 | | CY9AF155MBPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 80LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 17x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 1,643 | |
| N/A | N/A | CY9AF155MPMC-G-JNE2 | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 80-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, EBI/EMI, HDMI-CEC, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 17x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (14×14) | 1,097 | |
 | | CY9AF155NABGL-GE1 | Infineon Technologies | IC MCU 32BIT 416KB FLSH 112PFBGA | Microcontrollers | 112-PFBGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 112-PFBGA (10×10) | 966 | |
 | N/A | CY9AF155NABGL-GK9E1 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 112BGA | Microcontrollers | 112-PFBGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 112-PFBGA (10×10) | 1,454 | |
 | | CY9AF155NAPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 478 | |
 | | CY9AF155NBBGL-GK9E1 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 112BGA | Microcontrollers | 112-PFBGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 112-PFBGA (10×10) | 1,166 | |
 | N/A | CY9AF155NBGL-GK9E1 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 112FBGA | Microcontrollers | 112-PFBGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 112-PFBGA (10×10) | 409 | |
 | | CY9AF155NBPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 510 | |
 | | CY9AF155NBPMC-G-JNK1E2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,034 | |
 | | CY9AF155NPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 190 | |
 | | CY9AF155RAPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 120LQFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 416 | |
 | | CY9AF155RBPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 120LQFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 588 | |
 | N/A | CY9AF155RPMC-G-JNE2 | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, EBI/EMI, HDMI-CEC, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 1,068 | |
 | N/A | CY9AF156MABGL-GCGK9E1 | Infineon Technologies | IC MCU 32BIT 544KB FLASH 96FBGA | Microcontrollers | 96-FBGA (6x6) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, EBI/EMI, FIFO, I2C, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 17x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 96-FBGA (6×6) | 226 | |
 | | CY9AF156MABGL-GE1 | Infineon Technologies | IC MCU 32BIT 544KB FLASH 96FBGA | Microcontrollers | 96-FBGA (6x6) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 17x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 96-FBGA (6×6) | 238 | |
 | | CY9AF156MAPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 544KB FLASH 80LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 17x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 717 | |
 | | CY9AF156MBBGL-GE1 | Infineon Technologies | IC MCU 32BIT 544KB FLASH 96FBGA | Microcontrollers | 96-FBGA (6x6) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 17x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 96-FBGA (6×6) | 1,426 | |
 | | CY9AF156MBBGL-GK9E1 | Infineon Technologies | IC MCU 32BIT 544KB FLASH 96FBGA | Microcontrollers | 96-FBGA (6x6) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 17x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 96-FBGA (6×6) | 550 | |
 | | CY9AF156MBPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 544KB FLASH 80LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 17x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 551 | |
| N/A | N/A | CY9AF156MPMC-G-JNE2 | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 80-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, EBI/EMI, HDMI-CEC, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 3.6V Data Converters: A/D 17x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (14×14) | 658 | |