Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,054
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DF2117RVPT20HVDF2117RVPT20HVRenesasIC MCU 16BIT 160KB FLASH 144TQFPMicrocontrollers144-TQFP (16x16)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP
625
DF2117RVT20HVDF2117RVT20HVRenesasIC MCU 16BIT 160KB FLASH 144TQFPMicrocontrollers144-TQFP (16x16)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP
151
DF2117RVT20VDF2117RVT20VRenesasIC MCU 16BIT 160KB FLASH 144TQFPMicrocontrollers144-TQFP (16x16)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP
245
DF2117VBG20IHVDF2117VBG20IHVRenesasIC MCU 16BIT 160KB FLSH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
877
DF2117VBG20VDF2117VBG20VRenesasIC MCU 16BIT 160KB FLSH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
995
DF2117VLP20HVDF2117VLP20HVRenesasIC MCU 16BIT 160KB FLSH 145TFLGAMicrocontrollers145-TFLGA (9x9)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (9×9)
Package / Case:
145-TFLGA
1,009
DF2117VLP20VDF2117VLP20VRenesasIC MCU 16BIT 160KB FLSH 145TFLGAMicrocontrollers145-TFLGA (9x9)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
145-TFLGA (9×9)
Package / Case:
145-TFLGA
252
DF2117VT20HVDF2117VT20HVRenesasIC MCU 16BIT 160KB FLASH 144TQFPMicrocontrollers144-TQFP (16x16)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP
674
DF2117VT20VDF2117VT20VRenesasIC MCU 16BIT 160KB FLASH 144TQFPMicrocontrollers144-TQFP (16x16)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2600
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
FIFO, I2C, LPC, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-TQFP (16×16)
Package / Case:
144-TQFP
696
DF2128FA16LGDF2128FA16LGRenesasIC MCU 16BIT 128KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
1,027
DF2128FA20DF2128FA20RenesasIC MCU 16BIT 128KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
1,323
DF2128FA20VDF2128FA20VRenesasIC MCU 16BIT 128KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
1,355
DF2132FA20DF2132FA20RenesasIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
IrDA, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
57
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
740
DF2132RFA20JDF2132RFA20JRenesasIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
IrDA, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
57
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
168
DF2132RFA20VDF2132RFA20VRenesasIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
IrDA, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
57
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
1,731
DF2132RTF20VDF2132RTF20VRenesasIC MCU 16BIT 64KB FLASH 80TQFPMicrocontrollers80-TQFP (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
IrDA, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
57
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP (12×12)
Package / Case:
80-TQFP
630
DF2132RVTF10VDF2132RVTF10VRenesasIC MCU 16BIT 64KB FLASH 80TQFPMicrocontrollers80-TQFP (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
10MHz
Connectivity:
IrDA, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
57
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP (12×12)
Package / Case:
80-TQFP
1,216
DF2134AFA20DF2134AFA20RenesasIC MCU 16BIT 128KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
IrDA, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
58
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
505
DF2134AFA20JGDF2134AFA20JGRenesasIC MCU 16BIT 128KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
IrDA, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
58
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
95
DF2134AFA20LGDF2134AFA20LGRenesasIC MCU 16BIT 128KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
IrDA, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
58
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
985

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