SAM9X60T-V/DWBVAO
| Part Description |
ARM926EJ-S Microprocessor IC SAM9X 1 Core, 32-Bit 600MHz 228-TFBGA (11x11) |
|---|---|
| Quantity | 590 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | SAM9X6 |
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 7 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM926EJ-S | Device Package | 228-TFBGA (11x11) | Display & Interface Controllers | Keyboard, LCD, Touchscreen | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100Mbps (2) | Grade | Industrial | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 228-TFBGA | RAM Controllers | DDR2, LPDDR, LPSDR, SRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA | ||
| Speed | 600MHz | Supplier Device Package | 228-TFBGA (11×11) | USB | USB 2.0 (5) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of SAM9X60T-V/DWBVAO – ARM926EJ-S 600MHz 32‑Bit Microprocessor, 228‑TFBGA
The SAM9X60T-V/DWBVAO is a single‑core ARM926EJ‑S microprocessor operating at 600 MHz, designed for embedded applications requiring industrial temperature operation and integrated security. It combines a 32‑bit core with a broad set of memory controllers, peripheral interfaces and hardware security features for robust system designs.
Targeted at industrial and embedded system designs, the device offers on‑chip connectivity and display support alongside hardware cryptography and tamper protection to address secure, networked and human‑machine interface applications.
Key Features
- Core — ARM926EJ‑S single core, 32‑bit processor running at 600 MHz for deterministic embedded processing.
- Memory Support — Integrated controllers for DDR2, LPDDR, LPSDR and SRAM to support a range of system memory architectures.
- Display & HMI — Built‑in display interface controllers for keyboard, LCD and touchscreen integration for human‑machine interfaces.
- Connectivity — Two 10/100 Mbps Ethernet ports, five USB 2.0 ports and CAN interface provide extensive I/O for networked and peripheral‑rich systems.
- Security — Hardware features include boot security, cryptography, memory scrambling, Secure JTAG, secure key storage, secure RTC, tamper pins, and TDES/AES/SHA support.
- Graphics Acceleration — On‑chip graphics acceleration to support display and UI tasks.
- Package & Mounting — 228‑TFBGA surface‑mount package (11×11 mm) for compact board designs.
- Industrial Temperature Range — Qualified for operation from −40°C to 105°C for demanding environments.
- Compliance — RoHS compliant.
Typical Applications
- Industrial Embedded Systems — Industrial controllers and automation equipment that require robust operation across a wide temperature range and multiple field interfaces.
- Human‑Machine Interfaces (HMI) — Devices with LCD and touchscreen requirements can leverage the display controllers and graphics acceleration for responsive UIs.
- Secure Networked Devices — Networked embedded products using dual 10/100 Ethernet and multiple USB ports with on‑chip cryptography and boot security for secure communications.
- Communication and Control Nodes — Systems requiring CAN and USB connectivity for device control, monitoring and peripheral integration.
Unique Advantages
- Integrated Security Suite: Comprehensive hardware security (TDES/AES/SHA, secure key storage, Secure JTAG, tamper pins, secure RTC) reduces external component needs for protected designs.
- Broad Memory Flexibility: Support for DDR2, LPDDR, LPSDR and SRAM simplifies system memory choices across performance and cost targets.
- Rich Peripheral Set: Dual Ethernet, five USB 2.0 ports and CAN provide versatile I/O for networked, USB‑attached and fieldbus applications.
- Industrial‑Grade Reliability: −40°C to 105°C operating range and surface‑mount 228‑TFBGA packaging support deployment in harsh environments.
- Compact, Production‑Ready Package: 11×11 mm 228‑TFBGA enables space‑efficient board layouts for compact embedded products.
Why Choose SAM9X60T-V/DWBVAO?
The SAM9X60T‑V/DWBVAO delivers a balanced combination of 600 MHz ARM926EJ‑S performance, extensive memory interface support and a rich set of connectivity options in an industrial‑grade MPU. Its integrated security features and graphics/display capabilities make it suitable for secure, networked embedded systems and human‑machine interfaces that require reliable operation across temperature extremes.
Designed for engineers building secure, connected embedded products, this Microchip Technology MPU reduces system complexity by combining processing, memory controllers, display interfaces, and hardware security into a single package, offering a clear path to compact, production‑oriented designs.
Request a quote or submit a sales inquiry to evaluate SAM9X60T‑V/DWBVAO for your next embedded or industrial project.

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