FBFS064GBG-EB40

The FBFS064GBG-EB40 is a high-performance 64GB embedded flash storage solution from Flexxon, built on the Universal Flash Storage 3.1 (UFS 3.1) interface standard. Utilizing advanced 3D TLC NAND technology in a compact 153-ball FBGA package, this non-volatile memory device delivers the speed and reliability demanded by industrial computing, edge processing, and embedded systems. With its industrial temperature range of -25°C to 85°C, the FBFS064GBG-EB40 is engineered to perform consistently in challenging operating environments where standard consumer-grade storage cannot be relied upon.

Designed for applications requiring fast data throughput and robust performance, this 512 Gbit (64GB) UFS 3.1 module provides a proven storage foundation for industrial controllers, medical devices, networking equipment, and ruggedized computing platforms. Its surface-mount BGA form factor enables streamlined integration into space-constrained designs while maintaining the thermal and mechanical stability necessary for long-term field deployment.

Key Features

• UFS 3.1 Interface
  Leverages the latest Universal Flash Storage 3.1 standard, delivering high-speed serial data transfer that significantly outperforms legacy eMMC interfaces, enabling faster boot times, application loading, and data logging in embedded systems.
• 64GB Capacity (512 Gbit)
  Offers 512 Gbit of non-volatile flash storage organized as 64G × 8, providing ample capacity for operating systems, applications, firmware, and data buffering in industrial and embedded applications.
• 3D TLC NAND Technology
  Built on three-dimensional triple-level cell NAND flash, balancing high storage density with cost-effectiveness while maintaining the endurance and data integrity required for industrial workloads.
• Industrial Temperature Range
  Qualified for operation from -25°C to 85°C, ensuring reliable performance in factory automation, outdoor equipment, transportation systems, and other environments subject to temperature extremes.
• Compact BGA Package
  Housed in a space-efficient 11.5 × 13 × 1.4 mm, 153-ball FBGA package designed for surface-mount assembly, minimizing board footprint and enabling integration into slim, densely packed embedded designs.
• RoHS Compliant
  Meets RoHS environmental standards, supporting compliance requirements for global markets and environmentally conscious product development.

Typical Applications

• Industrial Automation and Control
  Serves as embedded storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and edge gateways, storing control logic, configuration data, and operational logs with the reliability and speed required for real-time industrial processes.
• Medical and Healthcare Devices
  Provides dependable non-volatile storage for diagnostic equipment, patient monitoring systems, and portable medical devices, where fast data access, extended temperature tolerance, and long-term reliability are critical.
• Networking and Telecommunications Equipment
  Enables high-speed storage for routers, switches, base stations, and network appliances, supporting firmware, configuration files, and traffic data management in demanding network infrastructure deployments.
• Ruggedized Computing Platforms
  Powers embedded computers, single-board computers, and edge AI systems deployed in harsh environments, delivering the performance and durability needed for outdoor installations, transportation, and field operations.
• Smart Instrumentation and Test Equipment
  Supports data acquisition systems, test and measurement devices, and scientific instrumentation that require fast, reliable storage for capturing and processing high-volume data streams.

Unique Advantages

• Performance Optimized for Embedded Systems:
  The UFS 3.1 interface architecture delivers superior sequential and random I/O performance compared to older storage standards, reducing system boot times and improving application responsiveness in embedded designs.
• Industrial-Grade Reliability:
  Engineered to operate reliably across an extended -25°C to 85°C temperature range, the FBFS064GBG-EB40 is built to withstand the thermal stress and environmental challenges of industrial, outdoor, and transportation applications.
• Space-Efficient Integration:
  The compact 11.5 × 13 mm BGA footprint and low-profile 1.4 mm height enable seamless integration into space-constrained embedded systems, reducing PCB real estate requirements and supporting slim product form factors.
• Proven 3D NAND Technology:
  Flexxon's use of 3D TLC NAND provides a mature, cost-effective storage foundation with the endurance and data retention characteristics necessary for demanding embedded applications.
• Simplified Design and Assembly:
  Surface-mount FBGA packaging streamlines automated PCB assembly processes, reducing manufacturing complexity and improving production yields for high-volume embedded product lines.
• Environmental Compliance:
  RoHS-compliant construction ensures that designs incorporating the FBFS064GBG-EB40 meet global environmental regulations, supporting responsible product stewardship and access to international markets.

Why Choose the FBFS064GBG-EB40?

The FBFS064GBG-EB40 combines the performance advantages of UFS 3.1 with the environmental resilience and compact packaging required for industrial embedded systems. Its 64GB capacity, industrial temperature range, and proven 3D TLC NAND technology make it an ideal storage solution for applications where reliability, performance, and long-term availability are non-negotiable. Whether you are designing a ruggedized edge computing platform, an industrial controller, or a medical device, this module delivers the speed and durability your application demands.

Flexxon's commitment to industrial-grade quality and robust product support ensures that the FBFS064GBG-EB40 is not only a technically sound choice today, but also a dependable foundation for products with extended lifecycles. By selecting this UFS 3.1 storage module, you gain access to high-speed embedded flash performance, simplified integration, and the peace of mind that comes with industrial-grade specifications and environmental compliance.

Ready to enhance your embedded design with high-performance, industrial-grade UFS 3.1 storage? Request a quote for the FBFS064GBG-EB40 today and discover how Flexxon's reliable flash solutions can elevate your next project.