 | | F28386DPTPS | Texas Instruments | IC MCU 32BIT 1MB FLASH 176HLQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 20x12b, 29x16b SAR; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 770 | |
 | | F28386DZWTQ | Texas Instruments | IC MCU 32BIT 1MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 24x12b, 36x16b SAR; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,001 | |
 | | F28386DZWTQR | Texas Instruments | IC MCU 32BIT 1MB FLASH 337LFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 24x12b, 36x16b SAR; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,272 | |
 | | F28386DZWTS | Texas Instruments | IC MCU 32BIT 1MB FLASH 337LFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 24x12b, 36x16b SAR; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,294 | |
 | | F28386SPTPQR | Texas Instruments | IC MCU 32BIT 512KB FLASH 176LQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 20x12b, 29x16b SAR; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 508 | |
 | | F28386SPTPS | Texas Instruments | IC MCU 32BIT 512KB FLSH 176HLQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 20x12b, 29x16b SAR; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 328 | |
 | | F28386SZWTS | Texas Instruments | IC MCU 32BIT 512KB FLSH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 96×12/16b; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,363 | |
 | | F28388DPTPS | Texas Instruments | IC MCU 32BIT 1MB FLASH 176HLQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 20x12b, 29x16b SAR; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 612 | |
 | | F28388DPTPSR | Texas Instruments | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 20x12b, 29x16b SAR; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,946 | |
 | | F28388DZWTS | Texas Instruments | IC MCU 32BIT 512KB FLSH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 96×12/16b; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,584 | |
 | | F28388DZWTSR | Texas Instruments | IC MCU 32BIT 1MB FLASH 337LFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 24x12b, 36x16b SAR; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,055 | |
 | | F28388SPTPS | Texas Instruments | IC MCU 32BIT 512KB FLSH 176HLQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 20x12b, 29x16b SAR; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 151 | |
 | | F28388SPTPSR | Texas Instruments | IC MCU 32BIT 512KB FLASH 176LQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -40°C ~ 125°C (TJ) | Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 20x12b, 29x16b SAR; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 765 | |
 | | F28388SZWTS | Texas Instruments | IC MCU 32BIT 512KB FLSH 337LFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TJ) | Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 24x12b, 36x16b SAR; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 325 | |
 | | F28388SZWTSR | Texas Instruments | IC MCU 32BIT 512KB FLSH 337LFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TJ) | Connectivity: CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 24x12b, 36x16b SAR; D/A 3x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 547 | |
 | | F28M35E20B1RFPS | Texas Instruments | IC MCU 32BIT 256KB FLASH 144TQFP | Microcontrollers | 144-HTQFP (20x20) | N/A | -40°C ~ 125°C (TJ) | Core Processor: C28x/ARM® Cortex®-M3 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, SSI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 256KB/256KB Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.2V, 1.8V, 3.3V Data Converters: A/D 20x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 144-HTQFP (20×20) Package / Case: 144-TQFP Exposed Pad | 652 | |
 | | F28M35E20B1RFPT | Texas Instruments | IC MCU 32BIT 256KB FLASH 144TQFP | Microcontrollers | 144-HTQFP (20x20) | N/A | -40°C ~ 105°C (TJ) | Core Processor: C28x/ARM® Cortex®-M3 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, SSI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 256KB/256KB Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.2V, 1.8V, 3.3V Data Converters: A/D 20x12b Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 144-HTQFP (20×20) Package / Case: 144-TQFP Exposed Pad | 616 | |
 | | F28M35E32C1RFPT | Texas Instruments | IC MCU 32BIT 256KB FLASH 144TQFP | Microcontrollers | 144-HTQFP (20x20) | N/A | -40°C ~ 105°C (TJ) | Core Processor: C28x/ARM® Cortex®-M3 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 256KB/512KB Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V, 3.3V Data Converters: A/D 20x12b Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 144-HTQFP (20×20) Package / Case: 144-TQFP Exposed Pad | 460 | |
 | | F28M35E50B1RFPQ | Texas Instruments | IC MCU 32BIT 512KB FLASH 144TQFP | Microcontrollers | 144-HTQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: C28x/ARM® Cortex®-M3 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 512KB/512KB Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V, 3.3V Data Converters: A/D 20x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-HTQFP (20×20) Package / Case: 144-TQFP Exposed Pad | 436 | |
 | | F28M35E50B1RFPS | Texas Instruments | IC MCU 32BIT 512KB FLASH 144TQFP | Microcontrollers | 144-HTQFP (20x20) | N/A | -40°C ~ 125°C (TJ) | Core Processor: C28x/ARM® Cortex®-M3 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 512KB/512KB Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V, 3.3V Data Converters: A/D 20x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 144-HTQFP (20×20) Package / Case: 144-TQFP Exposed Pad | 506 | |