Microcontrollers

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Total Products: 76,658
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
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F28384DZWTQRF28384DZWTQRTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
216K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
605
F28384DZWTSF28384DZWTSTexas InstrumentsIC MCU 32BIT 1MB FLASH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
216K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
577
F28384SPTPQRF28384SPTPQRTexas InstrumentsIC MCU 32BIT 512KB FLASH 176LQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
289
F28384SPTPSF28384SPTPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; A/D 3x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
442
F28384SZWTSF28384SZWTSTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 96×12/16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,091
F28386DPTPQF28386DPTPQTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
108K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
703
F28386DPTPQRF28386DPTPQRTexas InstrumentsIC MCU 32BIT 1MB FLASH 176LQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
216K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
401
F28386DPTPSF28386DPTPSTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
108K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
563
F28386DZWTQF28386DZWTQTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
108K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
769
F28386DZWTQRF28386DZWTQRTexas InstrumentsIC MCU 32BIT 1MB FLASH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
216K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
456
F28386DZWTSF28386DZWTSTexas InstrumentsIC MCU 32BIT 1MB FLASH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
216K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,653
F28386SPTPQRF28386SPTPQRTexas InstrumentsIC MCU 32BIT 512KB FLASH 176LQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
41
F28386SPTPSF28386SPTPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
238
F28386SZWTSF28386SZWTSTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 96×12/16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
500
F28388DPTPSF28388DPTPSTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
108K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
980
F28388DPTPSRF28388DPTPSRTexas InstrumentsIC MCU 32BIT 1MB FLASH 176LQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
216K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,517
F28388DZWTSF28388DZWTSTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 96×12/16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,016
F28388DZWTSRF28388DZWTSRTexas InstrumentsIC MCU 32BIT 1MB FLASH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
216K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
23
F28388SPTPSF28388SPTPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
865
F28388SPTPSRF28388SPTPSRTexas InstrumentsIC MCU 32BIT 512KB FLASH 176LQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
128

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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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