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Total Products: 220,048
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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B10011S-MFPG1N/AB10011S-MFPG1Microchip TechnologyIC TRANSCEIVER 1/1 16SODrivers, Receivers, Transceivers16-SO4.75V ~ 5.25V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Data Rate:
250kbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
695
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B10011S-MFPG1Y
B10011S-MFPG1YMicrochip TechnologyIC TRANSCEIVER 1/1 16SODrivers, Receivers, Transceivers16-SO4.75V ~ 5.25V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Data Rate:
250kbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
70
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B10011S-MFPG1Y74
B10011S-MFPG1Y74Microchip TechnologyIC TRANSCEIVER 1/1 16SODrivers, Receivers, Transceivers16-SO4.75V ~ 5.25V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Data Rate:
250kbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
884
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B10011S-MFPG3
B10011S-MFPG3Microchip TechnologyIC TRANSCEIVER 1/1 16SODrivers, Receivers, Transceivers16-SO4.75V ~ 5.25V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Data Rate:
250kbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
741
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B10011S-MFPG3Y
B10011S-MFPG3YMicrochip TechnologyIC TRANSCEIVER 1/1 16SODrivers, Receivers, Transceivers16-SO4.75V ~ 5.25V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Data Rate:
250kbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
555
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QUOTE
B10011S-MFPG3Y74
B10011S-MFPG3Y74Microchip TechnologyIC TRANSCEIVER 1/1 16SODrivers, Receivers, Transceivers16-SO4.75V ~ 5.25V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Data Rate:
250kbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
1,147
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N/A
B164CILM3VCAZNTInfineon TechnologiesIC MCU 16BIT ROMLESS 80MQFPMicrocontrollersN/AN/A0°C ~ 70°C (TA)
Core Processor:
C166
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SPI, SSC, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
59
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
718
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QUOTE
B3221PM3BDGUI-U
B3221PM3BDGUI-UKingston TechnologyIC DRAM 32GBIT PAR 200FBGADRAM Memory200-FBGA (10x14.5)1.06V ~ 1.17V, 1.7V ~ 1.95V-25°C ~ 85°C (TC)
Access Time:
3.5 ns
Clock Frequency:
1.866 GHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
2G x 16
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
200-WFBGA
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR4
Write Cycle Time Word Page:
18 ns
314
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B3221PM3BDGVIW-U
B3221PM3BDGVIW-UKingston Technology32GB 200 BALL LPDDR4 4266MHDRAM Memory200-FBGA (10x14.5)1.06V ~ 1.17V, 1.7V ~ 1.95V-40°C ~ 95°C (TC)
Access Time:
3.5 ns
Clock Frequency:
2.133 GHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
2G x 16
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
200-WFBGA
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR4
Write Cycle Time Word Page:
18 ns
1,393
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B3221XM3BDGVI-U
B3221XM3BDGVI-UKingston TechnologyIC DRAM 32GBIT PAR 200FBGADRAM Memory200-FBGA (10x14.5)1.06V ~ 1.17V, 1.7V ~ 1.95V-25°C ~ 85°C (TC)
Access Time:
3.5 ns
Clock Frequency:
2.133 GHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
2G x 16
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
200-WFBGA
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR4X
Write Cycle Time Word Page:
18 ns
505
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N/A
B4420NSE7QQMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, SPI, UART
562
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N/A
B4420NSN7QQMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, SPI, UART
910
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N/A
B4420NXE7QQMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, SPI, UART
382
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QUOTE
N/A
B4420NXN7QQMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, SPI, UART
108
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B4860NSE7QUMD
B4860NSE7QUMDNXP SemiconductorsQORIQ QONVERGE SOC, 6X1.2GHZ STAMicroprocessorsN/AN/AN/A

N/A

1,027
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N/A
B4860NSN7QUMDNXP SemiconductorsIC MPU QORIQ 1.8GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.8GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
882
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N/A
B4860NXE7QUMDNXP SemiconductorsIC MPU QORIQ 1.8GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.8GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
348
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B4860NXN7QUMD
B4860NXN7QUMDNXP SemiconductorsB4860 - QORIQ QONVERGE SOC, 6X1.MicroprocessorsN/AN/AN/A

N/A

135
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B505CA4EMCAXP
B505CA4EMCAXPInfineon TechnologiesIC MCU 8BIT 32KB OTP 44MQFPMicrocontrollersPG-MQFP-44-2N/A0°C ~ 70°C (TA)
Core Processor:
C500
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
4.25V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-MQFP-44-2
Package / Case:
44-QFP
956
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BA12003B
BA12003BRohm SemiconductorIC DARLINGTON ARRAY 7/0 16DIPDrivers, Receivers, Transceivers16-DIP--25°C ~ 75°C
Type:
Darlington Array
Number of Drivers/Receivers:
7/0
Operating Temperature:
-25°C ~ 75°C
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-DIP
242
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