Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DSPIC33CK1024MP410T-I/PT
DSPIC33CK1024MP410T-I/PTMicrochip TechnologyIC MCU 16BIT 1MB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
89
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 28x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
898
DSPIC33CK1024MP705-E/M7
DSPIC33CK1024MP705-E/M7Microchip TechnologyIC MCU 16BIT 1MB FLASH 48VFQFNMicrocontrollers48-VQFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
39
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 19x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-VQFN (6×6)
Package / Case:
48-VFQFN Exposed Pad
373
DSPIC33CK1024MP705-E/PT
DSPIC33CK1024MP705-E/PTMicrochip TechnologyIC MCU 16BIT 1MB FLASH 48TQFPMicrocontrollers48-TQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
39
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 19x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-TQFP (7×7)
Package / Case:
48-TQFP
17
DSPIC33CK1024MP705-I/M7
DSPIC33CK1024MP705-I/M7Microchip TechnologyIC MCU 16BIT 1MB FLASH 48VFQFNMicrocontrollers48-VQFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
39
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 19x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-VQFN (6×6)
Package / Case:
48-VFQFN Exposed Pad
127
DSPIC33CK1024MP705-I/PT
DSPIC33CK1024MP705-I/PTMicrochip TechnologyIC MCU 16BIT 1MB FLASH 48TQFPMicrocontrollers48-TQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
39
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 19x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-TQFP (7×7)
Package / Case:
48-TQFP
447
DSPIC33CK1024MP705T-I/M7
DSPIC33CK1024MP705T-I/M7Microchip TechnologyIC MCU 16BIT 1MB FLASH 48VFQFNMicrocontrollers48-VQFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
39
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 19x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-VQFN (6×6)
Package / Case:
48-VFQFN Exposed Pad
188
DSPIC33CK1024MP705T-I/PT
DSPIC33CK1024MP705T-I/PTMicrochip TechnologyIC MCU 16BIT 1MB FLASH 48TQFPMicrocontrollers48-TQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
39
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 19x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-TQFP (7×7)
Package / Case:
48-TQFP
144
DSPIC33CK1024MP706-E/MR
DSPIC33CK1024MP706-E/MRMicrochip TechnologyIC MCU 16BIT 1MB FLASH 64VFQFNMicrocontrollers64-QFN (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
54
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,763
DSPIC33CK1024MP706-E/PT
DSPIC33CK1024MP706-E/PTMicrochip TechnologyIC MCU 16BIT 1MB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
54
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
966
DSPIC33CK1024MP706-I/MR
DSPIC33CK1024MP706-I/MRMicrochip TechnologyIC MCU 16BIT 1MB FLASH 64VFQFNMicrocontrollers64-QFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
54
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,251
DSPIC33CK1024MP706-I/PT
DSPIC33CK1024MP706-I/PTMicrochip TechnologyIC MCU 16BIT 1MB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
54
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
324
DSPIC33CK1024MP706T-I/MR
DSPIC33CK1024MP706T-I/MRMicrochip TechnologyIC MCU 16BIT 1MB FLASH 64VFQFNMicrocontrollers64-QFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
54
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
836
DSPIC33CK1024MP706T-I/PT
DSPIC33CK1024MP706T-I/PTMicrochip TechnologyIC MCU 16BIT 1MB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
54
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
484
DSPIC33CK1024MP708-E/PT
DSPIC33CK1024MP708-E/PTMicrochip TechnologyIC MCU 16BIT 1MB FLASH 80TQFPMicrocontrollers80-TQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
69
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 24x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP (12×12)
Package / Case:
80-TQFP
1,699
DSPIC33CK1024MP708-I/PT
DSPIC33CK1024MP708-I/PTMicrochip TechnologyIC MCU 16BIT 1MB FLASH 80TQFPMicrocontrollers80-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
69
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 24x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP (12×12)
Package / Case:
80-TQFP
1,343
DSPIC33CK1024MP708T-I/PT
DSPIC33CK1024MP708T-I/PTMicrochip TechnologyIC MCU 16BIT 1MB FLASH 80TQFPMicrocontrollers80-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
69
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 24x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP (12×12)
Package / Case:
80-TQFP
616
DSPIC33CK1024MP710-E/PT
DSPIC33CK1024MP710-E/PTMicrochip TechnologyIC MCU 16BIT 1MB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
89
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 28x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
485
DSPIC33CK1024MP710-I/PT
DSPIC33CK1024MP710-I/PTMicrochip TechnologyIC MCU 16BIT 1MB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
89
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 28x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
871
DSPIC33CK1024MP710T-I/PT
DSPIC33CK1024MP710T-I/PTMicrochip TechnologyIC MCU 16BIT 1MB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
100MIPs
Connectivity:
CANbus, I2C, LINbus, QEI, SPI, Smart Card, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, QEI, WDT
Number of I/O:
89
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 28x12b SAR; D/A 6x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
1,126
DSPIC33CK128MC102-E/2NN/ADSPIC33CK128MC102-E/2NMicrochip TechnologyIC MCU 16BIT 128KB FLASH 28UQFNMicrocontrollers28-UQFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-UQFN (6×6)
Package / Case:
28-UQFN Exposed Pad
795

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