FBFS064GBA-EA40
| Part Description |
FBFS064GBA-EA40 64GB UFS 2.2 |
|---|---|
| Quantity | 797 Available (as of May 4, 2026) |
Specifications & Environmental
| Device Package | 153 BGA | Memory Format | FLASH | Technology | 3D TLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Grade | Automotive grade 3 | Clock Frequency | N/A | ||
| Voltage | N/A | Memory Type | Non-Volatile | Operating Temperature | -40°C - 85°C | ||
| Packaging | 11.5x13x1.4mm | Mounting Method | Surface Mount | Memory Interface | UFS 2.2 | ||
| Memory Organization | 64G x 8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | AEC-Q100 Grade 3 | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FBFS064GBA-EA40 – 64GB Automotive-Grade UFS 2.2 Flash Memory
The FBFS064GBA-EA40 is a 64GB (512 Gbit) Universal Flash Storage (UFS) 2.2 memory device from Flexxon, engineered for high-performance embedded applications requiring fast data access and automotive-grade reliability. Built on 3D TLC NAND technology in a compact 153-ball BGA package (11.5×13×1.4mm), this surface-mount non-volatile flash memory delivers the speed and durability needed for data-intensive automotive systems.
Qualified to AEC-Q100 Grade 3 standards and rated for operation from -40°C to 85°C, the FBFS064GBA-EA40 is designed for automotive infotainment, telematics, advanced driver assistance systems (ADAS), and other demanding embedded applications where robust performance and temperature tolerance are critical.
Key Features
- High-Capacity Storage
64GB (512 Gbit) organized as 64G × 8, providing substantial storage for operating systems, applications, maps, media files, and data logging in automotive and industrial systems. - UFS 2.2 Interface
Universal Flash Storage 2.2 interface delivers high sequential and random read/write performance compared to legacy eMMC solutions, enabling faster boot times, smoother multitasking, and improved user experiences. - 3D TLC NAND Technology
Advanced 3D triple-level cell architecture balances capacity, performance, and cost-effectiveness while maintaining reliable operation throughout the device's lifetime. - Automotive-Grade Qualification
AEC-Q100 Grade 3 qualified for automotive applications, ensuring reliability and quality standards required for in-vehicle electronic systems. - Extended Temperature Range
Operates reliably across -40°C to 85°C, suitable for automotive cabin environments and industrial installations exposed to temperature extremes. - Compact BGA Package
153-ball BGA in a space-efficient 11.5×13×1.4mm footprint enables integration into space-constrained PCB designs typical of automotive modules and embedded systems. - RoHS Compliant
Meets RoHS environmental compliance standards for lead-free manufacturing and environmentally responsible product design.
Typical Applications
- Automotive Infotainment Systems
Stores operating systems, navigation databases, multimedia content, and user data with the fast access speeds required for responsive touchscreen interfaces and seamless media playback. - Telematics and Connectivity Modules
Provides reliable storage for firmware, communication protocols, and logged vehicle data in connected car platforms and fleet management systems. - Advanced Driver Assistance Systems (ADAS)
Supports high-speed data buffering and storage for camera systems, sensor fusion modules, and map data used in driver safety and autonomous driving features. - Digital Instrument Clusters
Enables high-resolution graphics, animation assets, and configuration data storage for modern digital cockpit displays with fast boot and rendering requirements. - Industrial Embedded Systems
Delivers robust, temperature-tolerant storage for human-machine interfaces, data acquisition systems, and industrial controllers operating in harsh environments.
Unique Advantages
- Performance Upgrade Path from eMMC
UFS 2.2 architecture provides significantly higher throughput and improved multitasking compared to eMMC, future-proofing designs for increasingly complex automotive software platforms. - Automotive-Qualified Reliability
AEC-Q100 Grade 3 qualification ensures the memory meets stringent automotive quality and reliability standards, reducing field failure risks and warranty costs. - Space-Efficient Integration
Compact BGA form factor minimizes PCB footprint, allowing designers to maximize functionality in space-constrained automotive modules and embedded controllers. - Wide Operating Temperature Range
-40°C to 85°C rating ensures consistent performance across varying environmental conditions without requiring additional thermal management in most automotive cabin applications. - Scalable Storage Solution
Part of Flexxon's BGA UFS 2.2 series, enabling design scalability across product lines with consistent interfaces and qualification levels. - Non-Volatile Data Retention
Flash-based non-volatile storage maintains data integrity without power, essential for configuration settings, critical system data, and user content preservation.
Why Choose the FBFS064GBA-EA40?
The FBFS064GBA-EA40 combines automotive-grade reliability with the performance advantages of the UFS 2.2 standard, making it an ideal storage solution for next-generation automotive electronics and demanding embedded systems. Its 64GB capacity, extended temperature operation, and compact BGA package deliver the storage density, environmental resilience, and board-level efficiency that modern automotive and industrial designs require.
Backed by AEC-Q100 Grade 3 qualification and Flexxon's focus on automotive and industrial memory solutions, the FBFS064GBA-EA40 provides design engineers with a robust, high-performance storage component that meets both technical requirements and long-term reliability expectations. Whether you're developing advanced infotainment platforms, ADAS modules, or industrial control systems, this UFS 2.2 device offers the storage performance and automotive-grade quality your application demands.
Ready to integrate high-performance automotive-grade storage into your design? Request a quote for the FBFS064GBA-EA40 today and discover how UFS 2.2 technology can enhance your next embedded system.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015