F59L8G81XA-25BG2Y
| Part Description |
SLC NAND Flash, 8Gbit (1Gx8), 3.3V, 63-ball BGA, 25 ns |
|---|---|
| Quantity | 981 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | BGA-63 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 8 Gbit | Access Time | 20 ns | Grade | Commercial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C – 70°C | Write Cycle Time Word Page | 200 µs | Packaging | 63-BGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 1G x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59L8G81XA-25BG2Y – SLC NAND Flash, 8Gbit (1Gx8), 3.3V, 63-ball BGA, 25 ns
The F59L8G81XA-25BG2Y is an 8 Gbit Single-Level Cell (SLC) NAND Flash memory organized as 1G × 8. Designed for parallel asynchronous operation, the device implements an 8-bit multiplexed data bus and standard control signals for command, address and data transfer.
This commercial-grade, non-volatile Flash memory operates from 2.7 V to 3.6 V and is offered in a 63-ball BGA surface-mount package. It targets designs requiring reliable SLC NAND storage with ONFI 1.0 protocol compatibility and industry-standard pinout behavior for density scaling.
Key Features
- Memory Architecture 8.59 Gbit SLC NAND organized as 1G × 8 with device size of 4096 blocks and two planes of 2048 blocks per plane.
- Page and Block Organization Page size is 4,320 bytes (4,096 + 224 spare); block size is 64 pages (256K + 14K bytes).
- Performance Asynchronous I/O with RC/ WC speed grade 25 ns; typical array timings include read page 25 µs, program page 200 µs (typical) and erase block 3 ms (typical).
- Interface and Protocol Parallel 8-bit multiplexed I/O with standard control signals (CE#, CLE, ALE, WE#, RE#) and ONFI 1.0-compliant command set.
- Advanced Command and Data Modes Supports program page cache mode, read page cache mode, one-time programmable (OTP) mode, two-plane commands and multi-die (LUN) operations.
- Device Management and Signals Includes R/B# ready/busy status, WP# hardware write-protect for entire device, RESET (FFh) required as first command after power-on, and internal operation status byte for software detection.
- Reliability Endurance rated to 60,000 program/erase cycles with data retention compliant to JESD47G qualification guidance (see qualification report).
- Power Operating VCC range 2.7 V to 3.6 V for 3.3 V system compatibility.
- Package and Mounting Surface-mount 63-ball BGA (BGA-63) package, commercial operating temperature 0°C to +70°C, RoHS compliant.
Typical Applications
- Commercial embedded storage Non-volatile data and file storage in systems operating within the commercial temperature range (0°C to +70°C).
- Firmware and code storage Storage of firmware, boot code and system images using SLC NAND for endurance and reliable program/erase cycles.
- Scalable density designs Systems that may be upgraded to higher density parts later benefit from the standard pinout, which enables migration without board redesign.
Unique Advantages
- Single-Level Cell reliability: SLC technology and a 60,000 program/erase cycle endurance provide robust write/erase longevity for critical data storage.
- ONFI 1.0 compatibility: Standard ONFI protocol support and a standard pinout simplify integration and support interoperability with ONFI-aware controllers.
- Performance-balanced array timings: Typical read, program and erase times (25 µs read page, 200 µs program page, 3 ms erase block) give predictable latency for embedded storage operations.
- Flexible command set: Cache program/read modes, OTP, two-plane and multi-die operations offer options to optimize throughput and storage management.
- Hardware status and protection signals: R/B# and WP# provide hardware-level operation monitoring and write protection; the operation status byte supports software-level completion and pass/fail checks.
- Commercial temperature and RoHS compliance: 0°C to +70°C operating range and RoHS-compliant manufacturing meet common commercial deployment and regulatory requirements.
Why Choose F59L8G81XA-25BG2Y?
The F59L8G81XA-25BG2Y delivers SLC NAND non-volatile storage with a well-documented organization and predictable array performance. Its ONFI 1.0 compatibility, standard multiplexed 8-bit interface and defined control signals make it straightforward to integrate into existing parallel NAND designs and to scale densities without a board redesign.
With a 2.7 V–3.6 V operating range, commercial temperature rating, and a compact 63-ball BGA package, this device is suited to commercial embedded applications that demand reliable program/erase endurance, data retention per JESD47G guidance, and standard NAND Flash feature set including cache modes, OTP and multi-plane operations.
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