Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
FBFS064GBG-EA40N/AFBFS064GBG-EA40FlexxonBGA UFS 2.2Memory153 BGAN/A-25°C - 85°C
Memory Size:
512 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
64G x 8
Memory Interface:
UFS 2.2
Grade:
Industrial
Packaging:
11.5x13x1.4mm
Qualification:
N/A
804
FBFS064GBG-EB40N/AFBFS064GBG-EB40FlexxonBGA UFS 3.1Memory153 FBGAN/A-25°C - 85°C
Memory Size:
512 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
64G x 8
Memory Interface:
UFS 3.1
Grade:
Industrial
Packaging:
11.5x13x1.4mm
Qualification:
N/A
923
FBFS128GBA-EA40N/AFBFS128GBA-EA40FlexxonBGA UFS 2.2Memory153 BGAN/A-40°C - 85°C
Memory Size:
1.024 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
128G x 8
Memory Interface:
UFS 2.2
Grade:
Automotive grade 3
Packaging:
11.5x13x1.4mm
Qualification:
AEC-Q100 Grade 3
1,132
FBFS128GBA-EB40N/AFBFS128GBA-EB40FlexxonBGA UFS 3.1Memory153 FBGAN/A-40°C - 85°C
Memory Size:
1.024 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
128G x 8
Memory Interface:
UFS 3.1
Grade:
Automotive grade 3
Packaging:
11.5x13x1.4mm
Qualification:
AEC-Q100 Grade 3
332
FBFS128GBB-EA40N/AFBFS128GBB-EA40FlexxonBGA UFS 2.2Memory153 BGAN/A-40°C - 105°C
Memory Size:
1.024 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
128G x 8
Memory Interface:
UFS 2.2
Grade:
Automotive grade 2
Packaging:
11.5x13x1.4mm
Qualification:
AEC-Q100 Grade 2
810
FBFS128GBB-EB40N/AFBFS128GBB-EB40FlexxonBGA UFS 3.1Memory153 FBGAN/A-40°C - 105°C
Memory Size:
1.024 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
128G x 8
Memory Interface:
UFS 3.1
Grade:
Automotive grade 2
Packaging:
11.5x13x1.4mm
Qualification:
AEC-Q100 Grade 2
1,232
FBFS128GBE-EA40N/AFBFS128GBE-EA40FlexxonBGA UFS 2.2Memory153 BGAN/A-40°C - 85°C
Memory Size:
1.024 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
128G x 8
Memory Interface:
UFS 2.2
Grade:
Industrial
Packaging:
11.5x13x1.4mm
Qualification:
N/A
250
FBFS128GBE-EB40N/AFBFS128GBE-EB40FlexxonBGA UFS 3.1Memory153 FBGAN/A-40°C - 85°C
Memory Size:
1.024 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
128G x 8
Memory Interface:
UFS 3.1
Grade:
Industrial
Packaging:
11.5x13x1.4mm
Qualification:
N/A
1,134
FBFS128GBG-EA40N/AFBFS128GBG-EA40FlexxonBGA UFS 2.2Memory153 BGAN/A-25°C - 85°C
Memory Size:
1.024 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
128G x 8
Memory Interface:
UFS 2.2
Grade:
Industrial
Packaging:
11.5x13x1.4mm
Qualification:
N/A
1,436
FBFS128GBG-EB40N/AFBFS128GBG-EB40FlexxonBGA UFS 3.1Memory153 FBGAN/A-25°C - 85°C
Memory Size:
1.024 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
128G x 8
Memory Interface:
UFS 3.1
Grade:
Industrial
Packaging:
11.5x13x1.4mm
Qualification:
N/A
1,764
FBFS256GBA-EA40N/AFBFS256GBA-EA40FlexxonBGA UFS 2.2Memory153 BGAN/A-40°C - 85°C
Memory Size:
2.048 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
256G x 8
Memory Interface:
UFS 2.2
Grade:
Automotive grade 3
Packaging:
11.5x13x1.4mm
Qualification:
AEC-Q100 Grade 3
74
FBFS256GBA-EB40N/AFBFS256GBA-EB40FlexxonBGA UFS 3.1Memory153 FBGAN/A-40°C - 85°C
Memory Size:
2.048 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
256G x 8
Memory Interface:
UFS 3.1
Grade:
Automotive grade 3
Packaging:
11.5x13x1.4mm
Qualification:
AEC-Q100 Grade 3
871
FBFS256GBB-EA40N/AFBFS256GBB-EA40FlexxonBGA UFS 2.2Memory153 BGAN/A-40°C - 105°C
Memory Size:
2.048 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
256G x 8
Memory Interface:
UFS 2.2
Grade:
Automotive grade 2
Packaging:
11.5x13x1.4mm
Qualification:
AEC-Q100 Grade 2
858
FBFS256GBB-EB40N/AFBFS256GBB-EB40FlexxonBGA UFS 3.1Memory153 FBGAN/A-40°C - 105°C
Memory Size:
2.048 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
256G x 8
Memory Interface:
UFS 3.1
Grade:
Automotive grade 2
Packaging:
11.5x13x1.4mm
Qualification:
AEC-Q100 Grade 2
458
FBFS256GBE-EA40N/AFBFS256GBE-EA40FlexxonBGA UFS 2.2Memory153 BGAN/A-40°C - 85°C
Memory Size:
2.048 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
256G x 8
Memory Interface:
UFS 2.2
Grade:
Industrial
Packaging:
11.5x13x1.4mm
Qualification:
N/A
1,485
FBFS256GBE-EB40N/AFBFS256GBE-EB40FlexxonBGA UFS 3.1Memory153 FBGAN/A-40°C - 85°C
Memory Size:
2.048 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
256G x 8
Memory Interface:
UFS 3.1
Grade:
Industrial
Packaging:
11.5x13x1.4mm
Qualification:
N/A
697
FBFS256GBG-EA40N/AFBFS256GBG-EA40FlexxonBGA UFS 2.2Memory153 BGAN/A-25°C - 85°C
Memory Size:
2.048 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
256G x 8
Memory Interface:
UFS 2.2
Grade:
Industrial
Packaging:
11.5x13x1.4mm
Qualification:
N/A
322
FBFS256GBG-EB40N/AFBFS256GBG-EB40FlexxonBGA UFS 3.1Memory153 FBGAN/A-25°C - 85°C
Memory Size:
2.048 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
256G x 8
Memory Interface:
UFS 3.1
Grade:
Industrial
Packaging:
11.5x13x1.4mm
Qualification:
N/A
1,033
FBFS512GBA-EA40N/AFBFS512GBA-EA40FlexxonBGA UFS 2.2Memory153 BGAN/A-40°C - 85°C
Memory Size:
4.096 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
512G x 8
Memory Interface:
UFS 2.2
Grade:
Automotive grade 3
Packaging:
11.5x13x1.52mm
Qualification:
AEC-Q100 Grade 3
1,036
FBFS512GBA-EB40N/AFBFS512GBA-EB40FlexxonBGA UFS 3.1Memory153 FBGAN/A-40°C - 85°C
Memory Size:
4.096 Tbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
3D TLC
Memory Organization:
512G x 8
Memory Interface:
UFS 3.1
Grade:
Automotive grade 3
Packaging:
11.5x13x1.52mm
Qualification:
AEC-Q100 Grade 3
1,029

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