SAM9X70T-I/4PB

ARM926 MPU,BGA,I TEMP,T&R
Part Description

ARM926EJ-S Microprocessor IC SAM9X7 1 Core, 32-Bit 800MHz 240-TFBGA (11x11)

Quantity 148 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSAM9X7
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM926EJ-SDevice Package240-TFBGA (11x11)ECCNN/A
Ethernet10/100/1000Mbps (1)GradeIndustrialGraphics AccelerationYes
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case240-LFBGARAM ControllersDDR2, DDR3, DDR3L, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesAES, Boot Security, Cryptography, DES, SHA, TRNGSpeed800MHz
Supplier Device Package240-TFBGA (11×11)USBUSB (3)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of SAM9X70T-I/4PB – ARM926 MPU,BGA,I TEMP,T&R

The SAM9X70T-I/4PB is an ARM926EJ-S microprocessor from Microchip Technology's SAM9X7 series, featuring a single 32‑bit core running at 800 MHz. It is an industrial‑grade embedded MPU designed for applications that require integrated connectivity, security, and graphics acceleration in a compact surface‑mount BGA package.

With on‑chip support for multiple memory interfaces, Gigabit Ethernet, USB ports, and hardware security engines, this device targets embedded systems that need a balanced combination of performance, integration, and temperature range for industrial environments.

Key Features

  • Core & Performance  ARM926EJ-S single 32‑bit core operating at 800 MHz for deterministic embedded processing.
  • Memory Interfaces  Integrated controllers for DDR2, DDR3, DDR3L and SDRAM provide flexible memory subsystem options.
  • Connectivity  One 10/100/1000 Mbps Ethernet interface and three USB interfaces enable wired networking and peripheral connectivity.
  • Security  Hardware security features include AES, DES, SHA, TRNG and boot security to support cryptography and secure boot strategies.
  • Graphics & Multimedia  Graphics acceleration is supported to offload display and UI tasks from the CPU core.
  • Package & Mounting  240‑TFBGA (11×11) supplier package in a surface‑mount form factor; package case listed as 240‑LFBGA.
  • Operating Range  Industrial temperature grade rated from −40 °C to 85 °C for deployment in demanding environments.
  • Additional Interfaces  External bus interfaces such as EBI/EMI provide expansion and external memory/ peripheral connectivity options.

Typical Applications

  • Industrial Control  Used in embedded controllers and automation equipment that require industrial temperature operation and secure connectivity.
  • Networking Appliances  Suitable for devices needing a Gigabit Ethernet interface and on‑chip processing for packet handling or management functions.
  • Human‑Machine Interfaces (HMI)  Graphics acceleration and USB connectivity support display-driven interfaces and peripheral I/O in operator panels.
  • Secure Embedded Systems  Hardware cryptography and boot security enable secure device authentication and protected firmware operation.

Unique Advantages

  • Integrated Networking: One 10/100/1000 Mbps Ethernet interface on‑chip reduces external component count for networked products.
  • Flexible Memory Support: Native controllers for DDR2, DDR3, DDR3L and SDRAM simplify memory selection and future scalability.
  • Hardware Security Options: AES, DES, SHA and TRNG support on‑device cryptography and secure boot capabilities.
  • Industrial Temperature Rating: −40 °C to 85 °C grade enables reliable operation across a wide environmental range.
  • Compact BGA Package: 240‑TFBGA (11×11) surface‑mount package provides a high‑density footprint for space‑constrained designs.
  • Multiple USB Interfaces: Three USB ports enable versatile peripheral and host connectivity without additional controllers.

Why Choose SAM9X70T-I/4PB?

The SAM9X70T-I/4PB combines an 800 MHz ARM926EJ-S core with integrated networking, security, memory controller flexibility, and graphics acceleration in an industrial‑grade package. This balance of on‑chip integration and temperature resilience makes it well suited for embedded designs that require deterministic processing, secure operation, and compact system layouts.

Engineers and procurement teams building industrial control, networking, HMI, or secure embedded products will find the SAM9X70T-I/4PB offers a practical combination of interfaces and security features while supporting common DRAM technologies for design flexibility and future scalability.

Request a quote or submit a request for pricing and lead‑time information to begin integrating the SAM9X70T-I/4PB into your design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up