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Microcontrollers
Total Products: 76,658
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | DSPIC33EP512GM306-I/MR | Microchip Technology | IC MCU 16BIT 512KB FLASH 64VQFN | Microcontrollers | 64-VQFN (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 30x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-VQFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 372 | ||
 | DSPIC33EP512GM306-I/PT | Microchip Technology | IC MCU 16BIT 512KB FLASH 64TQFP | Microcontrollers | 64-TQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 30x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-TQFP (10×10) Package / Case: 64-TQFP | 786 | ||
 | DSPIC33EP512GM306T-I/MR | Microchip Technology | IC MCU 16BIT 512KB FLASH 64VQFN | Microcontrollers | 64-VQFN (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Data Converters: A/D 30x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-VQFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 1,145 | ||
 | DSPIC33EP512GM306T-I/PT | Microchip Technology | IC MCU 16BIT 512KB FLASH 64TQFP | Microcontrollers | 64-TQFP (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Data Converters: A/D 30x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-TQFP (10×10) Package / Case: 64-TQFP | 43 | ||
 | DSPIC33EP512GM310-E/BG | Microchip Technology | IC MCU 16BIT 512KB FLSH 121TFBGA | Microcontrollers | 121-TFBGA (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 121-TFBGA (10×10) Package / Case: 121-TFBGA | 631 | ||
 | DSPIC33EP512GM310-E/PF | Microchip Technology | IC MCU 16BIT 512KB FLASH 100TQFP | Microcontrollers | 100-TQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 100-TQFP (14×14) Package / Case: 100-TQFP | 961 | ||
 | DSPIC33EP512GM310-E/PT | Microchip Technology | IC MCU 16BIT 512KB FLASH 100TQFP | Microcontrollers | 100-TQFP (12x12) | N/A | -40°C ~ 125°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 100-TQFP (12×12) Package / Case: 100-TQFP | 523 | ||
 | DSPIC33EP512GM310-H/BG | Microchip Technology | IC MCU 16BIT 512KB FLSH 121TFBGA | Microcontrollers | 121-TFBGA (10x10) | N/A | -40°C ~ 150°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 121-TFBGA (10×10) Package / Case: 121-TFBGA | 1,327 | ||
 | DSPIC33EP512GM310-H/PF | Microchip Technology | IC MCU 16BIT 512KB FLASH 100TQFP | Microcontrollers | 100-TQFP (14x14) | N/A | -40°C ~ 150°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 100-TQFP (14×14) Package / Case: 100-TQFP | 1,081 | ||
 | DSPIC33EP512GM310-H/PT | Microchip Technology | IC MCU 16BIT 512KB FLASH 100TQFP | Microcontrollers | 100-TQFP (12x12) | N/A | -40°C ~ 150°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 100-TQFP (12×12) Package / Case: 100-TQFP | 817 | ||
 | DSPIC33EP512GM310-I/BG | Microchip Technology | IC MCU 16BIT 512KB FLSH 121TFBGA | Microcontrollers | 121-TFBGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 121-TFBGA (10×10) Package / Case: 121-TFBGA | 435 | ||
 | DSPIC33EP512GM310-I/PF | Microchip Technology | IC MCU 16BIT 512KB FLASH 100TQFP | Microcontrollers | 100-TQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TQFP (14×14) Package / Case: 100-TQFP | 450 | ||
 | DSPIC33EP512GM310-I/PT | Microchip Technology | IC MCU 16BIT 512KB FLASH 100TQFP | Microcontrollers | 100-TQFP (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TQFP (12×12) Package / Case: 100-TQFP | 118 | ||
 | DSPIC33EP512GM310T-I/BG | Microchip Technology | IC MCU 16BIT 512KB FLSH 121TFBGA | Microcontrollers | 121-TFBGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 121-TFBGA (10×10) Package / Case: 121-TFBGA | 1,696 | ||
 | DSPIC33EP512GM310T-I/PF | Microchip Technology | IC MCU 16BIT 512KB FLASH 100TQFP | Microcontrollers | 100-TQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TQFP (14×14) Package / Case: 100-TQFP | 408 | ||
 | DSPIC33EP512GM310T-I/PT | Microchip Technology | IC MCU 16BIT 512KB FLASH 100TQFP | Microcontrollers | 100-TQFP (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 70 MIPs Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Data Converters: A/D 49x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TQFP (12×12) Package / Case: 100-TQFP | 1,141 | ||
 | DSPIC33EP512GM604-E/ML | Microchip Technology | IC MCU 16BIT 512KB FLASH 44QFN | Microcontrollers | 44-QFN (8x8) | N/A | -40°C ~ 125°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 18x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 44-QFN (8×8) Package / Case: 44-VQFN Exposed Pad | 607 | ||
 | DSPIC33EP512GM604-E/PT | Microchip Technology | IC MCU 16BIT 512KB FLASH 44TQFP | Microcontrollers | 44-TQFP (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Speed: 60 MIPs Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 18x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 44-TQFP (10×10) Package / Case: 44-TQFP | 50 | ||
 | DSPIC33EP512GM604-H/ML | Microchip Technology | IC MCU 16BIT 512KB FLASH 44QFN | Microcontrollers | 44-QFN (8x8) | N/A | -40°C ~ 150°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Data Converters: A/D 18x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 44-QFN (8×8) Package / Case: 44-VQFN Exposed Pad | 729 | ||
 | DSPIC33EP512GM604-H/PT | Microchip Technology | IC MCU 16BIT 512KB FLASH 44TQFP | Microcontrollers | 44-TQFP (10x10) | N/A | -40°C ~ 150°C (TA) | Core Processor: dsPIC Core Size: 16-Bit Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 512KB (170K x 24) Program Memory Type: FLASH RAM Size: 48K x 8 Data Converters: A/D 18x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Grade: Automotive Qualification: AEC-Q100 Mounting Type: Surface Mount Supplier Device Package: 44-TQFP (10×10) Package / Case: 44-TQFP | 86 |
About Microcontrollers
Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.
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