Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
CY8C6336LQI-BLF02
CY8C6336LQI-BLF02Infineon TechnologiesIC MCU 32BIT 512KB FLASH 68QFNMicrocontrollers68-QFN (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
36
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-QFN (8×8)
Package / Case:
68-VFQFN Exposed Pad
635
CY8C6336LQI-BLF42
CY8C6336LQI-BLF42Infineon TechnologiesIC MCU 32BIT 512KB FLASH 68QFNMicrocontrollers68-QFN (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto – AES, DMA, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
36
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-QFN (8×8)
Package / Case:
68-VFQFN Exposed Pad
867
CY8C6337BZI-BLF13
CY8C6337BZI-BLF13Infineon TechnologiesIC MCU 32BIT 1MB FLASH 116BGAMicrocontrollers116-BGA (5.2x6.4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
116-BGA (5.2×6.4)
Package / Case:
116-WFBGA
570
N/A
CY8C6337BZI-BLF13TInfineon TechnologiesIC MCU 32BIT 1MB FLASH 116BGAMicrocontrollers116-BGA (5.2x6.4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
78
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
116-BGA (5.2×6.4)
Package / Case:
116-WFBGA
556
CY8C6347BZI-BLD33
CY8C6347BZI-BLD33Infineon TechnologiesIC MCU 32BIT 1MB FLASH 116BGAMicrocontrollers116-BGA (5.2x6.4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
116-BGA (5.2×6.4)
Package / Case:
116-WFBGA
437
N/A
CY8C6347BZI-BLD33TInfineon TechnologiesIC MCU 32BIT 1MB FLASH 116BGAMicrocontrollers116-BGA (5.2x6.4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
78
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
116-BGA (5.2×6.4)
Package / Case:
116-WFBGA
809
CY8C6347BZI-BLD34
CY8C6347BZI-BLD34Infineon TechnologiesIC MCU 32BIT 1MB FLASH 124VFBGAMicrocontrollers124-VFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
84
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
124-VFBGA (9×9)
Package / Case:
124-VFBGA
640
CY8C6347BZI-BLD43
CY8C6347BZI-BLD43Infineon TechnologiesIC MCU 32BIT 1MB FLASH 116BGAMicrocontrollers116-BGA (5.2x6.4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
116-BGA (5.2×6.4)
Package / Case:
116-WFBGA
1,105
N/A
CY8C6347BZI-BLD43TInfineon TechnologiesIC MCU 32BIT 1MB FLASH 116BGAMicrocontrollers116-BGA (5.2x6.4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto – AES, DMA, I2S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
116-BGA (5.2×6.4)
Package / Case:
116-WFBGA
1,149
CY8C6347BZI-BLD44
CY8C6347BZI-BLD44Infineon TechnologiesIC MCU 32BIT 1MB FLASH 124VFBGAMicrocontrollers124-VFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto – AES, DMA, I2S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
84
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
124-VFBGA (9×9)
Package / Case:
124-VFBGA
78
CY8C6347BZI-BLD53
CY8C6347BZI-BLD53Infineon TechnologiesIC MCU 32BIT 1MB FLASH 116BGAMicrocontrollers116-BGA (5.2x6.4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
116-BGA (5.2×6.4)
Package / Case:
116-WFBGA
460
N/A
CY8C6347BZI-BLD53TInfineon TechnologiesIC MCU 32BIT 1MB FLASH 116BGAMicrocontrollers116-BGA (5.2x6.4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto – AES, DMA, I2S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
Number of I/O:
78
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
116-BGA (5.2×6.4)
Package / Case:
116-WFBGA
770
CY8C6347BZI-BLD54
CY8C6347BZI-BLD54Infineon TechnologiesIC MCU 32BIT 1MB FLASH 124BGAMicrocontrollers124-VFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto – AES, DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2, 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
124-VFBGA (9×9)
Package / Case:
124-VFBGA
869
CY8C6347BZI-BLD54TN/ACY8C6347BZI-BLD54TInfineon TechnologiesIC MCU 32BIT 1MB FLASH 124BGAMicrocontrollers124-VFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, CapSense, Crypto – AES, DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2, 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
124-VFBGA (9×9)
Package / Case:
124-VFBGA
904
CY8C6347FMI-BLD13T
CY8C6347FMI-BLD13TInfineon TechnologiesIC MCU 32BIT 1MB FLASH 104WLCSPMicrocontrollers104-WLCSP (3.8x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
104-WLCSP (3.8×5)
Package / Case:
104-UFBGA, WLCSP
422
CY8C6347FMI-BLD33T
CY8C6347FMI-BLD33TInfineon TechnologiesIC MCU 32BIT 1MB FLASH 104WLCSPMicrocontrollers104-WLCSP (3.8x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
104-WLCSP (3.8×5)
Package / Case:
104-UFBGA, WLCSP
61
CY8C6347FMI-BLD43T
CY8C6347FMI-BLD43TInfineon TechnologiesIC MCU 32BIT 1MB FLASH 104WLCSPMicrocontrollers104-WLCSP (3.8x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
104-WLCSP (3.8×5)
Package / Case:
104-UFBGA, WLCSP
764
CY8C6347FMI-BLD53T
CY8C6347FMI-BLD53TInfineon TechnologiesIC MCU 32BIT 1MB FLASH 104WLCSPMicrocontrollers104-WLCSP (3.8x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
104-WLCSP (3.8×5)
Package / Case:
104-UFBGA, WLCSP
1,220
N/A
CY8C6347FMI-BUD13TInfineon TechnologiesIC MCU 32BIT 1MB FLASH 104WLCSPMicrocontrollers104-WLCSP (3.8x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
69
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
104-WLCSP (3.8×5)
Package / Case:
104-UFBGA, WLCSP
1,379
N/A
CY8C6347FMI-BUD33TInfineon TechnologiesIC MCU 32BIT 1MB FLASH 104WLCSPMicrocontrollers104-WLCSP (3.8x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size:
32-Bit Dual-Core
Speed:
100MHz, 150MHz
Connectivity:
FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O:
69
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
288K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
104-WLCSP (3.8×5)
Package / Case:
104-UFBGA, WLCSP
675

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