Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DF2648RFC20JV
DF2648RFC20JVRenesasIC MCU 16BIT 128KB FLASH 144QFPMicrocontrollers144-QFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
CANbus, SCI, SmartCard
Peripherals:
LCD, Motor control PWM, POR, PWM, WDT
Number of I/O:
92
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-QFP (20×20)
Package / Case:
144-BFQFP
934
DF2667VFQ33V
DF2667VFQ33VRenesasIC MCU 16BIT 384KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
33MHz
Connectivity:
IrDA, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
115
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
223
DF2676VFC33V
DF2676VFC33VRenesasIC MCU 16BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
33MHz
Connectivity:
IrDA, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
103
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x10b; D/A 4x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
549
DF3022F18V
DF3022F18VRenesas16-BIT, H8/300H CPUMicrocontrollersN/AN/AN/A

N/A

288
DF3024F25V
DF3024F25VRenesasIC MCU 16BIT 128KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
PWM, WDT
Number of I/O:
70
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
843
DF3024FBL25V
DF3024FBL25VRenesasIC MCU 16BIT 128KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
PWM, WDT
Number of I/O:
70
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
874
DF3024X25V
DF3024X25VRenesasMICROCONTROLLER, 16-BIT, H8/300HMicrocontrollersN/AN/AN/A

N/A

1,044
DF3026F25VN/ADF3026F25VRenesasIC MCU 16BIT 256KB FLASHMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
PWM, WDT
Number of I/O:
70
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
989
DF3026X25V
DF3026X25VRenesasMICROCONTROLLER, 16-BIT, FLASH,MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
PWM, WDT
Number of I/O:
70
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-TQFP
756
DF3028F25V
DF3028F25VRenesasIC MCU 16BIT 384KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
70
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
405
DF3028X25V
DF3028X25VRenesasIC MCU 16BIT 384KB FLASH 100TQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
70
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-TQFP
482
DF3029F25V
DF3029F25VRenesasIC MCU 16BIT 512KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
1,054
DF3029F25WV
DF3029F25WVRenesasIC MCU 16BIT 512KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
412
DF3039F18V
DF3039F18VRenesasIC MCU 16BIT 128KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
18MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
55
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
831
DF3048BF25V
DF3048BF25VRenesasIC MCU 16BIT 128KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
70
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
970
DF3048BF25WVN/ADF3048BF25WVRenesasIC MCU 16BIT 128KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
70
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
751
DF3048BVF25VN/ADF3048BVF25VRenesasIC MCU 16BIT 128KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
70
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
335
DF3048BVX25VN/ADF3048BVX25VRenesasIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
70
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-TQFP
1,863
DF3048BVX25WVN/ADF3048BVX25WVRenesasIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
70
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-TQFP
249
DF3048BX25VN/ADF3048BX25VRenesasIC MCU 16BIT 128KB FLASH 100TQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
70
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-TQFP
125

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