Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EFM32GG290F1024G-E-BGA112
EFM32GG290F1024G-E-BGA112Silicon LabsIC MCU 32BIT 1MB FLASH 112BGAMicrocontrollers112-BGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
90
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-BGA (10×10)
Package / Case:
112-LFBGA
144
EFM32GG290F1024G-E-BGA112R
EFM32GG290F1024G-E-BGA112RSilicon LabsIC MCU 32BIT 1MB FLASH 112BGAMicrocontrollers112-BGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
90
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-BGA (10×10)
Package / Case:
112-LFBGA
637
EFM32GG290F512-BGA112
EFM32GG290F512-BGA112Silicon LabsIC MCU 32BIT 512KB FLASH 112BGAMicrocontrollers112-BGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
90
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-BGA (10×10)
Package / Case:
112-LFBGA
321
EFM32GG290F512-BGA112T
EFM32GG290F512-BGA112TSilicon LabsIC MCU 32BIT 512KB FLASH 112BGAMicrocontrollers112-BGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
90
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-BGA (10×10)
Package / Case:
112-LFBGA
1,168
EFM32GG290F512G-E-BGA112
EFM32GG290F512G-E-BGA112Silicon LabsIC MCU 32BIT 512KB FLASH 112BGAMicrocontrollers112-BGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
90
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-BGA (10×10)
Package / Case:
112-LFBGA
164
EFM32GG290F512G-E-BGA112R
EFM32GG290F512G-E-BGA112RSilicon LabsIC MCU 32BIT 512KB FLASH 112BGAMicrocontrollers112-BGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
90
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-BGA (10×10)
Package / Case:
112-LFBGA
1,293
EFM32GG295F1024-BGA120
EFM32GG295F1024-BGA120Silicon LabsIC MCU 32BIT 1MB FLASH 120BGAMicrocontrollers120-BGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
93
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-BGA (7×7)
Package / Case:
120-VFBGA
438
EFM32GG295F1024-BGA120T
EFM32GG295F1024-BGA120TSilicon LabsIC MCU 32BIT 1MB FLASH 120BGAMicrocontrollers120-BGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
93
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-BGA (7×7)
Package / Case:
120-VFBGA
636
EFM32GG295F1024G-E-BGA120
EFM32GG295F1024G-E-BGA120Silicon LabsIC MCU 32BIT 1MB FLASH 120BGAMicrocontrollers120-BGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
93
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-BGA (7×7)
Package / Case:
120-VFBGA
247
EFM32GG295F1024G-E-BGA120R
EFM32GG295F1024G-E-BGA120RSilicon LabsIC MCU 32BIT 1MB FLASH 120BGAMicrocontrollers120-BGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
93
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-BGA (7×7)
Package / Case:
120-VFBGA
796
EFM32GG295F512-BGA120
EFM32GG295F512-BGA120Silicon LabsIC MCU 32BIT 512KB FLASH 120BGAMicrocontrollers120-BGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
93
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-BGA (7×7)
Package / Case:
120-VFBGA
569
EFM32GG295F512-BGA120T
EFM32GG295F512-BGA120TSilicon LabsIC MCU 32BIT 512KB FLASH 120BGAMicrocontrollers120-BGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
93
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-BGA (7×7)
Package / Case:
120-VFBGA
53
EFM32GG295F512G-E-BGA120
EFM32GG295F512G-E-BGA120Silicon LabsIC MCU 32BIT 512KB FLASH 120BGAMicrocontrollers120-BGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
93
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-BGA (7×7)
Package / Case:
120-VFBGA
288
EFM32GG295F512G-E-BGA120R
EFM32GG295F512G-E-BGA120RSilicon LabsIC MCU 32BIT 512KB FLASH 120BGAMicrocontrollers120-BGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
93
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-BGA (7×7)
Package / Case:
120-VFBGA
551
EFM32GG330F1024-QFN64
EFM32GG330F1024-QFN64Silicon LabsIC MCU 32BIT 1MB FLASH 64QFNMicrocontrollers64-QFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,061
EFM32GG330F1024-QFN64T
EFM32GG330F1024-QFN64TSilicon LabsIC MCU 32BIT 1MB FLASH 64QFNMicrocontrollers64-QFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
524
EFM32GG330F1024G-E-QFN64
EFM32GG330F1024G-E-QFN64Silicon LabsIC MCU 32BIT 1MB FLASH 64QFNMicrocontrollers64-QFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
14
EFM32GG330F1024G-E-QFN64R
EFM32GG330F1024G-E-QFN64RSilicon LabsIC MCU 32BIT 1MB FLASH 64QFNMicrocontrollers64-QFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
52
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
564
EFM32GG330F512-QFN64
EFM32GG330F512-QFN64Silicon LabsIC MCU 32BIT 512KB FLASH 64QFNMicrocontrollers64-QFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
175
EFM32GG330F512-QFN64T
EFM32GG330F512-QFN64TSilicon LabsIC MCU 32BIT 512KB FLASH 64QFNMicrocontrollers64-QFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 3.8V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,895

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