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Total Products: 5,357
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/A
SAM9X70-V/4PBMicrochip TechnologyARM926 MPU,BGA,EXT TEMPMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
470
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SAM9X70T-I/4PB
SAM9X70T-I/4PBMicrochip TechnologyARM926 MPU,BGA,I TEMP,T&RMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
269
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N/A
SAM9X70T-V/4PBMicrochip TechnologyARM926 MPU,BGA,EXT TEMP,T&RMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
292
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QUOTE
SAM9X72-I/4PB
SAM9X72-I/4PBMicrochip TechnologyARM926 MPU,LVDS,CAN-FD,BGA,I TEMMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
747
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QUOTE
N/A
SAM9X72-V/4PBMicrochip TechnologyARM926 MPU,LVDS,CAN-FD,BGA,EXT TMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
598
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QUOTE
SAM9X72T-I/4PB
SAM9X72T-I/4PBMicrochip TechnologyARM926 MPU,LVDS,CAN-FD,BGA,I TEMMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LVDS
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,247
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QUOTE
N/A
SAM9X72T-V/4PBMicrochip TechnologyARM926 MPU,LVDS,CAN-FD,BGA,EXT TMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,508
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SAM9X75-I/4PB
SAM9X75-I/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,203
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QUOTE
N/A
SAM9X75-V/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,917
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QUOTE
SAM9X75D1G-I/4TB
SAM9X75D1G-I/4TBMicrochip TechnologyARM926 MPU, 1GBIT DDR3L,MIPI,LVDMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
802
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QUOTE
SAM9X75D1GT-I/4TB
SAM9X75D1GT-I/4TBMicrochip TechnologyARM926 MPU,1GBIT DDR3L,MIPI,LVDSMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
580
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QUOTE
SAM9X75D2G-I/4TB
SAM9X75D2G-I/4TBMicrochip TechnologyARM926 MPU,2GBIT DDR3L,MIPI,LVDSMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
727
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QUOTE
SAM9X75D2GT-I/4TB
SAM9X75D2GT-I/4TBMicrochip TechnologyARM926 MPU,2GBIT DDR3L,MIPI,LVDSMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,733
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QUOTE
SAM9X75T-I/4PB
SAM9X75T-I/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,918
GET A
QUOTE
N/A
SAM9X75T-V/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
401
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QUOTE
N/A
SAMA7G54-E/4HBMicrochip TechnologyCORTEX-A7 MPU, BGA, EXT. TEMP (TMicroprocessors343-TFBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
343-TFBGA
Supplier Device Package:
343-TFBGA (14×14)
Additional Interfaces:
EBI, I2C, SPI
166
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QUOTE
SAMA7G54-V/4HB
SAMA7G54-V/4HBMicrochip TechnologyIC MPU SAMA7G5 1GHZ 343TFBGAMicroprocessors343-TFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB 2.0 PHY (3), USB Type-C (2)
Voltage – I/O:
3.3V, 5V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
343-TFBGA
Supplier Device Package:
343-TFBGA (14×14)
Additional Interfaces:
EBI, I2C, SPI
370
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QUOTE
SAMA7G54D1G-I/4UB
SAMA7G54D1G-I/4UBMicrochip TechnologyCORTEX-A7,MPU, 1GBIT DDR3,BGA,INMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Additional Interfaces:
EBI, I2C, SPI
1,670
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QUOTE
SAMA7G54D1GT-I/4UB
SAMA7G54D1GT-I/4UBMicrochip TechnologyCORTEX-A7,MPU, 1GBIT DDR3,BGA,INMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Additional Interfaces:
EBI, I2C, SPI
1,768
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QUOTE
SAMA7G54D2G-I/4UB
SAMA7G54D2G-I/4UBMicrochip TechnologyCORTEX-A7 MPU, 2GBIT DDR3, BGA,IMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Additional Interfaces:
EBI, I2C, SPI
646
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QUOTE

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