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Microcontrollers
Total Products: 76,658
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | DSPIC33EP16GS506T-I/PT | Microchip Technology | IC MCU 16BIT 16KB FLASH 64TQFP | Microcontrollers | 64-TQFP (10x10) | N/A | -40°C ~ 85°C | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 22x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 64-TQFP (10×10) Package / Case: 64-TQFP | 263 | ||
 | DSPIC33EP256GM304-E/ML | Microchip Technology | IC MCU 16BIT 256KB FLASH 44QFN | Microcontrollers | 44-QFN (8x8) | N/A | -40°C ~ 125°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 18x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 44-QFN (8×8) Package / Case: 44-VQFN Exposed Pad | 928 | ||
 | DSPIC33EP256GM304-E/PT | Microchip Technology | IC MCU 16BIT 256KB FLASH 44TQFP | Microcontrollers | 44-TQFP (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 18x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 44-TQFP (10×10) Package / Case: 44-TQFP | 143 | ||
 | DSPIC33EP256GM304-H/ML | Microchip Technology | IC MCU 16BIT 256KB FLASH 44QFN | Microcontrollers | 44-QFN (8x8) | N/A | -40°C ~ 150°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Data Converters: A/D 18x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 44-QFN (8×8) Package / Case: 44-VQFN Exposed Pad | 1,015 | ||
 | DSPIC33EP256GM304-H/PT | Microchip Technology | IC MCU 16BIT 256KB FLASH 44TQFP | Microcontrollers | 44-TQFP (10x10) | N/A | -40°C ~ 150°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Data Converters: A/D 18x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 44-TQFP (10×10) Package / Case: 44-TQFP | 327 | ||
 | DSPIC33EP256GM304-I/ML | Microchip Technology | IC MCU 16BIT 256KB FLASH 44QFN | Microcontrollers | 44-QFN (8x8) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 18x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFN (8×8) Package / Case: 44-VQFN Exposed Pad | 1,654 | ||
 | DSPIC33EP256GM304-I/PT | Microchip Technology | IC MCU 16BIT 256KB FLASH 44TQFP | Microcontrollers | 44-TQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 18x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-TQFP (10×10) Package / Case: 44-TQFP | 259 | ||
 | DSPIC33EP256GM304T-I/ML | Microchip Technology | IC MCU 16BIT 256KB FLASH 44QFN | Microcontrollers | 44-QFN (8x8) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Data Converters: A/D 18x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-QFN (8×8) Package / Case: 44-VQFN Exposed Pad | 907 | ||
 | DSPIC33EP256GM304T-I/PT | Microchip Technology | IC MCU 16BIT 256KB FLASH 44TQFP | Microcontrollers | 44-TQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Data Converters: A/D 18x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-TQFP (10×10) Package / Case: 44-TQFP | 852 | ||
 | DSPIC33EP256GM306-E/MR | Microchip Technology | IC MCU 16BIT 256KB FLASH 64VQFN | Microcontrollers | 64-VQFN (9x9) | N/A | -40°C ~ 125°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 30x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 64-VQFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 347 | ||
 | DSPIC33EP256GM306-E/PT | Microchip Technology | IC MCU 16BIT 256KB FLASH 64TQFP | Microcontrollers | 64-TQFP (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 30x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 64-TQFP (10×10) Package / Case: 64-TQFP | 539 | ||
 | DSPIC33EP256GM306-H/MR | Microchip Technology | IC MCU 16BIT 256KB FLASH 64VQFN | Microcontrollers | 64-VQFN (9x9) | N/A | -40°C ~ 150°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Data Converters: A/D 30x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 64-VQFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 285 | ||
 | DSPIC33EP256GM306-H/PT | Microchip Technology | IC MCU 16BIT 256KB FLASH 64TQFP | Microcontrollers | 64-TQFP (10x10) | N/A | -40°C ~ 150°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Data Converters: A/D 30x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 64-TQFP (10×10) Package / Case: 64-TQFP | 189 | ||
 | DSPIC33EP256GM306-I/MR | Microchip Technology | IC MCU 16BIT 256KB FLASH 64VQFN | Microcontrollers | 64-VQFN (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 30x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-VQFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 383 | ||
 | DSPIC33EP256GM306-I/PT | Microchip Technology | IC MCU 16BIT 256KB FLASH 64TQFP | Microcontrollers | 64-TQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 30x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-TQFP (10×10) Package / Case: 64-TQFP | 1,196 | ||
 | DSPIC33EP256GM306T-I/MR | Microchip Technology | IC MCU 16BIT 256KB FLASH 64VQFN | Microcontrollers | 64-VQFN (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Data Converters: A/D 30x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-VQFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 550 | ||
 | DSPIC33EP256GM306T-I/PT | Microchip Technology | IC MCU 16BIT 256KB FLASH 64TQFP | Microcontrollers | 64-TQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Data Converters: A/D 30x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-TQFP (10×10) Package / Case: 64-TQFP | 840 | ||
 | DSPIC33EP256GM310-E/BG | Microchip Technology | IC MCU 16BIT 256KB FLSH 121TFBGA | Microcontrollers | 121-TFBGA (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 121-TFBGA (10×10) Package / Case: 121-TFBGA | 798 | ||
 | DSPIC33EP256GM310-E/PF | Microchip Technology | IC MCU 16BIT 256KB FLASH 100TQFP | Microcontrollers | 100-TQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 100-TQFP (14×14) Package / Case: 100-TQFP | 60 | ||
 | DSPIC33EP256GM310-E/PT | Microchip Technology | IC MCU 16BIT 256KB FLASH 100TQFP | Microcontrollers | 100-TQFP (12x12) | N/A | -40°C ~ 125°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 256KB (85.5K x 24) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 100-TQFP (12×12) Package / Case: 100-TQFP | 1,206 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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