SAM9X75D2G-I/4TB

ARM926 MPU,2GBIT DDR3L,MIPI,LVDS
Part Description

ARM926EJ-S Microprocessor IC SAM9X7 1 Core, 32-Bit 800MHz 243-TFBGA (16x16)

Quantity 1,240 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSAM9X7
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM926EJ-SDevice Package243-TFBGA (16x16)Display & Interface ControllersLCD, LVDS, MIPI/DSI
ECCNN/AEthernet10/100/1000Mbps (1)GradeIndustrial
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case243-LFBGARAM ControllersDDR2, DDR3, DDR3L, SDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceUnknownSecurity FeaturesAES, Boot Security, Cryptography, DES, SHA, TRNG
Speed800MHzSupplier Device Package243-TFBGA (16×16)USBUSB (3)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of SAM9X75D2G-I/4TB – ARM926 MPU,2GBIT DDR3L,MIPI,LVDS

The SAM9X75D2G-I/4TB is an industrial-grade ARM926EJ-S microprocessor designed for embedded applications. It integrates a single 32-bit core running at 800 MHz and supports a broad set of memory and display controllers, wired connectivity, and security primitives for robust system designs.

Targeted at embedded and industrial markets, this MPU offers on-chip support for DDR2/DDR3/DDR3L/SDRAM, multiple display interfaces including MIPI/DSI and LVDS, and wired networking options—enabling compact, connectivity-focused designs that require extended operating temperature capability.

Key Features

  • Core ARM926EJ-S single 32-bit core operating at 800 MHz for deterministic embedded processing.
  • Memory Controllers Integrated controllers for DDR2, DDR3, DDR3L and SDRAM to support external memory configurations, including 2Gbit DDR3L usage as indicated in the product name.
  • Display Interfaces On-chip display controllers for LCD, LVDS and MIPI/DSI to support a range of user interface and display panel options.
  • Connectivity Gigabit-capable Ethernet (10/100/1000 Mbps), multiple USB interfaces, and CANbus support provide extensive wired communication options for networking and control applications.
  • Security Hardware security features including AES, DES, SHA, TRNG and Boot Security provide cryptographic building blocks and secure boot capabilities.
  • Package & Mounting Available in a 243-TFBGA (16×16) supplier device package and listed 243-LFBGA package case; surface-mount mounting type for standard PCB assembly.
  • Operating Range & Grade Industrial grade with an operating temperature range of −40 °C to 85 °C and RoHS compliance for regulatory alignment.
  • Graphics No graphics acceleration is provided, suitable for systems that rely on CPU-driven or simple display pipelines.

Typical Applications

  • Industrial Automation Real-time controllers and automation gateways benefiting from industrial temperature rating, CANbus connectivity and robust Ethernet options.
  • Human–Machine Interfaces (HMIs) Embedded displays and control panels leveraging LCD, LVDS or MIPI/DSI interfaces alongside external DDR memory for UI framebuffers and assets.
  • Networking & Communication Devices Routers, gateways and Ethernet-enabled controllers that require wired connectivity, USB peripherals and on-chip security features.
  • Security-Focused Embedded Systems Products requiring cryptographic primitives and secure boot capabilities for authenticated firmware and secure communications.

Unique Advantages

  • Well-rounded Integration: Memory controllers, display interfaces and multiple communication peripherals are integrated on-chip to simplify board design and reduce external components.
  • Industrial Reliability: Industrial temperature range (−40 °C to 85 °C) and surface-mount TFBGA packaging support deployment in demanding environmental conditions.
  • Comprehensive Wired Connectivity: Gigabit Ethernet, USB interfaces and CANbus coverage enable diverse networking and peripheral topologies without adding bridging ICs.
  • Built-in Security Primitives: AES, DES, SHA, TRNG and Boot Security provide on-chip options for implementing encryption, hashing and authenticated boot flows.
  • Clear BOM and Assembly Path: Standard 243-TFBGA supplier package and surface-mount mounting streamline manufacturing and supply chain planning for volume production.

Why Choose SAM9X75D2G-I/4TB?

The SAM9X75D2G-I/4TB combines an ARM926EJ-S 800 MHz core with broad memory support, multiple display interfaces and wired communication peripherals to address embedded and industrial designs that demand integration and security. Its industrial operating range and RoHS compliance make it suitable for deployment in temperature-challenging environments.

Designed for engineers who need deterministic single‑core processing with extensive on-chip controllers and security features, this MPU reduces external component count and supports reliable, connected system designs backed by Microchip Technology.

Request a quote or submit an inquiry to obtain pricing and lead-time information for the SAM9X75D2G-I/4TB.

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