B4860NXE7QUMD

IC MPU QORIQ 1.8GHZ 1020FCPBGA
Part Description

PowerPC e6500 Microprocessor IC QorIQ Qonverge B 4 Core, 64-Bit 1.8GHz 1020-FCPBGA (33x33)

Quantity 115 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesB4860
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; SC3900FP FVP – 6 CoreCore ProcessorPowerPC e6500Device Package1020-FCPBGA (33x33)
ECCN5A002A1Ethernet1/2.5Gbps (4), 1/2.5/10Gbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case1020-BBGA, FCBGARAM ControllersDDR3, DDR3LREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesAES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUCSpeed1.8GHz
Supplier Device Package1020-FCPBGA (33×33)USBUSB 2.0 (1)Voltage – I/O1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V

Overview of B4860NXE7QUMD – IC MPU QORIQ 1.8GHz 1020-FCPBGA

The B4860NXE7QUMD is an NXP QorIQ Qonverge B-series multi-core baseband processor SoC built around 64-bit Power Architecture e6500 cores and programmable StarCore DSP cores. With four dual‑threaded e6500 cores running up to 1.8 GHz plus dedicated FVP DSP cores and MAPLE baseband accelerators, the device targets broadband wireless infrastructure and macro base station applications.

Designed for multi‑standard wireless base stations, the device supports LTE (FDD/TDD), LTE‑Advanced (including 3GPP LTE Rel.10/11) and WCDMA while providing integration of processing, baseband acceleration and rich I/O to help reduce system power and design complexity.

Key Features

  • CPU and DSP  Four dual‑threaded PowerPC e6500 64‑bit cores up to 1.8 GHz plus six SC3900FP FVP DSP cores for signal processing and flexible programmability.
  • Baseband Acceleration  MAPLE hardware accelerators for baseband functions such as FEC, FFT and PDSCH/PUSCH processing to offload real‑time Layer‑1 workloads.
  • Memory Subsystem  Integrated 64‑bit DDR3/DDR3L memory controllers with on‑chip caches (L1/L2/L3 reported in series documentation) to support high throughput data paths.
  • Networking and High‑Speed I/O  Multiple Ethernet interfaces (4 × 1/2.5 Gbps and 2 × 1/2.5/10 Gbps), PCIe 16‑lane capability and multi‑Gbps SerDes for robust backhaul and fronthaul connectivity.
  • Peripherals and Management  Integrated interfaces including USB 2.0, I2C and debug/test ports plus DMA, queue and buffer managers for packet and transport handling.
  • Security  On‑chip crypto and security features including AES, DES, 3DES, HMAC, IPsec, Kasumi, MD5, SHA‑1/2, SNOW‑3G and ZUC for secure data and control-plane processing.
  • Package and Mounting  1020‑FCPBGA (33 × 33 mm) FCBGA package, designed for surface mount assembly.
  • Industrial Qualification and Temperature Range  Qualified for industrial applications with an operating temperature range of −40 °C to 105 °C.
  • Compliance  RoHS compliant.
  • Graphics  No graphics acceleration included.

Typical Applications

  • Macrocell Base Stations  Processing and baseband acceleration for multi‑sector LTE and WCDMA macro base stations.
  • LTE and LTE‑Advanced Infrastructure  Support for LTE (FDD/TDD) and LTE‑Advanced (Rel.10/11) layer‑1 and layer‑2 processing in broadband wireless deployments.
  • Broadband Wireless Equipment  Integrated SoC for vendors building high‑throughput wireless infrastructure with on‑chip DSPs and accelerators.

Unique Advantages

  • Multi‑standard Baseband Support: Designed to adapt to LTE, LTE‑Advanced and WCDMA standards, enabling a single platform for multiple radio protocols.
  • Programmable Performance Mix: Combination of high‑frequency e6500 cores and SC3900FP DSP cores provides both control‑plane and signal‑processing programmability.
  • Hardware Baseband Acceleration: MAPLE accelerators offload compute‑intensive Layer‑1 tasks to reduce CPU load and improve latency for real‑time processing.
  • Comprehensive Connectivity: Multiple Ethernet grades, PCIe lanes and high‑speed SerDes simplify integration with fronthaul/backhaul and accelerator subsystems.
  • Industrial Reliability: Industrial qualification and a −40 °C to 105 °C operating range support deployment in demanding wireless infrastructure environments.
  • Integrated Security: Extensive cryptographic support enables secure transport and control‑plane processing without external security coprocessors.

Why Choose B4860NXE7QUMD?

The B4860NXE7QUMD positions itself as an integrated, high‑performance SoC platform for wireless base station and broadband infrastructure designs that require a mix of general‑purpose processing, DSP programmability and dedicated baseband acceleration. Its multi‑core architecture, hardware accelerators and broad I/O complement the needs of base station manufacturers and system designers targeting LTE, LTE‑Advanced and WCDMA deployments.

With industrial qualification, a wide operating temperature range and RoHS compliance, the device supports long‑life infrastructure deployments while consolidating multiple system functions onto a single package to simplify designs and reduce system component count.

Request a quote or submit a pricing inquiry to evaluate B4860NXE7QUMD for your wireless infrastructure design and receive availability and lead‑time information.

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