FBFS128GBB-EB40
| Part Description |
FBFS128GBB-EB40 128GB UFS 3.1 |
|---|---|
| Quantity | 1,625 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 153 FBGA | Memory Format | FLASH | Technology | 3D TLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 1.024 Tbit | Grade | Automotive grade 2 | Clock Frequency | N/A | ||
| Voltage | N/A | Memory Type | Non-Volatile | Operating Temperature | -40°C - 105°C | ||
| Packaging | 11.5x13x1.4mm | Mounting Method | Surface Mount | Memory Interface | UFS 3.1 | ||
| Memory Organization | 128G x 8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | AEC-Q100 Grade 2 | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FBFS128GBB-EB40 – 128GB UFS 3.1 Automotive-Grade Flash Storage
The FBFS128GBB-EB40 from Flexxon is a high-capacity 128GB Universal Flash Storage (UFS) 3.1 memory module delivering reliable, high-performance non-volatile storage in a compact 153-pin FBGA package. Built on advanced 3D TLC NAND technology, this automotive-grade storage solution offers 1.024 Tbit of organized memory (128G × 8) designed for applications demanding both speed and durability across extended temperature ranges.
Qualified to AEC-Q100 Grade 2 standards and operational from -40°C to 105°C, the FBFS128GBB-EB40 is engineered to meet the rigorous requirements of automotive systems, industrial equipment, and other mission-critical applications where data integrity and thermal resilience are essential. Its UFS 3.1 interface provides the bandwidth and efficiency needed for data-intensive embedded applications.
Key Features
- 128GB High-Capacity Storage
Provides 1.024 Tbit of non-volatile flash memory organized as 128G × 8, delivering ample storage for operating systems, firmware, data logging, multimedia, and application files in space-constrained embedded designs. - UFS 3.1 Interface
Leverages the Universal Flash Storage 3.1 standard for high-speed data access with low latency and efficient power management, enabling faster boot times and improved system responsiveness compared to legacy eMMC solutions. - 3D TLC NAND Technology
Utilizes three-bit-per-cell 3D TLC flash architecture to balance storage density, performance, and cost-effectiveness, optimized for read-intensive and mixed-workload applications. - Automotive-Grade Reliability
AEC-Q100 Grade 2 qualified with an operating temperature range of -40°C to 105°C, ensuring dependable operation in harsh automotive and industrial environments subject to thermal stress and vibration. - Compact Surface-Mount Package
Housed in a space-efficient 11.5 × 13 × 1.4 mm, 153-ball FBGA package for surface-mount integration, minimizing PCB footprint and enabling high-density board layouts in modern embedded systems. - RoHS Compliant
Meets RoHS environmental standards, supporting global regulatory compliance and environmentally responsible product development.
Typical Applications
- Automotive Infotainment and Telematics
Provides robust storage for navigation maps, multimedia content, over-the-air update packages, and user data in advanced driver assistance systems (ADAS), instrument clusters, and in-vehicle entertainment platforms operating in wide temperature ranges. - Industrial Automation and Control
Serves as reliable data storage for PLCs, HMI devices, edge gateways, and industrial computers requiring high-speed access to firmware, logs, and real-time process data in factory and field environments. - Medical and Healthcare Devices
Offers dependable storage for patient data, imaging files, and operating system environments in portable diagnostic equipment, patient monitoring systems, and medical imaging devices where data integrity is critical. - Smart Transportation Systems
Supports data-intensive applications in railway signaling, traffic management systems, and fleet management devices that demand automotive-grade reliability and extended temperature operation. - Ruggedized Computing Platforms
Enables high-capacity, high-performance storage for military, aerospace, and outdoor embedded computing systems designed to withstand harsh environmental conditions and thermal extremes.
Unique Advantages
- Automotive-Qualified for Mission-Critical Deployments:
AEC-Q100 Grade 2 qualification ensures the FBFS128GBB-EB40 meets stringent automotive reliability standards, providing design confidence for safety-critical and long-lifecycle applications in transportation and industrial sectors. - Extended Temperature Range for Harsh Environments:
-40°C to 105°C operational capability allows deployment in extreme climates and thermally demanding installations without requiring additional cooling or derating, reducing system complexity and cost. - High-Performance UFS 3.1 Interface:
UFS 3.1 delivers superior bandwidth and lower latency than eMMC, accelerating boot times, application launches, and data throughput—critical for responsive user interfaces and real-time data processing in embedded systems. - Compact Form Factor for Space-Constrained Designs:
The 11.5 × 13 mm FBGA footprint enables integration into miniaturized modules and densely populated PCBs, supporting modern trends toward smaller, lighter embedded products without sacrificing storage capacity. - Proven 3D TLC NAND Technology:
Balances storage density, performance, and endurance, providing a cost-effective solution for applications with moderate write cycles and high read demands, while maintaining data retention across temperature extremes. - Simplified Design and Reduced BOM:
Integrates high-capacity storage in a single, surface-mount component, streamlining board design, reducing component count, and minimizing supply chain complexity compared to multi-chip or modular storage architectures.
Why Choose the FBFS128GBB-EB40?
The FBFS128GBB-EB40 combines automotive-grade reliability, high-speed UFS 3.1 performance, and 128GB of storage capacity in a compact, thermally resilient package. It is the ideal choice for design engineers developing automotive, industrial, and ruggedized embedded systems that require dependable storage capable of operating reliably across wide temperature ranges and demanding environmental conditions. With AEC-Q100 Grade 2 qualification, this module provides the quality assurance needed for long product lifecycles and safety-critical applications.
Flexxon's BGA UFS 3.1 series delivers a future-ready storage architecture that supports the growing data demands of intelligent edge devices, connected vehicles, and next-generation industrial equipment. Whether you're designing an advanced infotainment system, a ruggedized field computer, or a high-reliability medical device, the FBFS128GBB-EB40 offers the performance, capacity, and durability to meet your most demanding storage requirements.
Get Started with the FBFS128GBB-EB40
Ready to integrate automotive-grade UFS 3.1 storage into your next design? Request a quote today to learn more about pricing, availability, and technical support for the FBFS128GBB-EB40. Our team is here to help you select the right storage solution for your application requirements.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015