Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
D9LVRA2IDEMT
D9LVRA2IDEMTTexas InstrumentsIC RECEIVER 0/2 8WSONDrivers, Receivers, Transceivers8-WSON (2x2)1.62V ~ 1.98V-40°C ~ 85°C (TA)
Type:
Receiver
Protocol:
LVDS
Number of Drivers/Receivers:
0/2
Receiver Hysteresis:
40 mV
Data Rate:
600Mbps
Voltage – Supply:
1.62V ~ 1.98V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-WFDFN
Supplier Device Package:
8-WSON (2×2)
620
DA82562EM
DA82562EMIntelIC ETH 10/100 PLC DEV CTR 48SSOPControllers48-SSOPN/AN/A
Package / Case:
48-BSSOP (0.295″, 7.50mm Width)
Supplier Device Package:
48-SSOP
170
DE70845RN80FPV
DE70845RN80FPVRenesasIC MCU 32BIT 512KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
76
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
600
DE70855RN80FPV
DE70855RN80FPVRenesasIC MCU 32BIT 512KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
100
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
527
DE70865RN80FPV
DE70865RN80FPVRenesasIC MCU 32BIT 512KB FLSH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
118
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,101
DE71464RN80FPVN/ADE71464RN80FPVRenesasIC MCU 32BIT 256KB FLASH 80LQFPMicrocontrollers80-LQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (14×14)
Package / Case:
80-LQFP
228
DE71494RN80FPVN/ADE71494RN80FPVRenesasIC MCU 32BIT 256KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
63
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
886
N/A
DF2112RVLP25HVRenesasIC MCU 16BIT 64KB FLASH 145TFLGAMicrocontrollers145-TFLGA (9x9)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (9×9)
Package / Case:
145-TFLGA
1,320
DF2112VBG25HVN/ADF2112VBG25HVRenesasIC MCU 16BIT 64KB FLASH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, LPC, PS2, SCI, SCIF, SMBUS
Peripherals:
DMA, PWM, WDT
Number of I/O:
112
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
848
N/AN/ADF2112VT25HVRenesasIC MCU 16BIT 96KB FLASH 144TQFPMicrocontrollers144-TQFP (16x16)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, LPC, PS2, SCI, SCIF, SMBUS
Peripherals:
DMA, PWM, WDT
Number of I/O:
112
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP
741
DF2116VT20MV
DF2116VT20MVRenesasIC MCU 16BIT 128KB FLASH 144TQFPMicrocontrollers144-TQFP (16x16)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, LPC, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP
821
DF2117RVBG20IHV
DF2117RVBG20IHVRenesasIC MCU 16BIT 160KB FLSH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
1,247
DF2117RVBG20V
DF2117RVBG20VRenesasIC MCU 16BIT 160KB FLSH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
1,748
DF2117RVLP20DHV
DF2117RVLP20DHVRenesasIC MCU 16BIT 160KB FLSH 145TFLGAMicrocontrollers145-TFLGA (9x9)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (9×9)
Package / Case:
145-TFLGA
680
DF2117RVPBG20HV
DF2117RVPBG20HVRenesasIC MCU 16BIT 160KB FLSH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
401
DF2117RVPLP20HVN/ADF2117RVPLP20HVRenesasIC MCU 16BIT 160KB FLSH 145TFLGAMicrocontrollers145-TFLGA (9x9)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (9×9)
Package / Case:
145-TFLGA
629
DF2117RVPT20HV
DF2117RVPT20HVRenesasIC MCU 16BIT 160KB FLASH 144TQFPMicrocontrollers144-TQFP (16x16)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP
1,113
DF2117RVT20HV
DF2117RVT20HVRenesasIC MCU 16BIT 160KB FLASH 144TQFPMicrocontrollers144-TQFP (16x16)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP
544
DF2117RVT20V
DF2117RVT20VRenesasIC MCU 16BIT 160KB FLASH 144TQFPMicrocontrollers144-TQFP (16x16)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP
1,495
DF2117VBG20IHV
DF2117VBG20IHVRenesasIC MCU 16BIT 160KB FLSH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
569

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