FBFS064GBG-EA40

BGA UFS 2.2
Part Description

FBFS064GBG-EA40 64GB UFS 2.2

Quantity 1,260 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153 BGAMemory FormatFLASHTechnology3D TLC
Memory Size512 GbitGradeIndustrialClock FrequencyN/A
VoltageN/AMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging11.5x13x1.4mmMounting MethodSurface MountMemory InterfaceUFS 2.2
Memory Organization64G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FBFS064GBG-EA40 – 64GB Industrial-Grade UFS 2.2 Flash Memory

The FBFS064GBG-EA40 is a high-performance 64GB Universal Flash Storage (UFS) 2.2 memory solution from Flexxon, designed to meet the demanding requirements of industrial embedded systems. Built with advanced 3D TLC technology, this 512 Gbit non-volatile flash memory delivers robust storage capacity in a compact 153-pin BGA package measuring just 11.5×13×1.4mm. Organized as 64G × 8, the FBFS064GBG-EA40 provides fast, reliable data storage for space-constrained applications requiring high-speed access and industrial-grade durability.

Engineered for harsh operating environments, this UFS 2.2 memory module operates reliably across an industrial temperature range of -25°C to 85°C, making it ideal for embedded computing, industrial automation, edge computing, and IoT gateway applications where consistent performance and data integrity are critical.

Key Features

  • High-Capacity Storage
    512 Gbit (64GB) of non-volatile flash memory provides ample storage for data-intensive embedded applications, firmware, operating systems, and application data.
  • UFS 2.2 Interface
    Universal Flash Storage 2.2 protocol delivers high-speed sequential and random access performance, significantly outperforming traditional eMMC solutions for faster boot times and improved system responsiveness.
  • Advanced 3D TLC Technology
    Three-dimensional triple-level cell architecture provides an optimal balance of capacity, performance, and endurance for industrial storage requirements.
  • Industrial Temperature Range
    Qualified for operation from -25°C to 85°C, ensuring reliable performance in challenging environmental conditions including factory floors, outdoor enclosures, and transportation systems.
  • Compact BGA Package
    Surface-mount 153-ball BGA in an 11.5×13×1.4mm footprint enables high-density PCB layouts and integration into space-constrained industrial designs.
  • RoHS Compliant
    Meets environmental compliance standards for global markets, supporting sustainable product development initiatives.

Typical Applications

  • Industrial Automation and Control Systems
    Provides fast, reliable storage for PLCs, HMIs, and industrial controllers requiring rapid data logging, configuration storage, and firmware updates in factory environments.
  • Edge Computing and IoT Gateways
    Delivers high-speed local storage for edge analytics platforms, IoT gateways, and intelligent sensors processing and caching data before cloud transmission.
  • Medical and Healthcare Devices
    Supports diagnostic equipment, patient monitoring systems, and portable medical devices requiring industrial-grade storage with reliable operation across extended temperature ranges.
  • Transportation and Fleet Management
    Enables ruggedized storage for vehicle telematics, fleet tracking systems, and transportation infrastructure where temperature extremes and reliability are paramount.
  • Smart City Infrastructure
    Powers intelligent surveillance systems, traffic management controllers, and environmental monitoring stations requiring durable storage in outdoor installations.

Unique Advantages

  • Superior Performance Over eMMC:
    UFS 2.2 architecture provides significantly faster sequential and random I/O performance compared to legacy eMMC solutions, reducing system boot time and improving application responsiveness.
  • Industrial-Grade Reliability:
    Extended temperature qualification and rigorous testing ensure consistent operation in harsh industrial environments where commercial-grade components would fail.
  • Space-Efficient Integration:
    Compact 11.5×13×1.4mm BGA footprint minimizes PCB real estate requirements, enabling smaller form factors and higher component density in embedded designs.
  • Design Flexibility:
    64G × 8 memory organization and surface-mount package simplify integration into diverse embedded system architectures and support automated assembly processes.
  • Future-Proof Storage:
    64GB capacity and high-speed UFS 2.2 interface provide headroom for growing application requirements, firmware expansion, and data storage needs over extended product lifecycles.
  • Environmental Compliance:
    RoHS compliance ensures compatibility with global environmental regulations, simplifying certification and reducing time-to-market for international deployments.

Why Choose the FBFS064GBG-EA40?

The FBFS064GBG-EA40 delivers an exceptional combination of high-capacity storage, industrial-grade reliability, and advanced UFS 2.2 performance in a compact surface-mount package. Its 64GB capacity and 3D TLC technology provide the storage density modern embedded systems demand, while the -25°C to 85°C operating range ensures dependable operation in challenging industrial environments. Engineers designing next-generation industrial controllers, edge computing platforms, or IoT infrastructure will appreciate the performance advantages of UFS 2.2 over traditional eMMC solutions.

Whether you're developing ruggedized industrial equipment, intelligent edge devices, or mission-critical medical systems, the FBFS064GBG-EA40 provides the storage performance, environmental resilience, and physical footprint required for successful embedded system design. Backed by Flexxon's expertise in industrial memory solutions and manufactured to stringent quality standards, this UFS 2.2 module represents a reliable, long-term storage solution for demanding embedded applications.

Ready to upgrade your embedded design with industrial-grade UFS 2.2 storage? Contact our sales team today to request a quote for the FBFS064GBG-EA40 or to discuss your specific application requirements and volume pricing options.

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    Headquarters: Singapore


    Employees: 51-200


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