LPC3154FET208,551
IC MCU 16/32BIT ROMLESS 208TFBGA
| Part Description | ARM9® LPC3100 Microcontroller IC 16/32-Bit 180MHz ROMless 208-TFBGA (12x12) |
|---|
| Product Category | Microcontrollers |
|---|---|
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Leadtime | N/A |
| Datasheet | |
| Quantity | 112 Available |
Specifications
| Part Package | 208-TFBGA |
|---|---|
| Device Package | 208-TFBGA (12×12) |
| Mounting Method | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Core Processor: | ARM9® |
| Core Size: | 16/32-Bit |
| Speed: | 180MHz |
| Connectivity: | EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG |
| Peripherals: | DMA, I2S, LCD, PWM, WDT |
| Number of I/O: | 10 |
| Program Memory Type: | ROMless |
| RAM Size: | 192K x 8 |
| Voltage – Supply (Vcc/Vdd): | 1.1V ~ 3.6V |
| Data Converters: | A/D 3x10b |
| Oscillator Type: | External |
Environmental
| REACH Compliance | REACH Unaffected |
|---|---|
| RoHS Compliance | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) |
| ECCN | 3A991A2 |
| HTS Code | 8542.31.0001 |
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NXP Semiconductors
Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Industry: Semiconductor Manufacturing
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016
