Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
F28388DZWTSRF28388DZWTSRTexas InstrumentsIC MCU 32BIT 1MB FLASH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
216K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
23
F28388SPTPSF28388SPTPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
865
F28388SPTPSRF28388SPTPSRTexas InstrumentsIC MCU 32BIT 512KB FLASH 176LQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 20x12b, 29x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
128
F28388SZWTSF28388SZWTSTexas InstrumentsIC MCU 32BIT 512KB FLSH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,386
F28388SZWTSRF28388SZWTSRTexas InstrumentsIC MCU 32BIT 512KB FLSH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
172K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24x12b, 36x16b SAR; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,279
F28M35E20B1RFPSF28M35E20B1RFPSTexas InstrumentsIC MCU 32BIT 256KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
256KB/256KB
Program Memory Type:
FLASH
RAM Size:
72KB
Voltage – Supply (Vcc/Vdd):
1.2V, 1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
240
F28M35E20B1RFPTF28M35E20B1RFPTTexas InstrumentsIC MCU 32BIT 256KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
256KB/256KB
Program Memory Type:
FLASH
RAM Size:
72KB
Voltage – Supply (Vcc/Vdd):
1.2V, 1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
1,055
F28M35E32C1RFPTF28M35E32C1RFPTTexas InstrumentsIC MCU 32BIT 256KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
256KB/512KB
Program Memory Type:
FLASH
RAM Size:
136KB
Voltage – Supply (Vcc/Vdd):
1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
1,853
F28M35E50B1RFPQF28M35E50B1RFPQTexas InstrumentsIC MCU 32BIT 512KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
512KB/512KB
Program Memory Type:
FLASH
RAM Size:
72KB
Voltage – Supply (Vcc/Vdd):
1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
1,076
F28M35E50B1RFPSF28M35E50B1RFPSTexas InstrumentsIC MCU 32BIT 512KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
512KB/512KB
Program Memory Type:
FLASH
RAM Size:
72KB
Voltage – Supply (Vcc/Vdd):
1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
1,088
F28M35E50B1RFPTF28M35E50B1RFPTTexas InstrumentsIC MCU 32BIT 512KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)1.8V, 3.3V-40°C – 105°C
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Program Memory Size:
512KB/512KB
Mounting Type:
Surface Mount
418
F28M35E50C1RFPSF28M35E50C1RFPSTexas InstrumentsIC MCU 32BIT 512KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
512KB/512KB
Program Memory Type:
FLASH
RAM Size:
72KB
Voltage – Supply (Vcc/Vdd):
1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
1,784
F28M35E52B1RFPQF28M35E52B1RFPQTexas InstrumentsIC MCU 32BIT 512KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
512KB/512KB
Program Memory Type:
FLASH
RAM Size:
136KB
Voltage – Supply (Vcc/Vdd):
1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
578
F28M35E52B1RFPTF28M35E52B1RFPTTexas InstrumentsIC MCU 32BIT 512KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
512KB/512KB
Program Memory Type:
FLASH
RAM Size:
136KB
Voltage – Supply (Vcc/Vdd):
1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
485
F28M35E52C1RFPTF28M35E52C1RFPTTexas InstrumentsIC MCU 32BIT 512KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
60MHz/60MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
512KB/512KB
Program Memory Type:
FLASH
RAM Size:
136KB
Voltage – Supply (Vcc/Vdd):
1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
1,104
F28M35H22C1RFPSF28M35H22C1RFPSTexas InstrumentsIC MCU 32BIT 256KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
100MHz/150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SCI, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
256KB/256KB
Program Memory Type:
FLASH
RAM Size:
136KB
Voltage – Supply (Vcc/Vdd):
1.2V, 1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
788
F28M35H22C1RFPTF28M35H22C1RFPTTexas InstrumentsIC MCU 32BIT 256KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
100MHz/150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SCI, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
256KB/256KB
Program Memory Type:
FLASH
RAM Size:
136KB
Voltage – Supply (Vcc/Vdd):
1.2V, 1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
524
F28M35H52C1RFPQF28M35H52C1RFPQTexas InstrumentsIC MCU 32BIT 512KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
100MHz/150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SCI, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
512KB/512KB
Program Memory Type:
FLASH
RAM Size:
136KB
Voltage – Supply (Vcc/Vdd):
1.2V, 1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
701
F28M35H52C1RFPSF28M35H52C1RFPSTexas InstrumentsIC MCU 32BIT 512KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
100MHz/150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SCI, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
512KB/512KB
Program Memory Type:
FLASH
RAM Size:
136KB
Voltage – Supply (Vcc/Vdd):
1.2V, 1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
928
F28M35H52C1RFPTF28M35H52C1RFPTTexas InstrumentsIC MCU 32BIT 512KB FLASH 144TQFPMicrocontrollers144-HTQFP (20x20)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x/ARM® Cortex®-M3
Core Size:
32-Bit Dual-Core
Speed:
100MHz/150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SCI, SPI, SSI, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
512KB/512KB
Program Memory Type:
FLASH
RAM Size:
136KB
Voltage – Supply (Vcc/Vdd):
1.2V, 1.8V, 3.3V
Data Converters:
A/D 20x12b
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HTQFP (20×20)
Package / Case:
144-TQFP Exposed Pad
583

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