Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/A
DF7058SCBPAKVRenesasMCU BGAMicrocontrollersN/AN/AN/A

N/A

764
DF70834AD80BGV
DF70834AD80BGVRenesasIC MCU 32BIT 256KB FLSH 112LFBGAMicrocontrollers112-LFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LFBGA (10×10)
Package / Case:
112-LFBGA
1,042
DF70834AD80FTV
DF70834AD80FTVRenesasIC MCU 32BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
581
DF70834AN80FTV
DF70834AN80FTVRenesasIC MCU 32BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
580
DF70835AD80BGV
DF70835AD80BGVRenesasIC MCU 32BIT 512KB FLSH 112LFBGAMicrocontrollers112-LFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LFBGA (10×10)
Package / Case:
112-LFBGA
461
DF70835AD80FTV
DF70835AD80FTVRenesasIC MCU 32BIT 512KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
676
DF70835AN80BGV
DF70835AN80BGVRenesasIC MCU 32BIT 512KB FLSH 112LFBGAMicrocontrollers112-LFBGA (10x10)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LFBGA (10×10)
Package / Case:
112-LFBGA
132
DF70835AN80FTV
DF70835AN80FTVRenesasIC MCU 32BIT 512KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
1,271
DF70844AD80FPV
DF70844AD80FPVRenesasIC MCU 32BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
76
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,925
N/AN/ADF70844AD80FPV#GZRenesasMCU 5/3V 256K I-TEMP PB-FREE FP-Microcontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
76
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,191
DF70844AN80FPV
DF70844AN80FPVRenesasIC MCU 32BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
76
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,398
N/AN/ADF70844AN80FPV#GZRenesasMCU 5/3V 256K PB-FREE FP-112EVMicrocontrollers112-LQFP (20x20)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
76
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,719
DF70845AD80FPV
DF70845AD80FPVRenesasIC MCU 32BIT 512KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
76
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
509
DF70845AN80FPV
DF70845AN80FPVRenesasIC MCU 32BIT 512KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
76
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
131
DF70854AD80FPV
DF70854AD80FPVRenesasIC MCU 32BIT 256KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
100
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
966
DF70854AN80FPV
DF70854AN80FPVRenesasIC MCU 32BIT 256KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
100
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
724
DF70855AD80FPV
DF70855AD80FPVRenesasIC MCU 32BIT 512KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
100
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,557
DF70855AN80FPV
DF70855AN80FPVRenesasIC MCU 32BIT 512KB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
100
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
966
DF70865AD80FPV
DF70865AD80FPVRenesasIC MCU 32BIT 512KB FLSH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
118
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
247
DF70865AN80FPV
DF70865AN80FPVRenesasIC MCU 32BIT 512KB FLSH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
118
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
350

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up