 | | CY9AF312NAPF-G-JNE1 | Infineon Technologies | IC MCU 32BIT 128KB FLASH 100QFP | Microcontrollers | 100-QFP (14x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-QFP (14×20) | 1,889 | |
 | N/A | CY9AF312NAPMC-GNE2 | Infineon Technologies | IC MCU 32BIT 128KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,318 | |
 | N/A | CY9AF314LAPMC-G-MNE2 | Infineon Technologies | IC MM MCU 64LQFP | Microcontrollers | N/A | N/A | N/A | N/A | 640 | |
 | | CY9AF314LAPMC-GNE2 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 9x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (12×12) | 123 | |
 | N/A | CY9AF314LAPMC1-G-MJE1 | Infineon Technologies | IC MCU 32BIT 256KB 64LQFP | Microcontrollers | N/A | N/A | N/A | N/A | 45 | |
 | N/A | CY9AF314LAPMC1-G-MNE2 | Infineon Technologies | IC MM MCU 64LQFP | Microcontrollers | N/A | N/A | N/A | N/A | 1,802 | |
 | N/A | CY9AF314LAPMC1-GE1 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 9x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 715 | |
 | | CY9AF314LAPMC1-GNE2 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 9x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 718 | |
 | | CY9AF314LAQN-G-AVE2 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 64QFN | Microcontrollers | 64-QFN (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 9x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-QFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 675 | |
 | N/A | CY9AF314LPMC-G-MJE1 | Infineon Technologies | IC MCU 32BIT 64LQFP | Microcontrollers | N/A | N/A | N/A | N/A | 1,800 | |
 | N/A | CY9AF314LPMC-GE1 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 9x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (12×12) | 480 | |
 | N/A | CY9AF314LPMC1-G-MJE1 | Infineon Technologies | IC MCU 32BIT 64LQFP | Microcontrollers | N/A | N/A | N/A | N/A | 219 | |
 | N/A | CY9AF314LPMC1-GE1 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 9x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 398 | |
 | | CY9AF314MAPMC-G-MNE2 | Infineon Technologies | IC MM MCU 64LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 459 | |
| N/A | N/A | CY9AF314MAPMC-GNE2 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 80LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 1,187 | |
| N/A | | CY9AF314MPMC-G-MJE1 | Infineon Technologies | IC MM MCU 64LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 1,237 | |
| N/A | N/A | CY9AF314MPMC-GE1 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 80LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 910 | |
 | | CY9AF314NABGL-GE1 | Infineon Technologies | IC MCU 32BIT 256KB FLSH 112PFBGA | Microcontrollers | 112-PFBGA (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 112-PFBGA (10×10) | 1,733 | |
 | N/A | CY9AF314NABGL-GK9E1 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 112BGA | Microcontrollers | 112-PFBGA (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 112-PFBGA (10×10) | 337 | |
 | | CY9AF314NAPF-G-JNE1 | Infineon Technologies | IC MCU 32BIT 256KB FLASH 100QFP | Microcontrollers | 100-QFP (14x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-QFP (14×20) | 346 | |