Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DF61654N50FTV
DF61654N50FTVRenesasIC MCU 32BIT 512KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
75
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
1,193
DF61654W50FTV
DF61654W50FTVRenesasIC MCU 32BIT 512KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
75
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
1,717
DF61656CN35FTV
DF61656CN35FTVRenesasIC MCU 32BIT 512KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
35MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
82
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
1,190
DF61657BN35FTVN/ADF61657BN35FTVRenesasIC MCU 32BIT 768KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
35MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
82
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
795
DF61657CN35FTV
DF61657CN35FTVRenesasIC MCU 32BIT 768KB FLASH 120TQFPMicrocontrollers120-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
35MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
82
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-TQFP (14×14)
Package / Case:
120-TQFP
725
DF61663N50FPV
DF61663N50FPVRenesasIC MCU 32BIT 384KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
92
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
759
DF61663N50FPV-50N/ADF61663N50FPV-50RenesasIC MCU 32BIT 384KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
92
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
22
DF61663W50FPV
DF61663W50FPVRenesasIC MCU 32BIT 384KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
92
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
419
DF61664N50FPV
DF61664N50FPVRenesasIC MCU 32BIT 512KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
92
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
763
DF61664W50FPV
DF61664W50FPVRenesasIC MCU 32BIT 512KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, IrDA, SCI, SmartCard, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
92
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
269
DF7047FRK40HVN/ADF7047FRK40HVRenesasIC MCU 32BIT 256KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
539
N/AN/ADF7055SBP40KNVRenesasSH7055SF MCU BGA272Microcontrollers272-BGA (21x21)N/A-40°C ~ 125°C (TA)
Core Processor:
SH-2E
Core Size:
32-Bit
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
149
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
680
DF7055SBP40LNVN/ADF7055SBP40LNVRenesasIC MCU 32BIT 512KB FLASH 256QFPMicrocontrollers256-QFP (40x28)N/A-40°C ~ 125°C (TA)
Core Processor:
SH-2E
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
149
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-QFP (40×28)
Package / Case:
256-BFQFP
1,157
N/A
DF7055SF40KNRenesasMCU 32BIT 512KB FLASHMicroprocessorsN/AN/AN/A

N/A

987
DF7055SF40KNV
DF7055SF40KNVRenesasIC MCU 32BIT 512KB FLASH 256QFPMicrocontrollers256-QFP (40x28)N/A-40°C ~ 125°C (TA)
Core Processor:
SH-2E
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
149
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-QFP (40×28)
Package / Case:
256-BFQFP
538
N/A
DF7058BF80KNRenesasMCU 32BIT 512KB FLASHMicroprocessorsN/AN/AN/A

N/A

3
N/A
DF7058BF80LNRenesasMCU 32BIT 512KB FLASHMicroprocessorsN/AN/AN/A

N/A

735
N/A
DF7058BP80KNVRenesasMCU 32BIT 512KB FLASHMicroprocessorsN/AN/AN/A

N/A

1,075
N/A
DF7058SBPAKRenesasMCU SUPERH RISC / SH7058MicrocontrollersN/AN/AN/A

N/A

637
N/AN/ADF7058SBPAKVRenesasMCU 3V 512K PB-FREE K-TEMP BP-27Microcontrollers272-BGA (21x21)N/A-40°C ~ 125°C (TA)
Core Processor:
SH-2E
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
149
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
716

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