connectivity:
DMA, I2S, LVD, Temp Sensor, WDT
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
168
Program Memory Size:
6.188MB (6.188M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
327-BGA
Package / Case:
327-BGA
1,147
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CYT4DNJBRCQ1BZSGSTN/ACYT4DNJBRCQ1BZSGSTInfineon TechnologiesIC MCU 32BIT 6.188MB FLSH 327BGAMicrocontrollers327-BGAN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size:
32-Bit Quad-Core
Speed:
320MHz
Connectivity:
DMA, I2S, LVD, Temp Sensor, WDT
Peripherals:
DMA, I2S, LVD, Temp Sensor, WDT
Number of I/O:
168
Program Memory Size:
6.188MB (6.188M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
640K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
327-BGA
Package / Case:
327-BGA
1,077
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N/AN/ACYTR21100-44LQI28Infineon TechnologiesTRACKPADMicrocontrollersN/AN/A–

N/A

18
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N/AN/ACYTR21100-44LQI28TInfineon TechnologiesTRACKPADMicrocontrollersN/AN/A–

N/A

1,546
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D12312SVF20V
D12312SVF20VRenesasIC MCU 16BIT ROMLESS 100QFPMicrocontrollers100-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
70
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
718
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D12312SVF25V
D12312SVF25VRenesasIC MCU 16BIT ROMLESS 100QFPMicrocontrollers100-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
70
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
1,759
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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