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Total Products: 31,198
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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N/A
SAM9X72T-V/4PBMicrochip TechnologyARM926 MPU,LVDS,CAN-FD,BGA,EXT TMicroprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,317
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SAM9X75-I/4PB
SAM9X75-I/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
834
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N/A
SAM9X75-V/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,745
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SAM9X75D1G-I/4TB
SAM9X75D1G-I/4TBMicrochip TechnologyARM926 MPU, 1GBIT DDR3L,MIPI,LVDMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
621
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SAM9X75D1GT-I/4TB
SAM9X75D1GT-I/4TBMicrochip TechnologyARM926 MPU,1GBIT DDR3L,MIPI,LVDSMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
124
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SAM9X75D2G-I/4TB
SAM9X75D2G-I/4TBMicrochip TechnologyARM926 MPU,2GBIT DDR3L,MIPI,LVDSMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
235
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SAM9X75D2GT-I/4TB
SAM9X75D2GT-I/4TBMicrochip TechnologyARM926 MPU,2GBIT DDR3L,MIPI,LVDSMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,539
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QUOTE
SAM9X75T-I/4PB
SAM9X75T-I/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
1,877
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QUOTE
N/A
SAM9X75T-V/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Additional Interfaces:
CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
69
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QUOTE
N/A
SAMA7G54-E/4HBMicrochip TechnologyCORTEX-A7 MPU, BGA, EXT. TEMP (TMicroprocessors343-TFBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
343-TFBGA
Supplier Device Package:
343-TFBGA (14×14)
Additional Interfaces:
EBI, I2C, SPI
1,706
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QUOTE
SAMA7G54-V/4HB
SAMA7G54-V/4HBMicrochip TechnologyIC MPU SAMA7G5 1GHZ 343TFBGAMicroprocessors343-TFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB 2.0 PHY (3), USB Type-C (2)
Voltage – I/O:
3.3V, 5V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
343-TFBGA
Supplier Device Package:
343-TFBGA (14×14)
Additional Interfaces:
EBI, I2C, SPI
179
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SAMA7G54D1G-I/4UB
SAMA7G54D1G-I/4UBMicrochip TechnologyCORTEX-A7,MPU, 1GBIT DDR3,BGA,INMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Additional Interfaces:
EBI, I2C, SPI
1,348
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QUOTE
SAMA7G54D1GT-I/4UB
SAMA7G54D1GT-I/4UBMicrochip TechnologyCORTEX-A7,MPU, 1GBIT DDR3,BGA,INMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Additional Interfaces:
EBI, I2C, SPI
1,589
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QUOTE
SAMA7G54D2G-I/4UB
SAMA7G54D2G-I/4UBMicrochip TechnologyCORTEX-A7 MPU, 2GBIT DDR3, BGA,IMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Additional Interfaces:
EBI, I2C, SPI
355
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QUOTE
SAMA7G54D2GT-I/4UB
SAMA7G54D2GT-I/4UBMicrochip TechnologyCORTEX-A7 MPU, 2GBIT DDR3, BGA,IMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Additional Interfaces:
EBI, I2C, SPI
126
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QUOTE
N/A
SAMA7G54T-E/4HBMicrochip TechnologyCORTEX-A7 MPU, BGA, EXT. TEMP (TMicroprocessors343-TFBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB Typ-C (2)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
343-TFBGA
Supplier Device Package:
343-TFBGA (14×14)
Additional Interfaces:
EBI, I2C, SPI
404
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QUOTE
N/A
SAMRH71F20C-00-SVMicrochip TechnologyIC MCU 32BIT 128MB FLASH DIEMicrocontrollersWaferN/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART
Peripherals:
DMA, LCD, POR, PWM, WDT
Number of I/O:
194
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
1.125M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
Wafer
Package / Case:
Die
319
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QUOTE
N/A
SAMRH71F20C-7GB-EMicrochip TechnologyIC MCU 32BIT 128MB FLASH 625TBGAMicrocontrollers625-TFBGA (6x8)N/A–
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART
Peripherals:
DMA, LCD, POR, PWM, WDT
Number of I/O:
194
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
1.125M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External, Internal
Mounting Type:
Surface Mount
Supplier Device Package:
625-TFBGA (6×8)
Package / Case:
625-TBGA
768
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QUOTE
N/A
SAMRH71F20C-7GB-MQMicrochip TechnologyIC MCU 32BIT 128MB FLASH 625TBGAMicrocontrollers625-TFBGA (6x8)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART
Peripherals:
DMA, LCD, POR, PWM, WDT
Number of I/O:
194
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
1.125M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
625-TFBGA (6×8)
Package / Case:
625-TBGA
56
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QUOTE
N/A
SAMRH71F20C-7GB-SRMicrochip TechnologyIC MCU 32BIT 128MB FLASH 625TBGAMicrocontrollers625-TFBGA (6x8)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART
Peripherals:
DMA, LCD, POR, PWM, WDT
Number of I/O:
194
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
1.125M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
625-TFBGA (6×8)
Package / Case:
625-TBGA
1,096
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QUOTE

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