Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
F28386DPTPS
F28386DPTPSTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
108K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
770
F28386DZWTQ
F28386DZWTQTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
108K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,001
F28386DZWTQR
F28386DZWTQRTexas InstrumentsIC MCU 32BIT 1MB FLASH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
216K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,272
F28386DZWTS
F28386DZWTSTexas InstrumentsIC MCU 32BIT 1MB FLASH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
216K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,294
F28386SPTPQR
F28386SPTPQRTexas InstrumentsIC MCU 32BIT 512KB FLASH 176LQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
508
F28386SPTPS
F28386SPTPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
328
F28386SZWTS
F28386SZWTSTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 96×12/16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,363
F28388DPTPS
F28388DPTPSTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
108K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
612
F28388DPTPSR
F28388DPTPSRTexas InstrumentsIC MCU 32BIT 1MB FLASH 176LQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
216K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,946
F28388DZWTS
F28388DZWTSTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 96×12/16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,584
F28388DZWTSR
F28388DZWTSRTexas InstrumentsIC MCU 32BIT 1MB FLASH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
216K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,055
F28388SPTPS
F28388SPTPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
151
F28388SPTPSR
F28388SPTPSRTexas InstrumentsIC MCU 32BIT 512KB FLASH 176LQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
765
F28388SZWTS
F28388SZWTSTexas InstrumentsIC MCU 32BIT 512KB FLSH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
325
F28388SZWTSR
F28388SZWTSRTexas InstrumentsIC MCU 32BIT 512KB FLSH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
547
F28M35E20B1RFPS
F28M35E20B1RFPSTexas InstrumentsIC MCU 32BIT 256KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
256KB/256KB
Program Memory Type:
FLASH
RAM Size:
72KB
Voltage – Supply (Vcc/Vdd):
1.2V, 1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
652
F28M35E20B1RFPT
F28M35E20B1RFPTTexas InstrumentsIC MCU 32BIT 256KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
256KB/256KB
Program Memory Type:
FLASH
RAM Size:
72KB
Voltage – Supply (Vcc/Vdd):
1.2V, 1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
616
F28M35E32C1RFPT
F28M35E32C1RFPTTexas InstrumentsIC MCU 32BIT 256KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
256KB/512KB
Program Memory Type:
FLASH
RAM Size:
136KB
Voltage – Supply (Vcc/Vdd):
1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
460
F28M35E50B1RFPQ
F28M35E50B1RFPQTexas InstrumentsIC MCU 32BIT 512KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
512KB/512KB
Program Memory Type:
FLASH
RAM Size:
72KB
Voltage – Supply (Vcc/Vdd):
1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
436
F28M35E50B1RFPS
F28M35E50B1RFPSTexas InstrumentsIC MCU 32BIT 512KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
512KB/512KB
Program Memory Type:
FLASH
RAM Size:
72KB
Voltage – Supply (Vcc/Vdd):
1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
506

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