Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DS75452M
DS75452MTexas InstrumentsIC DRIVER 2/0 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V0°C ~ 70°C
Type:
Driver
Number of Drivers/Receivers:
2/0
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
308
DS75452MX
DS75452MXTexas InstrumentsIC DRIVER 2/0 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V0°C ~ 70°C
Type:
Driver
Number of Drivers/Receivers:
2/0
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
1,166
DS75452N
DS75452NTexas InstrumentsIC DRIVER 2/0 8MDIPDrivers, Receivers, Transceivers8-MDIP4.75V ~ 5.25V0°C ~ 70°C
Type:
Driver
Number of Drivers/Receivers:
2/0
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Through Hole
Package / Case:
8-DIP (0.300″”, 7.62mm)
Supplier Device Package:
8-MDIP
865
DS75453M
DS75453MTexas InstrumentsIC DRIVER 2/0 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V0°C ~ 70°C
Type:
Driver
Number of Drivers/Receivers:
2/0
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
347
N/A
DS76191B125BGVRenesasIC MCU 32BIT ROMLESS 176BGAMicrocontrollersN/AN/A-20°C ~ 70°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
125MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
78
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-UFBGA
225
N/A
DS76191N125BGVRenesasIC MCU 32BIT ROMLESS 176BGAMicrocontrollersN/AN/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
125MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
78
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-UFBGA
240
N/A
DS76191W125BGVRenesasIC MCU 32BIT ROMLESS 176BGAMicrocontrollersN/AN/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
125MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
78
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-UFBGA
764
DS7831J
DS7831JTexas InstrumentsIC LINE DRIVERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

1,457
DS7831WB
DS7831WBTexas InstrumentsIC LINE DRIVER/RECEIVERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

571
DS7832AW
DS7832AWTexas InstrumentsIC LINE DRIVER/RCVR DUAL DIFFDrivers, Receivers, TransceiversN/AN/AN/A

N/A

47
DS7832FK
DS7832FKTexas InstrumentsIC LINE DRIVER/RCVR DUAL DIFFDrivers, Receivers, TransceiversN/AN/AN/A

N/A

1,190
DS7832FKB
DS7832FKBTexas InstrumentsIC LINE DRIVER/RECEIVERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

1,335
DS7832JB
DS7832JBTexas InstrumentsIC LINE DRIVER/RECEIVERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

268
DS78LS120J/883
DS78LS120J/883Texas InstrumentsIC RECEIVER 0/2 16CDIPDrivers, Receivers, Transceivers16-CDIP4.5V ~ 5.5V-55°C ~ 125°C (TA)
Type:
Receiver
Protocol:
RS232, RS422, RS423
Number of Drivers/Receivers:
0/2
Receiver Hysteresis:
50 mV
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-CDIP (0.300″”, 7.62mm)
Supplier Device Package:
16-CDIP
466
DS80C310-ECG
DS80C310-ECGAnalog Devices Inc.IC MCU 8BIT ROMLESS 44TQFPMicrocontrollers44-TQFP (10x10)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SIO, UART/USART
Peripherals:
Brown-out Detect/Reset, POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
662
DS80C310-ECG+
DS80C310-ECG+Analog Devices Inc.IC MCU 8BIT ROMLESS 44TQFPMicrocontrollers44-TQFP (10x10)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SIO, UART/USART
Peripherals:
Brown-out Detect/Reset, POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
855
DS80C310-FCG
DS80C310-FCGAnalog Devices Inc.IC MCU 8BIT ROMLESS 44TQFPMicrocontrollers44-TQFP (10x10)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SIO, UART/USART
Peripherals:
Brown-out Detect/Reset, POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
1,358
DS80C310-FCG+
DS80C310-FCG+Analog Devices Inc.IC MCU 8BIT ROMLESS 44TQFPMicrocontrollers44-TQFP (10x10)N/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SIO, UART/USART
Peripherals:
Brown-out Detect/Reset, POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
104
DS80C310-MCG
DS80C310-MCGAnalog Devices Inc.IC MCU 8BIT ROMLESS 40DIPMicrocontrollers40-PDIPN/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SIO, UART/USART
Peripherals:
Brown-out Detect/Reset, POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
682
DS80C310-MCG+
DS80C310-MCG+Analog Devices Inc.IC MCU 8BIT ROMLESS 40DIPMicrocontrollers40-PDIPN/A0°C ~ 70°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, SIO, UART/USART
Peripherals:
Brown-out Detect/Reset, POR
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
777

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up