Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DS485MX/NOPB
DS485MX/NOPBTexas InstrumentsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Data Rate:
2.5Mbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
602
DS485N
DS485NTexas InstrumentsIC TRANSCEIVER HALF 1/1 8DIPDrivers, Receivers, Transceivers8-PDIP4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Data Rate:
2.5Mbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Through Hole
Package / Case:
8-DIP (0.300″”, 7.62mm)
Supplier Device Package:
8-PDIP
507
DS485N/NOPB
DS485N/NOPBTexas InstrumentsIC TRANSCEIVER HALF 1/1 8DIPDrivers, Receivers, Transceivers8-PDIP4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Data Rate:
2.5Mbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Through Hole
Package / Case:
8-DIP (0.300″”, 7.62mm)
Supplier Device Package:
8-PDIP
605
DS485TM
DS485TMTexas InstrumentsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Data Rate:
2.5Mbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
945
DS485TM/NOPB
DS485TM/NOPBTexas InstrumentsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Data Rate:
2.5Mbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
367
DS485TMX
DS485TMXTexas InstrumentsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Data Rate:
2.5Mbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
964
DS485TMX/NOPB
DS485TMX/NOPBTexas InstrumentsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Data Rate:
2.5Mbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
1,343
DS485TN/NOPB
DS485TN/NOPBTexas InstrumentsIC TRANSCEIVER HALF 1/1 8MDIPDrivers, Receivers, Transceivers8-MDIP4.75V ~ 5.25V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Data Rate:
2.5Mbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Through Hole
Package / Case:
8-DIP (0.300″”, 7.62mm)
Supplier Device Package:
8-MDIP
152
DS5000-32-16
DS5000-32-16Analog Devices Inc.IC MCU 8BIT 32KB NVSRAM 40EDIPMicrocontrollers40-EDIPN/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
SIO, UART/USART
Peripherals:
Power-Fail Reset, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
NVSRAM
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-EDIP
Package / Case:
40-DIP Module (0.610″”, 15.495mm)
1,874
DS5000-32-16+
DS5000-32-16+Analog Devices Inc.IC MCU 8BIT 32KB NVSRAM 40EDIPMicrocontrollers40-EDIPN/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
SIO, UART/USART
Peripherals:
Power-Fail Reset, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
NVSRAM
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-EDIP
Package / Case:
40-DIP Module (0.610″”, 15.495mm)
572
DS5000-8-16
DS5000-8-16Analog Devices Inc.IC MCU 8BIT 8KB NVSRAM 40EDIPMicrocontrollers40-EDIPN/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
SIO, UART/USART
Peripherals:
Power-Fail Reset, WDT
Number of I/O:
32
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
NVSRAM
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-EDIP
Package / Case:
40-DIP Module (0.610″”, 15.495mm)
539
DS5000-8-8
DS5000-8-8Analog Devices Inc.IC MCU 8BIT 8KB NVSRAM 40EDIPMicrocontrollers40-EDIPN/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SIO, UART/USART
Peripherals:
Power-Fail Reset, WDT
Number of I/O:
32
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
NVSRAM
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-EDIP
Package / Case:
40-DIP Module (0.610″”, 15.495mm)
908
DS5000FP-16
DS5000FP-16Analog Devices Inc.IC MCU 8BIT EXTRNL NVSRAM 80QFPMicrocontrollers80-MQFP (14x20)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SIO, UART/USART
Peripherals:
Power-Fail Reset, WDT
Number of I/O:
32
Program Memory Size:
External
Program Memory Type:
NVSRAM
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-MQFP (14×20)
Package / Case:
80-BQFP
1,964
DS5000FP-16+
DS5000FP-16+Analog Devices Inc.IC MCU 8BIT EXTRNL NVSRAM 80QFPMicrocontrollers80-MQFP (14x20)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SIO, UART/USART
Peripherals:
Power-Fail Reset, WDT
Number of I/O:
32
Program Memory Size:
External
Program Memory Type:
NVSRAM
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-MQFP (14×20)
Package / Case:
80-BQFP
440
DS5000T-32-16
DS5000T-32-16Analog Devices Inc.IC MCU 8BIT 32KB NVSRAM 40EDIPMicrocontrollers40-EDIPN/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
SIO, UART/USART
Peripherals:
Power-Fail Reset, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
NVSRAM
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-EDIP
Package / Case:
40-DIP Module (0.610″”, 15.495mm)
461
DS5000T-32-16+
DS5000T-32-16+Analog Devices Inc.IC MCU 8BIT 32KB NVSRAM 40EDIPMicrocontrollers40-EDIPN/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
SIO, UART/USART
Peripherals:
Power-Fail Reset, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
NVSRAM
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-EDIP
Package / Case:
40-DIP Module (0.610″”, 15.495mm)
1,299
DS5001FP-16
DS5001FP-16Analog Devices Inc.IC MCU 8BIT EXTRNL NVSRAM 80QFPMicrocontrollers80-MQFP (14x20)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SIO, UART/USART
Peripherals:
Power-Fail Reset, WDT
Number of I/O:
32
Program Memory Size:
External
Program Memory Type:
NVSRAM
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-MQFP (14×20)
Package / Case:
80-BQFP
494
DS5001FP-16+
DS5001FP-16+Analog Devices Inc.IC MCU 8BIT EXTRNL NVSRAM 80QFPMicrocontrollers80-MQFP (14x20)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SIO, UART/USART
Peripherals:
Power-Fail Reset, WDT
Number of I/O:
32
Program Memory Size:
External
Program Memory Type:
NVSRAM
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-MQFP (14×20)
Package / Case:
80-BQFP
1,190
DS5001FP-16N
DS5001FP-16NAnalog Devices Inc.IC MCU 8BIT EXTRNL NVSRAM 80QFPMicrocontrollers80-MQFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SIO, UART/USART
Peripherals:
Power-Fail Reset, WDT
Number of I/O:
32
Program Memory Size:
External
Program Memory Type:
NVSRAM
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-MQFP (14×20)
Package / Case:
80-BQFP
963
DS5001FP-16N+
DS5001FP-16N+Analog Devices Inc.IC MCU 8BIT EXTRNL NVSRAM 80QFPMicrocontrollers80-MQFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SIO, UART/USART
Peripherals:
Power-Fail Reset, WDT
Number of I/O:
32
Program Memory Size:
External
Program Memory Type:
NVSRAM
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-MQFP (14×20)
Package / Case:
80-BQFP
327

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