 | | CY8C6336LQI-BLF02 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 68QFN | Microcontrollers | 68-QFN (8x8) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, Temp Sensor, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-QFN (8×8) Package / Case: 68-VFQFN Exposed Pad | 635 | |
 | | CY8C6336LQI-BLF42 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 68QFN | Microcontrollers | 68-QFN (8x8) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, CapSense, Crypto – AES, DMA, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 68-QFN (8×8) Package / Case: 68-VFQFN Exposed Pad | 867 | |
 | | CY8C6337BZI-BLF13 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 116BGA | Microcontrollers | 116-BGA (5.2x6.4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 116-BGA (5.2×6.4) | 570 | |
| N/A | | CY8C6337BZI-BLF13T | Infineon Technologies | IC MCU 32BIT 1MB FLASH 116BGA | Microcontrollers | 116-BGA (5.2x6.4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 116-BGA (5.2×6.4) | 556 | |
 | | CY8C6347BZI-BLD33 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 116BGA | Microcontrollers | 116-BGA (5.2x6.4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 116-BGA (5.2×6.4) | 437 | |
| N/A | | CY8C6347BZI-BLD33T | Infineon Technologies | IC MCU 32BIT 1MB FLASH 116BGA | Microcontrollers | 116-BGA (5.2x6.4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 116-BGA (5.2×6.4) | 809 | |
 | | CY8C6347BZI-BLD34 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 124VFBGA | Microcontrollers | 124-VFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 124-VFBGA (9×9) | 640 | |
 | | CY8C6347BZI-BLD43 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 116BGA | Microcontrollers | 116-BGA (5.2x6.4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 116-BGA (5.2×6.4) | 1,105 | |
| N/A | | CY8C6347BZI-BLD43T | Infineon Technologies | IC MCU 32BIT 1MB FLASH 116BGA | Microcontrollers | 116-BGA (5.2x6.4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, CapSense, Crypto – AES, DMA, I2S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 116-BGA (5.2×6.4) | 1,149 | |
 | | CY8C6347BZI-BLD44 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 124VFBGA | Microcontrollers | 124-VFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, CapSense, Crypto – AES, DMA, I2S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 124-VFBGA (9×9) | 78 | |
 | | CY8C6347BZI-BLD53 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 116BGA | Microcontrollers | 116-BGA (5.2x6.4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 116-BGA (5.2×6.4) | 460 | |
| N/A | | CY8C6347BZI-BLD53T | Infineon Technologies | IC MCU 32BIT 1MB FLASH 116BGA | Microcontrollers | 116-BGA (5.2x6.4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, CapSense, Crypto – AES, DMA, I2S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 116-BGA (5.2×6.4) | 770 | |
 | | CY8C6347BZI-BLD54 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 124BGA | Microcontrollers | 124-VFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, CapSense, Crypto – AES, DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2, 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 124-VFBGA (9×9) | 869 | |
 | N/A | CY8C6347BZI-BLD54T | Infineon Technologies | IC MCU 32BIT 1MB FLASH 124BGA | Microcontrollers | 124-VFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, CapSense, Crypto – AES, DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2, 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 124-VFBGA (9×9) | 904 | |
 | | CY8C6347FMI-BLD13T | Infineon Technologies | IC MCU 32BIT 1MB FLASH 104WLCSP | Microcontrollers | 104-WLCSP (3.8x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 104-WLCSP (3.8×5) Package / Case: 104-UFBGA, WLCSP | 422 | |
 | | CY8C6347FMI-BLD33T | Infineon Technologies | IC MCU 32BIT 1MB FLASH 104WLCSP | Microcontrollers | 104-WLCSP (3.8x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 104-WLCSP (3.8×5) Package / Case: 104-UFBGA, WLCSP | 61 | |
 | | CY8C6347FMI-BLD43T | Infineon Technologies | IC MCU 32BIT 1MB FLASH 104WLCSP | Microcontrollers | 104-WLCSP (3.8x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 104-WLCSP (3.8×5) Package / Case: 104-UFBGA, WLCSP | 764 | |
 | | CY8C6347FMI-BLD53T | Infineon Technologies | IC MCU 32BIT 1MB FLASH 104WLCSP | Microcontrollers | 104-WLCSP (3.8x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 104-WLCSP (3.8×5) Package / Case: 104-UFBGA, WLCSP | 1,220 | |
| N/A | | CY8C6347FMI-BUD13T | Infineon Technologies | IC MCU 32BIT 1MB FLASH 104WLCSP | Microcontrollers | 104-WLCSP (3.8x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 104-WLCSP (3.8×5) Package / Case: 104-UFBGA, WLCSP | 1,379 | |
| N/A | | CY8C6347FMI-BUD33T | Infineon Technologies | IC MCU 32BIT 1MB FLASH 104WLCSP | Microcontrollers | 104-WLCSP (3.8x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1×8/12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 104-WLCSP (3.8×5) Package / Case: 104-UFBGA, WLCSP | 675 | |