FBFS128GBG-EB40

BGA UFS 3.1
Part Description

FBFS128GBG-EB40 128GB UFS 3.1

Quantity 503 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153 FBGAMemory FormatFLASHTechnology3D TLC
Memory Size1.024 TbitGradeIndustrialClock FrequencyN/A
VoltageN/AMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging11.5x13x1.4mmMounting MethodSurface MountMemory InterfaceUFS 3.1
Memory Organization128G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FBFS128GBG-EB40 – 128GB UFS 3.1 Industrial-Grade Flash Memory

The FBFS128GBG-EB40 from Flexxon is a high-capacity 128GB (1.024 Tbit) UFS 3.1 flash memory device built on advanced 3D TLC NAND technology. Designed for embedded applications requiring fast, reliable non-volatile storage, this industrial-grade BGA solution delivers the performance and endurance needed for demanding edge computing, industrial IoT, automotive infotainment, and ruggedized mobile platforms. The compact 153-ball FBGA package measures just 11.5×13×1.4mm, enabling space-efficient integration in modern embedded designs.

With UFS 3.1 interface capability and an extended industrial temperature range of –25°C to 85°C, the FBFS128GBG-EB40 provides a robust storage foundation for systems operating in challenging thermal environments. Its surface-mount BGA format simplifies PCB assembly and supports automated manufacturing workflows, making it ideal for volume production across industrial, commercial, and connected device markets.

Key Features

  • High-Capacity Non-Volatile Storage
    128GB (1.024 Tbit) of FLASH memory organized as 128G × 8, providing ample space for operating systems, applications, data logging, and multimedia content in embedded systems.
  • UFS 3.1 Interface
    Universal Flash Storage 3.1 interface delivers high sequential read/write performance and low-latency random access, optimized for modern mobile and embedded computing workloads requiring fast boot times and responsive application performance.
  • 3D TLC NAND Technology
    Leverages advanced 3D triple-level cell architecture to deliver high density and cost-effective storage while maintaining reliability suitable for industrial applications.
  • Industrial Temperature Range
    Rated for operation from –25°C to 85°C, ensuring reliable data retention and access in harsh environmental conditions including factory automation, transportation systems, and outdoor installations.
  • Compact BGA Package
    153-ball FBGA package with 11.5×13×1.4mm footprint enables dense board layouts and reduces overall system size, critical for space-constrained embedded devices.
  • Surface Mount Design
    SMT-compatible package supports standard PCB assembly processes, improving manufacturability and reducing production costs in high-volume applications.
  • RoHS Compliant
    Meets environmental compliance standards for global markets, supporting sustainable design practices and regulatory requirements.

Typical Applications

  • Industrial IoT and Edge Computing
    Provides fast, reliable local storage for edge gateways, controllers, and smart sensors that require data buffering, firmware storage, and local analytics in factory automation and process control environments.
  • Automotive Infotainment and Telematics
    Serves as primary storage for in-vehicle infotainment systems, navigation platforms, and telematics units requiring high-speed media access, map data storage, and software update capability across automotive temperature ranges.
  • Medical and Healthcare Devices
    Supports portable diagnostic equipment, patient monitoring systems, and imaging devices where compact form factor, data integrity, and reliable operation in variable temperature conditions are essential.
  • Ruggedized Mobile and Handheld Devices
    Enables robust storage solutions for industrial tablets, handheld scanners, field service tools, and outdoor electronics requiring resistance to temperature extremes and reliable performance in demanding field conditions.
  • Transportation and Fleet Management
    Ideal for onboard computers, digital signage, and fleet tracking systems in buses, trains, and commercial vehicles where extended temperature operation and vibration tolerance are critical.

Unique Advantages

  • Industrial-Grade Reliability:
    Extended temperature rating and industrial-grade qualification ensure dependable operation in harsh environments where consumer-grade components would fail, reducing field failures and warranty costs.
  • Simplified BOM and Design:
    Integrated UFS 3.1 storage solution eliminates the need for separate controller circuits and external components, reducing PCB complexity, component count, and overall system cost.
  • Performance-Optimized Architecture:
    UFS 3.1 interface provides superior performance compared to legacy eMMC solutions, enabling faster boot times, improved application responsiveness, and better multi-tasking capability for modern embedded operating systems.
  • Space-Efficient Integration:
    Compact 11.5×13mm BGA footprint and low 1.4mm profile support miniaturized product designs, freeing valuable PCB real estate for additional functionality or enabling smaller end-product form factors.
  • Production-Ready Package:
    Standard FBGA format and surface-mount construction integrate seamlessly into established PCB assembly lines, supporting cost-effective high-volume manufacturing without specialized handling or tooling.
  • Global Environmental Compliance:
    RoHS-compliant design meets international environmental regulations, simplifying qualification for worldwide markets and supporting corporate sustainability initiatives.

Why Choose the FBFS128GBG-EB40?

The FBFS128GBG-EB40 delivers the combination of high-capacity storage, UFS 3.1 performance, and industrial-grade reliability required for next-generation embedded systems. Its 128GB capacity handles demanding applications ranging from complex embedded Linux platforms to rich multimedia content, while the –25°C to 85°C operating range ensures consistent performance across industrial, automotive, and outdoor deployment scenarios. The compact BGA package and surface-mount design streamline integration and manufacturing, accelerating time-to-market and reducing production costs.

For design teams building industrial controllers, automotive systems, medical devices, or ruggedized mobile platforms, the FBFS128GBG-EB40 provides a proven storage foundation backed by Flexxon's expertise in industrial flash memory solutions. Its combination of capacity, performance, environmental tolerance, and compact form factor makes it an ideal choice for applications where reliability and longevity are non-negotiable.

Ready to integrate high-performance industrial storage into your next design? Request a quote for the FBFS128GBG-EB40 today to discuss your specific application requirements, volume pricing, and technical support options.

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    Date Founded: 2007


    Headquarters: Singapore


    Employees: 51-200


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