 | | CY9BF324LPMC1-GNE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 23x12b SAR; D/A 2x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 289 | |
 | | CY9BF324LQN-G-AVE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 64QFN | Microcontrollers | 64-QFN (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 23x12b; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-QFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 1,012 | |
 | | CY9BF324MBGL-GK9E1 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 96FBGA | Microcontrollers | 96-FBGA (6x6) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 26x12b; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 96-FBGA (6×6) | 594 | |
 | | CY9BF324MPMC-G-MNE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 80LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 26x12b; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 178 | |
 | | CY9BF324MPMC-GNE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 80LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 26x12b SAR; D/A 2x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 386 | |
 | | CY9BF324MPMC1-G-JNE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 80LQFP | Microcontrollers | 80-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 26x12b; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (14×14) | 1,342 | |
 | | CY9BF328SAPMC-GK7CGE2 | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 144QFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 441 | |
 | N/A | CY9BF328SPMC-GK7E1 | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 144QFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 292 | |
| N/A | N/A | CY9BF328TBGL-GK7E1 | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 192-FBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 192-FBGA (12×12) | 596 | |
 | | CY9BF329TABGL-GK7E1 | Infineon Technologies | IC MCU 32B 1.5625MB FLSH 192FBGA | Microcontrollers | 192-FBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.5625MB (1.5625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 192-FBGA (12×12) | 549 | |
| N/A | N/A | CY9BF329TBGL-GK7E1 | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 192-FBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.5625MB (1.5625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 192-FBGA (12×12) | 842 | |
 | | CY9BF364KPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 948 | |
 | | CY9BF364KQN-G-AVE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 875 | |
 | | CY9BF364LPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 64LQFP | Microcontrollers | 64-LQFP (12x12) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 15x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (12×12) | 118 | |
 | | CY9BF364LPMC1-G-JNE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 15x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 1,413 | |
 | | CY9BF364LQN-G-AVE2 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 64QFN | Microcontrollers | 64-QFN (9x9) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 15x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-QFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 986 | |
 | | CY9BF365KPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 1,639 | |
 | | CY9BF365KQN-G-AVE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 8x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 851 | |
 | | CY9BF365LPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 64LQFP | Microcontrollers | 64-LQFP (12x12) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 15x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (12×12) | 19 | |
 | | CY9BF365LPMC1-G-JNE2 | Infineon Technologies | IC MCU 32BIT 416KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 416KB (416K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 15x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 1,162 | |