FS32V232BMN1VUB

IC MPU FS32V23 800MHZ 621FCPBGA
Part Description

ARM® Cortex®-A53, Cortex®-M4 Microprocessor IC FS32V23 4 Core, 64-Bit/1 Core, 32-Bit 800MHz 621-FCPBGA (17x17)

Quantity 821 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesFS32V232
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A53, Cortex®-M4Device Package621-FCPBGA (17x17)
Display & Interface ControllersLCD, VideoECCN5A992CEthernetGbE
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit/1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TA)Package / Case621-FBGA, FCBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Speed800MHzSupplier Device Package621-FCPBGA (17×17)Voltage – I/O1.8V

Overview of FS32V232BMN1VUB – IC MPU FS32V23 800MHZ 621FCPBGA

The FS32V232BMN1VUB is an NXP Semiconductors embedded microprocessor IC combining ARM® Cortex®-A53 and Cortex®-M4 cores in a multi-core architecture. Designed for embedded systems, it delivers a balance of application processing and real-time control for video, imaging, and industrial applications.

With an 800 MHz core clock, integrated memory controllers, extensive security features and industrial qualification, this device targets designs that require performance, system integration, and operation across a wide temperature range.

Key Features

  • Cores and Architecture ARM® Cortex®-A53 and Cortex®-M4 processor combination providing 4× 64-bit cores plus a 32-bit real-time core for mixed application and control tasks.
  • Performance 800 MHz core speed to support compute workloads and real-time control functions.
  • Memory Interfaces Integrated DRAM controller supporting LPDDR2, DDR3 and DDR3L memory types for flexible system memory choices.
  • Security On-chip security features including AES, ARM TrustZone, secure boot, Cryptographic Services Engine (CSE), On-Chip One-Time Programmable controller (OCOTP_CTRL) and System JTAG for secured device lifecycle and trusted boot.
  • Multimedia Processing NEON™ MPE multimedia co-processor for SIMD acceleration and DSP-style processing to assist image and video algorithms.
  • Display and Video Display interface controllers for LCD and video enabling integration of display and video pipelines in embedded systems.
  • Connectivity and Interfaces GbE Ethernet support, I2C and additional serial interfaces for networked and peripheral connectivity.
  • System Reliability and Safety Industrial-grade qualification with operating temperature range of -40 °C to 125 °C and memory error detection/correction schemes noted in the series datasheet.
  • Package and Mounting 621-FCPBGA (17 × 17 mm) surface-mount package suitable for compact, high-density board designs.

Typical Applications

  • Industrial Automation Real-time control and application processing in industrial controllers and instrumentation, benefiting from industrial qualification and wide temperature operation.
  • Embedded Vision and Imaging Video and image processing subsystems that leverage the NEON multimedia co-processor and display/video interface controllers.
  • Networking & Communications Networked embedded equipment using GbE and serial interfaces for connectivity and data exchange.
  • High‑Performance Embedded Systems Multi-core application processors where a combination of 64-bit application cores and a 32-bit real-time core simplifies mixed workload designs.

Unique Advantages

  • Dual-class processing: Combines ARM Cortex-A53 application cores with a Cortex-M4 real-time core for consolidated application and control tasks.
  • Integrated memory support: On-chip DRAM controller for LPDDR2/DDR3/DDR3L reduces external memory integration complexity.
  • Comprehensive security set: AES, TrustZone, secure boot, CSE and OCOTP_CTRL provide layered device security for protected boot and runtime.
  • Industrial readiness: Rated for -40 °C to 125 °C and supplied in a compact 621-FCPBGA package suitable for demanding environments.
  • Multimedia acceleration: NEON™ MPE and video/display controllers accelerate imaging and multimedia tasks without adding external accelerators.

Why Choose FS32V232BMN1VUB?

FS32V232BMN1VUB positions itself as a highly integrated embedded MPU that blends application-class processing with deterministic real-time control. Its multi-core ARM® architecture, combined with extensive security features and memory interface flexibility, supports designs that require both compute performance and system-level integration.

Backed by NXP Semiconductors and packaged for industrial environments, this device is well suited for engineers building robust embedded platforms in industrial, imaging and networked applications that demand scalability and operational reliability.

Request a quote or contact sales to check availability, lead times and pricing for FS32V232BMN1VUB.

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