SAM9X70-I/4PB
| Part Description |
ARM926EJ-S Microprocessor IC SAM9X7 1 Core, 32-Bit 800MHz 240-TFBGA (11x11) |
|---|---|
| Quantity | 93 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | SAM9X7 |
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM926EJ-S | Device Package | 240-TFBGA (11x11) | ECCN | 5A992C | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 10/100/1000Mbps (1) | Grade | Industrial | Graphics Acceleration | Yes | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 85°C (TA) | ||
| Package / Case | 240-LFBGA | RAM Controllers | DDR2, DDR3, DDR3L, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | AES, Boot Security, Cryptography, DES, SHA, TRNG | Speed | 800MHz | ||
| Supplier Device Package | 240-TFBGA (11×11) | USB | USB (3) | Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of SAM9X70-I/4PB – ARM926 MPU,BGA,I TEMP,TRAY
The SAM9X70-I/4PB is a single-core ARM926EJ-S microprocessor IC operating at 800 MHz, designed for embedded and industrial applications. It is part of the SAM9X7 series from Microchip Technology and provides a combination of processing performance, integrated connectivity and hardware security features.
Packaged in a 240-ball TFBGA (11×11) surface-mount package and specified for an industrial temperature range, the device targets designs that require integrated memory support, multi‑interface connectivity and on-chip cryptographic capabilities.
Key Features
- Core and Performance ARM926EJ-S single 32‑bit core running at 800 MHz, suitable for embedded control and compute tasks.
- Memory Controllers Integrated controllers for DDR2, DDR3, DDR3L and SDRAM to support a range of external memory configurations.
- High-Speed Connectivity Built-in 10/100/1000 Mbps Ethernet (1) and multiple USB interfaces (USB (3)) for networking and peripheral connectivity.
- Security Hardware security features including AES, DES, SHA, TRNG and Boot Security plus general cryptography support for secure boot and data protection.
- Graphics Acceleration On-chip graphics acceleration to support graphical user interfaces and display applications.
- System Interfaces External Bus Interface / External Memory Interface (EBI/EMI) for flexible system integration.
- Package & Mounting 240‑TFBGA (11×11) package, surface-mount, with supplier package case listed as 240‑LFBGA.
- Industrial Temperature Rated for operation from −40 °C to 85 °C for use in industrial environments.
- RoHS Compliant Device is RoHS compliant for environmental and regulatory considerations.
Typical Applications
- Industrial Control Use as the main processing MPU in industrial automation and control systems requiring industrial temperature operation and secure boot capability.
- Networking Equipment Embedded routers, gateways or networked controllers leveraging the integrated Gigabit Ethernet interface for wired connectivity.
- Human Machine Interfaces (HMI) Graphics-accelerated user interfaces and display controllers where on-chip graphics and external memory support enable responsive UI performance.
- Secure Embedded Systems Applications that require hardware cryptography and true random number generation for secure communications and data protection.
Unique Advantages
- Integrated Connectivity: On-chip Gigabit Ethernet and multiple USB interfaces reduce the need for external controllers and simplify system design.
- Flexible Memory Support: Native support for DDR2/DDR3/DDR3L and SDRAM allows designers to choose memory types that meet cost and performance targets.
- Hardware Security Suite: AES, DES, SHA, TRNG and boot security features provide a hardware foundation for secure system designs.
- Industrial Temperature Rating: −40 °C to 85 °C specification supports deployment in industrial environments with extended temperature ranges.
- Surface-Mount BGA Package: 240‑TFBGA (11×11) packaging enables compact, PCB-friendly integration for space-constrained designs.
- RoHS Compliant: Meets RoHS requirements to support environmentally compliant product assemblies.
Why Choose SAM9X70-I/4PB?
The SAM9X70-I/4PB combines a mature ARM926EJ-S core at 800 MHz with broad memory interface support, integrated Gigabit Ethernet, multiple USB interfaces and a comprehensive set of hardware security features. Its industrial temperature rating and BGA surface-mount package make it suited for embedded designs that demand reliable operation and compact PCB integration.
As a member of Microchip Technology’s SAM9X7 series, this part provides a focused balance of performance, connectivity and on‑chip security, making it well suited for designers building industrial control, networked embedded systems or secure HMI solutions.
Request a quote or submit a pricing and availability inquiry for SAM9X70-I/4PB to begin evaluating this MPU for your next embedded or industrial design.

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