SAM9X60D6KT-I/4GB

IC MPU SAM9X 600MHZ 196TFBGA
Part Description

ARM926EJ-S Microprocessor IC SAM9X 1 Core, 32-Bit 600MHz 196-TFBGA (11x11)

Quantity 1,566 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSAM9X6
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time4 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM926EJ-SDevice Package196-TFBGA (11x11)Display & Interface ControllersKeyboard, LCD, Touchscreen
ECCNN/AEthernet10/100Mbps (2)GradeIndustrial
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case196-TFBGARAM ControllersSDR, LPDDR, LPSDR, SRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesBoot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Speed600MHzSupplier Device Package196-TFBGA (11×11)USBUSB 2.0 (5)
Voltage – I/O1.8V, 3.3V

Overview of SAM9X60D6KT-I/4GB – IC MPU SAM9X 600MHZ 196TFBGA

The SAM9X60D6KT-I/4GB is an ARM926EJ-S microprocessor IC featuring a single 32-bit core running at 600 MHz, supplied in a 196-TFBGA (11×11) surface-mount package. It is categorized for embedded applications and specified as an industrial-grade device.

Designed for embedded systems that require connectivity and on-chip security, the device integrates multiple interface controllers and a comprehensive security feature set while supporting a range of memory controller options.

Key Features

  • Core  ARM926EJ-S single 32-bit core operating at 600 MHz, delivering deterministic processing for embedded workloads.
  • Memory Support  Integrated support for SDR, LPDDR, LPSDR and SRAM memory controllers to accommodate a variety of memory configurations.
  • Display and HMI Interfaces  On-chip controllers for keyboard, LCD and touchscreen interfaces to support human–machine interface designs.
  • Ethernet  Two 10/100 Mbps Ethernet interfaces for network connectivity.
  • USB  Five USB 2.0 ports for host/device connectivity and peripheral interfacing.
  • Additional Interfaces  CAN interface support for fieldbus and control networks.
  • Security Features  Comprehensive security including boot security, cryptography, memory scrambling, Secure JTAG, secure key storage, secure RTC and tamper pins.
  • Graphics Acceleration  On-chip graphics acceleration to assist with display rendering and UI performance.
  • Package & Mounting  196-TFBGA supplier device package (11×11) with surface-mount mounting for compact board integration.
  • Operating Range  Industrial operating temperature range from −40 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Use in industrial embedded systems that require resilient operation across −40 °C to 85 °C and dual Ethernet connectivity for control-network integration.
  • Human‑Machine Interfaces (HMI)  Drives LCD and touchscreen interfaces with graphics acceleration and keyboard support for responsive operator panels and displays.
  • Networking and Connectivity Appliances  Leverages two 10/100 Ethernet ports and five USB 2.0 ports for local networking, device connectivity and gateway applications.
  • Secure Embedded Systems  Built-in boot security, cryptography and tamper protection for embedded products requiring enhanced security controls.

Unique Advantages

  • Integrated connectivity suite: Dual 10/100 Mbps Ethernet, five USB 2.0 ports and CAN reduce external interface components and simplify board design.
  • Comprehensive security stack: Boot security, cryptography, secure key storage, Secure JTAG, secure RTC and tamper pins provide layered protection for sensitive embedded applications.
  • Flexible memory interfacing: Support for SDR, LPDDR, LPSDR and SRAM controllers enables designers to choose memory technologies that match performance and cost targets.
  • Industrial-ready operation: Specified industrial-grade temperature range (−40 °C to 85 °C) improves suitability for harsh-environment deployments.
  • Compact, surface-mount package: 196-TFBGA (11×11) packaging supports high-density board layouts while maintaining ease of manufacturing.
  • Single-core deterministic performance: 600 MHz ARM926EJ-S core delivers consistent processing capacity for embedded control and user-interface tasks.

Why Choose SAM9X60D6KT-I/4GB?

The SAM9X60D6KT-I/4GB combines a 600 MHz ARM926EJ-S core with extensive connectivity and a broad security feature set in a compact 196-TFBGA package, making it well suited for industrial embedded designs that need dependable performance, secure operation and multiple peripheral interfaces. Its support for a range of memory controllers and industrial temperature rating enables adaptable system designs across varied deployment environments.

Manufactured by Microchip Technology, this device addresses embedded applications that prioritize integration, security and connectivity while keeping board footprint and component count manageable.

Request a quote or submit an inquiry to receive pricing and availability information for the SAM9X60D6KT-I/4GB.

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