Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
D12320VF25V
D12320VF25VRenesasIC MCU 16BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
1,080
D12320VTE25V
D12320VTE25VRenesasIC MCU 16BIT ROMLESS 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
758
D12321VF25V
D12321VF25VRenesasIC MCU 16BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
86
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
311
D12321VTE20V
D12321VTE20VRenesasIC MCU 16BIT ROMLESS 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
86
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
80
D12322RVF20V
D12322RVF20VRenesasIC MCU 16BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
550
D12322RVF25V
D12322RVF25VRenesasIC MCU 16BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
1,008
D12322RVTE25V
D12322RVTE25VRenesasIC MCU 16BIT ROMLESS 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
919
D12324SVF25V
D12324SVF25VRenesasIC MCU 16BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
1,425
D12324SVTE20V
D12324SVTE20VRenesasIC MCU 16BIT ROMLESS 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
617
D12324SVTE25V
D12324SVTE25VRenesasIC MCU 16BIT ROMLESS 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
86
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
4
D12332VFC20V
D12332VFC20VRenesasIC MCU 16BIT ROMLESS 144QFPMicrocontrollers144-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
106
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-QFP (20×20)
Package / Case:
144-BFQFP
673
D12332VFC25V
D12332VFC25VRenesasIC MCU 16BIT ROMLESS 144QFPMicrocontrollers144-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
106
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-QFP (20×20)
Package / Case:
144-BFQFP
578
D12350F20
D12350F20RenesasIC MCU 16BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
632
D12350F20IV
D12350F20IVRenesasIC MCU 16BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
161
D12350F20V
D12350F20VRenesasIC MCU 16BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
60
D12350TE20IV
D12350TE20IVRenesasMICROCONTROLLER, 16-BIT, 20MHZ,MicrocontrollersN/AN/AN/A

N/A

1,108
N/A
D12352F20VRenesasIC MCU 32BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
382
D12352TE13V
D12352TE13VRenesasIC MCU 16BIT ROMLESS 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
1,592
D12363VF33V
D12363VF33VRenesasIC MCU 16BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
33MHz
Connectivity:
I2C, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
84
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 10x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
1,020
D12363VTE33V
D12363VTE33VRenesasIC MCU 16BIT ROMLESS 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
33MHz
Connectivity:
I2C, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
84
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 10x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
231

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