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Total Products: 13,051
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/A
FS32R294LAK0MJDRNXP SemiconductorsS32R29 MULTICORE POWER ARCHITECTMicrocontrollers269-LFBGA (14x14)N/AN/A
Mounting Type:
Surface Mount
Supplier Device Package:
269-LFBGA (14×14)
Package / Case:
269-LFBGA
1,277
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N/A
FS32R294LAK0MJDTNXP SemiconductorsS32R29 MULTICORE POWER ARCHITECTMicrocontrollers269-LFBGA (14x14)N/A–
Core Processor:
e200z4, e200z7 (2)
Core Size:
32-Bit 5-Core
Speed:
250MHz, 500MHz, 430MHz
Connectivity:
CAN, Ethernet, FlexRay
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
SRAM
RAM Size:
2.5M x 8
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
269-LFBGA (14×14)
Package / Case:
269-LFBGA
25
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QUOTE
N/A
FS32R294LBK0MJDRNXP SemiconductorsS32R29 MULTICORE POWER ARCHITECTMicrocontrollers269-LFBGA (14x14)N/A–
Core Processor:
e200z4, e200z7 (2)
Core Size:
32-Bit 5-Core
Speed:
250MHz, 500MHz, 430MHz
Connectivity:
CAN, Ethernet, FlexRay
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
SRAM
RAM Size:
2.5M x 8
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
269-LFBGA (14×14)
Package / Case:
269-LFBGA
121
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N/A
FS32R294LBK0MJDTNXP SemiconductorsS32R29 MULTICORE POWER ARCHITECTMicrocontrollers269-LFBGA (14x14)N/A–
Core Processor:
e200z4, e200z7 (2)
Core Size:
32-Bit 5-Core
Speed:
250MHz, 500MHz, 430MHz
Connectivity:
CAN, Ethernet, FlexRay
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
SRAM
RAM Size:
2.5M x 8
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
269-LFBGA (14×14)
Package / Case:
269-LFBGA
787
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N/A
FS32R294LCK0MJDRNXP SemiconductorsIC MCU 32BIT 2MB CRAM 269LFBGAMicrocontrollersN/AN/AN/A

N/A

1,954
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QUOTE
N/A
FS32R294LCK0MJDTNXP SemiconductorsIC MCU 32BIT 2MB CRAM 269LFBGAMicrocontrollersN/AN/AN/A

N/A

619
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QUOTE
N/A
FS32R294LDK0MJDRNXP SemiconductorsIC MCU 32BIT 2MB CRAM 269LFBGAMicrocontrollersN/AN/AN/A

N/A

191
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QUOTE
N/A
FS32R294LDK0MJDTNXP SemiconductorsIC MCU 32BIT 2MB CRAM 269LFBGAMicrocontrollersN/AN/AN/A

N/A

351
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QUOTE
N/A
FS32R372SBK0MMMTNXP SemiconductorsIC MCU 32B 1.3MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7260
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SPI
Peripherals:
POR, PWM, WDT
Program Memory Size:
1.3MB (1.3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
487
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N/A
FS32R372SBK0MMVTNXP SemiconductorsIC MCU 32B 1.3MB FLASH 141MAPBGAMicrocontrollers141-MAPBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7260
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SPI
Peripherals:
POR, PWM, WDT
Program Memory Size:
1.3MB (1.3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
141-MAPBGA (10×10)
Package / Case:
141-LFBGA
941
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QUOTE
N/A
FS32R372SCK0MMMTNXP SemiconductorsIC MCU 32B 1.3MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7260
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SPI
Peripherals:
POR, PWM, WDT
Program Memory Size:
1.3MB (1.3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
768K x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
1,450
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QUOTE
N/A
FS32R372SDK0MMVTNXP SemiconductorsIC MCU 32B 1.3MB FLASH 141MAPBGAMicrocontrollers141-MAPBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7260
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SPI
Peripherals:
POR, PWM, WDT
Program Memory Size:
1.3MB (1.3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
141-MAPBGA (10×10)
Package / Case:
141-LFBGA
1,528
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QUOTE
N/A
FS32R372SEK0MMVTNXP SemiconductorsIC MCU 32B 1.3MB FLASH 141MAPBGAMicrocontrollers141-MAPBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7260
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, I2C, LINbus, SPI
Peripherals:
POR, PWM, WDT
Program Memory Size:
1.3MB (1.3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
141-MAPBGA (10×10)
Package / Case:
141-LFBGA
1,107
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QUOTE
N/A
FS32V232BMN1VUBNXP SemiconductorsIC MPU FS32V23 800MHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-A53, Cortex®-M4
Number of Cores/Bus Width:
4 Core, 64-Bit/1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
GbE
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
1,332
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QUOTE
N/A
FS32V232BMN2VUBNXP SemiconductorsIC MPU FS32V23 800MHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 32/64-Bit
Speed:
800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
1,724
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QUOTE
N/A
FS32V232CKN1VUBNXP SemiconductorsISP CSE 1GHZ DUAL COREMicroprocessorsN/AN/AN/A

N/A

876
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QUOTE
N/A
FS32V232CKN1VUBRNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
855
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QUOTE
N/A
FS32V232CKN2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
1,584
GET A
QUOTE
N/A
FS32V232CKN2VUBRNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
697
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QUOTE
N/A
FS32V232CTN1VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
540
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QUOTE

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