Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EFM8BB51F8G-C-QFN20
EFM8BB51F8G-C-QFN20Silicon LabsIC MCU 8BIT 8KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-WFQFN Exposed Pad
1,122
EFM8BB51F8G-C-QFN20R
EFM8BB51F8G-C-QFN20RSilicon LabsIC MCU 8BIT 8KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-WFQFN Exposed Pad
457
EFM8BB51F8G-C-TSSOP20
EFM8BB51F8G-C-TSSOP20Silicon LabsIC MCU 8BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
192
EFM8BB51F8G-C-TSSOP20R
EFM8BB51F8G-C-TSSOP20RSilicon LabsIC MCU 8BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
528
EFM8BB51F8I-C-QFN20
EFM8BB51F8I-C-QFN20Silicon LabsIC MCU 8BIT 8KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 125°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-WFQFN Exposed Pad
620
EFM8BB51F8I-C-QFN20R
EFM8BB51F8I-C-QFN20RSilicon LabsIC MCU 8BIT 8KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 125°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-WFQFN Exposed Pad
102
EFM8BB51F8I-C-TSSOP20
EFM8BB51F8I-C-TSSOP20Silicon LabsIC MCU 8BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
328
EFM8BB51F8I-C-TSSOP20R
EFM8BB51F8I-C-TSSOP20RSilicon LabsIC MCU 8BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
1,256
EFM8BB52F16G-C-QFN20N/AEFM8BB52F16G-C-QFN20Silicon LabsIC MCU 8BIT 16KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-WFQFN Exposed Pad
517
EFM8BB52F16G-C-QFN20RN/AEFM8BB52F16G-C-QFN20RSilicon LabsIC MCU 8BIT 16KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-WFQFN Exposed Pad
1,135
EFM8BB52F16G-C-QFN32
EFM8BB52F16G-C-QFN32Silicon LabsIC MCU 8BIT 16KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-WFQFN Exposed Pad
554
EFM8BB52F16G-C-QFN32RN/AEFM8BB52F16G-C-QFN32RSilicon LabsIC MCU 8BIT 16KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-WFQFN Exposed Pad
1,304
EFM8BB52F16G-C-TSSOP20N/AEFM8BB52F16G-C-TSSOP20Silicon LabsIC MCU 8BIT 16KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
1,668
EFM8BB52F16G-C-TSSOP20RN/AEFM8BB52F16G-C-TSSOP20RSilicon LabsIC MCU 8BIT 16KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
1,206
EFM8BB52F16G-C-TSSOP28
EFM8BB52F16G-C-TSSOP28Silicon LabsIC MCU 8BIT 16KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
470
EFM8BB52F16G-C-TSSOP28RN/AEFM8BB52F16G-C-TSSOP28RSilicon LabsIC MCU 8BIT 16KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
1,033
EFM8BB52F16I-C-QFN20N/AEFM8BB52F16I-C-QFN20Silicon LabsIC MCU 8BIT 16KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 125°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-WFQFN Exposed Pad
535
EFM8BB52F16I-C-QFN20RN/AEFM8BB52F16I-C-QFN20RSilicon LabsIC MCU 8BIT 16KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 125°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-WFQFN Exposed Pad
680
EFM8BB52F16I-C-QFN32N/AEFM8BB52F16I-C-QFN32Silicon LabsIC MCU 8BIT 16KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-WFQFN Exposed Pad
105
EFM8BB52F16I-C-QFN32RN/AEFM8BB52F16I-C-QFN32RSilicon LabsIC MCU 8BIT 16KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
50MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x12b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-WFQFN Exposed Pad
750

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