Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
D12373RVFQ33V
D12373RVFQ33VRenesasIC MCU 16BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
33MHz
Connectivity:
I2C, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 6x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
643
D12373VFQ33V
D12373VFQ33VRenesasIC MCU 16BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
33MHz
Connectivity:
I2C, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 6x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
749
D12390F20IV
D12390F20IVRenesasIC MCU 16BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
505
D12390F20V
D12390F20VRenesasIC MCU 16BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
1,055
D12390TE20V
D12390TE20VRenesasIC MCU 16BIT ROMLESS 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
634
D12392F20IV
D12392F20IVRenesasMICROCONTROLLER, 16-BIT, H8S/200Microcontrollers128-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
41
D12392F20V
D12392F20VRenesasIC MCU 16BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
325
D12394F20V
D12394F20VRenesasIC MCU 16BIT ROMLESS 128QFPMicrocontrollers128-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
87
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-QFP (14×20)
Package / Case:
128-BFQFP
774
D12670VFC33V
D12670VFC33VRenesasIC MCU 16BIT ROMLESS 144QFPMicrocontrollers144-QFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
33MHz
Connectivity:
IrDA, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
115
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-QFP (20×20)
Package / Case:
144-BFQFP
1,377
D12674RVFQ33DV
D12674RVFQ33DVRenesasIC MCU 16BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
33MHz
Connectivity:
IrDA, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
103
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
163
D12674RVFQ33V
D12674RVFQ33VRenesasIC MCU 16BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
33MHz
Connectivity:
IrDA, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
103
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
868
D13002F10V
D13002F10VRenesasMCU H8/300H / H8/3002MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
10MHz
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
947
N/A
D13002F12VRenesasMCU H8/300H / H8/3002MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
12MHz
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
1,094
N/A
D13002F17VRenesasMCU H8/300H / H8/3002MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
17MHz
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
2
D13002FI16FV
D13002FI16FVRenesasMCU H8/300H / H8/3002MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
1,062
D13002FI16V
D13002FI16VRenesasMCU H8/300H / H8/3002MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
72
D13002FP16V
D13002FP16VRenesasMCU H8/300H / H8/3002MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
1,097
N/A
D13002VF10VRenesasMCU H8/300H / H8/3002MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
10MHz
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
1,121
D13002X16V
D13002X16VRenesasIC MCU 16BIT ROMLESS 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
SCI
Peripherals:
DMA, PWM, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
526
D13003RF10V
D13003RF10VRenesasMCU H8/300H / H8/3002MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
10MHz
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
1,053

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