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Microcontrollers

Suntsu Electronics: Your premier supplier of microcontrollers. Our advanced part search tool streamlines the process of finding the ideal microcontroller for your application. Search by part number, manufacturer, or specifications and discover a comprehensive selection of high-performance microcontrollers designed to power your embedded applications.

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Total Products: 76,658
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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HD6417622F80V
HD6417622F80VRenesasIC MCU 32BIT ROMLESSMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-DSP
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, SCI, USB
Peripherals:
DMA, POR, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.75V ~ 2.05V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Package / Case:
208-LQFP
519
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HD6417705BP100BV
HD6417705BP100BVRenesasIC MCU 32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
105
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (12×12)
Package / Case:
208-TFBGA
1,627
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HD6417705BP100V
HD6417705BP100VRenesasIC MCU 32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
105
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (12×12)
Package / Case:
208-TFBGA
99
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HD6417705F133BV
HD6417705F133BVRenesasIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
105
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,573
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HD6417706BP133V
HD6417706BP133VRenesasRISC MCU, 133.34MHZMicrocontrollersN/AN/AN/A

N/A

961
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HD6417707RF60A
HD6417707RF60ARenesasIC MCU 32-BIT FLASHMicrocontrollers-N/A–
Core Size:
32-Bit
Program Memory Type:
FLASH
Mounting Type:
Surface Mount
955
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HD6417708RF100AV
HD6417708RF100AVRenesasIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, SCI, SmartCard
Peripherals:
POR, WDT
Number of I/O:
8
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
3.15V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
328
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HD6417708SF60
HD6417708SF60RenesasIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
60MHz
Connectivity:
EBI/EMI, SCI, SmartCard
Peripherals:
POR, WDT
Number of I/O:
8
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
311
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HD6417710XVN/AHD6417710XVRenesasIC MCU 32BIT ROMLESS 256HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
7
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HD6417712BPV
HD6417712BPVRenesasIC MCU 32BIT ROMLESS 256LFBGAMicrocontrollers256-LFBGA (17x17)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LFBGA (17×17)
Package / Case:
256-LFBGA
869
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HD6417712XVN/AHD6417712XVRenesasIC MCU 32BIT ROMLESS 256HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
1,231
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N/A
HD6417713BPVRenesasIC MCU 32BIT ROMLESS 256LFBGAMicrocontrollers256-LFBGA (17x17)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LFBGA (17×17)
Package / Case:
256-LFBGA
1,586
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HD6417713XVN/AHD6417713XVRenesasIC MCU 32BIT ROMLESS 256HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
334
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HD6417720BP133CV
HD6417720BP133CVRenesasIC MCU 32BIT ROMLESS 256LFBGAMicrocontrollers256-LFBGA (17x17)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
FIFO, I2C, IrDA, Memory Card, SCI, SD, SIO, SIM, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
117
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LFBGA (17×17)
Package / Case:
256-LFBGA
125
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HD6417727BP100CV
HD6417727BP100CVRenesasIC MCU 32BIT ROMLESS 240LFBGAMicrocontrollers240-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
FIFO, SCI, SIO, SmartCard, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 2.05V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
240-LFBGA (13×13)
Package / Case:
240-LFBGA
355
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HD6417727BP160CV
HD6417727BP160CVRenesasIC MCU 32BIT ROMLESS 240LFBGAMicrocontrollers240-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
FIFO, SCI, SIO, SmartCard, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 2.05V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
240-LFBGA (13×13)
Package / Case:
240-LFBGA
1,198
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HD6417727X100CV
HD6417727X100CVRenesasIC MCU 32BIT ROMLESS 240HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
FIFO, SCI, SIO, SmartCard, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 2.05V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
608
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HD6417727X160CV
HD6417727X160CVRenesasIC MCU 32BIT ROMLESS 240HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
FIFO, SCI, SIO, SmartCard, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 2.05V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
489
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HD6417750BP200M
HD6417750BP200MRenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-20°C ~ 75°C
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
706
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HD6417750BP200MV
HD6417750BP200MVRenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
230
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About Microcontrollers

Microcontroller products are sophisticated digital logic devices that can be programmed by the user. Microcontrollers traditionally include working memory, frequently incorporate mixed-signal peripherals, and are generally used with simpler software paradigms focused on repeating a predefined series of tasks. For applications requiring higher performance or parallel processing, designers may instead use field programmable gate arrays.

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