 | | D6417709SBP167BV | Renesas | IC MCU 32BIT ROMLESS 240LFBGA | Microcontrollers | 240-LFBGA (13x13) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.75V ~ 2.05V Data Converters: A/D 8x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-LFBGA (13×13) | 408 | |
 | | D6417709SF100B | Renesas | IC MCU 32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.55V ~ 1.95V Data Converters: A/D 8x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 970 | |
 | | D6417709SF100BV | Renesas | IC MCU 32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.55V ~ 1.95V Data Converters: A/D 8x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 472 | |
 | | D6417709SF133BV | Renesas | IC MCU 32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 2.05V Data Converters: A/D 8x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 1,362 | |
 | | D6417709SHF200BV | Renesas | IC MCU 32BIT ROMLESS 208HQFP | Microcontrollers | 208-HQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.85V ~ 2.15V Data Converters: A/D 8x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-HQFP (28×28) Package / Case: 208-BFQFP Exposed Pad | 131 | |
| N/A | | D6417709SHX200BV | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.85V ~ 2.15V Data Converters: A/D 8x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) | 653 | |
 | | D6417729RF133BV | Renesas | IC MCU 32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: A/D 8x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 1,101 | |
| N/A | N/A | D6417729RHX200BV | Renesas | IC MCU 32BIT ROMLESS 208QFP | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.85V ~ 2.15V Data Converters: A/D 8x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) | 1,141 | |
 | | D6417750RBA240HVU0 | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 1,071 | |
| N/A | | D6417750SVBT133V | Renesas | MPU, 32-BIT SH-4 RISC CPU | Microprocessors | N/A | N/A | 0 °C – 70 °C | Number of Cores/Bus Width: 1 Core, 32-Bit | 343 | |
 | | D6417751RBA240HVU0 | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 952 | |
 | | D6417751RBP200DV | Renesas | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Peripherals: DMA, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (27×27) | 58 | |
| N/A | | D6417751RF200DDV | Renesas | MCU 32-BIT SUPERH RISC ROMLESS | Microcontrollers | N/A | N/A | N/A | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, FIFO, SCI, SmartCard Program Memory Type: ROMless | 504 | |
 | | D6417760BL200ADV | Renesas | IC MCU 32BIT ROMLESS 256LFBGA | Microcontrollers | 256-LFBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: Audio Codec, CANbus, EBI/EMI, FIFO, I2C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB Peripherals: DMA, LCD, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Data Converters: A/D 4x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (17×17) | 605 | |
| N/A | | D6417760BL200ADVTR | Renesas | IC MCU 32BIT ROMLESS 256LFBGA | Microcontrollers | 256-LFBGA (17x17) | N/A | -20°C ~ 75°C (TA) | Connectivity: Audio Codec, CANbus, EBI/EMI, FIFO, I2C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB Peripherals: DMA, LCD, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 4x10b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LFBGA (17×17) | 500 | |
 | | D64F3337YFLH16V | Renesas | IC MCU 8BIT 60KB FLASH 80QFP | Microcontrollers | 80-QFP (14x14) | N/A | -20°C ~ 75°C (TA) | Connectivity: Host Interface, I2C, SCI Peripherals: POR, PWM, WDT Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-QFP (14×14) | 1,132 | |
 | | D64F3437TFLH16V | Renesas | IC MCU 8BIT 60KB FLASH 100TQFP | Microcontrollers | 100-TQFP (14x14) | N/A | -20°C ~ 75°C (TA) | Connectivity: Host Interface, I2C, SCI Peripherals: POR, PWM, WDT Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b; D/A 2x8b Operating Temperature: -20°C ~ 75°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TQFP (14×14) | 721 | |
| N/A | | D72246FA20V | Renesas | IC MCU | Microcontrollers | N/A | N/A | N/A | N/A | 745 | |
| N/A | | D72246TE20IV | Renesas | D72246 - 16-BIT H8S MCU | Microcontrollers | N/A | N/A | N/A | N/A | 725 | |
 | | D73032F18V | Renesas | MCU H8/300H / H8/3032 | Microcontrollers | N/A | N/A | -20°C ~ 75°C (TA) | Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Operating Temperature: -20°C ~ 75°C (TA) | 860 | |