FBFS064GBB-EA40
| Part Description |
FBFS064GBB-EA40 64GB UFS 2.2 |
|---|---|
| Quantity | 873 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 153 BGA | Memory Format | FLASH | Technology | 3D TLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Grade | Automotive grade 2 | Clock Frequency | N/A | ||
| Voltage | N/A | Memory Type | Non-Volatile | Operating Temperature | -40°C - 105°C | ||
| Packaging | 11.5x13x1.4mm | Mounting Method | Surface Mount | Memory Interface | UFS 2.2 | ||
| Memory Organization | 64G x 8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | AEC-Q100 Grade 2 | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FBFS064GBB-EA40 – Automotive-Grade 64GB UFS 2.2 Embedded Flash Storage
The FBFS064GBB-EA40 is a 64GB embedded Universal Flash Storage (UFS) 2.2 memory solution from Flexxon, engineered for demanding automotive and industrial applications. Built on advanced 3D TLC NAND technology and packaged in a compact 153-ball BGA (11.5×13×1.4mm), this non-volatile flash memory delivers high-performance data storage in a surface-mount format optimized for space-constrained embedded systems.
Qualified to AEC-Q100 Grade 2 standards and rated for automotive-grade operation from -40°C to 105°C, the FBFS064GBB-EA40 provides reliable, high-speed storage for automotive infotainment, advanced driver assistance systems, industrial controllers, and mission-critical embedded applications where data integrity and environmental resilience are paramount.
Key Features
- High-Capacity Embedded Storage
Offers 512 Gbit (64GB) of non-volatile flash memory organized as 64G × 8, providing ample storage for multimedia content, firmware, logs, and application data in embedded systems. - UFS 2.2 High-Speed Interface
Features the Universal Flash Storage 2.2 interface, enabling fast sequential and random read/write performance for demanding data-intensive applications requiring rapid access to large files and real-time data processing. - Advanced 3D TLC NAND Technology
Utilizes 3D TLC (Triple-Level Cell) NAND flash technology, delivering a balance of high density, performance, and endurance suitable for modern embedded storage requirements. - Automotive-Grade Qualification
AEC-Q100 Grade 2 qualified with an extended operating temperature range of -40°C to 105°C, ensuring reliable operation in harsh automotive and industrial environments subject to temperature extremes and environmental stress. - Compact BGA Package
Surface-mount 153-ball BGA package measuring just 11.5×13×1.4mm enables integration into space-constrained PCB designs while maintaining robust electrical performance and manufacturability. - RoHS Compliant
Meets RoHS environmental compliance standards, supporting environmentally responsible design and manufacturing practices.
Typical Applications
- Automotive Infotainment Systems
Provides high-capacity storage for navigation maps, multimedia content, user interfaces, and application data in in-vehicle infotainment (IVI) systems, leveraging UFS 2.2 speed for responsive user experiences. - Advanced Driver Assistance Systems (ADAS)
Stores firmware, calibration data, and event logs for ADAS applications, with automotive-grade reliability and temperature tolerance critical for safety-related automotive functions. - Industrial Control and Automation
Delivers reliable non-volatile storage for industrial controllers, human-machine interfaces (HMI), and automation equipment operating in challenging temperature and environmental conditions. - Embedded Computing Platforms
Serves as primary storage for embedded Linux, Android, or RTOS-based systems requiring high-speed, high-capacity flash memory in compact form factors for edge computing and IoT gateway applications. - Transportation and Commercial Vehicle Systems
Supports fleet management, telematics, digital instrument clusters, and commercial vehicle information systems with ruggedized storage capable of withstanding extended temperature ranges and vibration.
Unique Advantages
- Automotive-Qualified Reliability: AEC-Q100 Grade 2 qualification ensures the FBFS064GBB-EA40 meets stringent automotive reliability standards, reducing risk in safety-critical and mission-critical applications.
- Extended Temperature Performance: Operating range of -40°C to 105°C provides headroom for demanding thermal environments in automotive underhood, industrial, and outdoor installations without derating or performance degradation.
- High-Speed UFS 2.2 Interface: UFS 2.2 architecture delivers superior performance compared to legacy eMMC interfaces, enabling faster boot times, improved application responsiveness, and efficient handling of large data sets.
- Space-Efficient Integration: The compact 11.5×13×1.4mm BGA footprint minimizes PCB real estate requirements, allowing designers to maximize functionality in size-constrained automotive and industrial designs.
- Proven 3D NAND Technology: 3D TLC NAND provides a mature, reliable foundation for embedded storage with a favorable balance of capacity, performance, and endurance suitable for long product lifecycles.
- Environmentally Responsible: RoHS compliance supports global regulatory requirements and corporate sustainability initiatives, simplifying supply chain management and market access.
Why Choose the FBFS064GBB-EA40?
The FBFS064GBB-EA40 combines high-capacity storage, high-speed UFS 2.2 performance, and automotive-grade qualification in a compact, robust package. Designed for engineers developing next-generation automotive, industrial, and embedded systems, this 64GB UFS solution addresses the growing demand for fast, reliable, and environmentally resilient non-volatile memory. Its AEC-Q100 Grade 2 qualification and extended temperature rating make it an ideal choice for applications where reliability cannot be compromised.
Whether you're designing advanced infotainment systems, ADAS platforms, industrial controllers, or ruggedized embedded computing solutions, the FBFS064GBB-EA40 delivers the storage performance and environmental resilience your application demands. Backed by Flexxon's expertise in embedded memory solutions and proven 3D NAND technology, this UFS 2.2 module provides a scalable, dependable foundation for current and future designs.
Ready to integrate high-performance automotive-grade storage into your next design? Request a quote for the FBFS064GBB-EA40 today and discover how this 64GB UFS 2.2 solution can enhance your embedded system's capabilities and reliability.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015