Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
C8051F567-IM
C8051F567-IMSilicon LabsIC MCU 8BIT 16KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
25
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 25x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
861
C8051F567-IMR
C8051F567-IMRSilicon LabsIC MCU 8BIT 16KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
25
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 25x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
188
C8051F567-IQ
C8051F567-IQSilicon LabsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
25
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 25x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
492
C8051F567-IQR
C8051F567-IQRSilicon LabsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
25
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 25x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
408
C8051F568-IM
C8051F568-IMSilicon LabsIC MCU 8BIT 32KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, SMBus (2-Wire/I2C), CANbus, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
246
C8051F568-IMR
C8051F568-IMRSilicon LabsIC MCU 8BIT 32KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, SMBus (2-Wire/I2C), CANbus, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
338
C8051F569-IM
C8051F569-IMSilicon LabsIC MCU 8BIT 32KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
974
C8051F569-IMR
C8051F569-IMRSilicon LabsIC MCU 8BIT 32KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
270
C8051F570-IM
C8051F570-IMSilicon LabsIC MCU 8BIT 32KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, SMBus (2-Wire/I2C), LINbus, SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
1,632
C8051F570-IMR
C8051F570-IMRSilicon LabsIC MCU 8BIT 32KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, SMBus (2-Wire/I2C), LINbus, SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
834
C8051F571-IM
C8051F571-IMSilicon LabsIC MCU 8BIT 32KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
128
C8051F571-IMR
C8051F571-IMRSilicon LabsIC MCU 8BIT 32KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
430
C8051F572-IM
C8051F572-IMSilicon LabsIC MCU 8BIT 16KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, SMBus (2-Wire/I2C), CANbus, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
734
C8051F572-IMR
C8051F572-IMRSilicon LabsIC MCU 8BIT 16KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, SMBus (2-Wire/I2C), CANbus, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
828
C8051F573-IM
C8051F573-IMSilicon LabsIC MCU 8BIT 16KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
789
C8051F573-IMR
C8051F573-IMRSilicon LabsIC MCU 8BIT 16KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
1,137
C8051F574-IM
C8051F574-IMSilicon LabsIC MCU 8BIT 16KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, SMBus (2-Wire/I2C), LINbus, SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
756
C8051F574-IMR
C8051F574-IMRSilicon LabsIC MCU 8BIT 16KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, SMBus (2-Wire/I2C), LINbus, SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
1,863
C8051F575-IM
C8051F575-IMSilicon LabsIC MCU 8BIT 16KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
902
C8051F575-IMR
C8051F575-IMRSilicon LabsIC MCU 8BIT 16KB FLASH 40QFNMicrocontrollers40-QFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
33
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-QFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
670

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