F59L8G81XA-25TG2Y

8Gb NAND Flash
Part Description

SLC NAND Flash, 8 Gbit, 3.3V, x8, 25ns, 48-pin TSOPI

Quantity 1,223 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageTSOPI-48Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size8 GbitAccess Time20 nsGradeCommercial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C – 70°CWrite Cycle Time Word Page200 µsPackaging48-TSOPI
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization1G x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of F59L8G81XA-25TG2Y – SLC NAND Flash, 8 Gbit, 3.3V, x8, 25ns, 48-pin TSOPI

The F59L8G81XA-25TG2Y is an 8.59 Gbit single-level cell (SLC) NAND Flash memory organized as 1G × 8 with a parallel x8 interface. Designed for non-volatile data and program storage, the device supports asynchronous I/O with ONFI 1.0 compatibility and operates from a 2.7 V to 3.6 V supply.

With features such as hardware Ready/Busy# and Write Protect (WP#) signals, multi-plane operations, and internal data-move support, the device addresses embedded storage needs where reliable, byte-addressable NAND Flash is required in a compact 48-pin TSOPI surface-mount package.

Key Features

  • Memory Core 8.59 Gbit SLC NAND organized as 1G × 8 with 4096 blocks total and two planes of 2048 blocks per plane.
  • Page & Block Organization Page size: 4,320 bytes (4,096 + 224 bytes); Block size: 64 pages (256K + 14K bytes).
  • Performance Asynchronous I/O with typical timings: access time 20 ns (spec sheet listing) and RC/ WC rated 25 ns; read page ~25 µs, program page ~200 µs (typ), erase block ~3 ms (typ).
  • Interface & Commands Parallel x8 bus using standard NAND control signals (CE#, CLE, ALE, WE#, RE#) and ONFI 1.0-compliant command set with advanced features such as program/read page cache modes, two-plane commands, OTP mode, and multi-die (LUN) operations.
  • System Signals Ready/Busy# (R/B#) for hardware status, WP# for device write protection, and an operation status byte for software detection of completion and pass/fail conditions.
  • Reliability & Endurance Endurance rated to 60,000 program/erase cycles and data retention compliant with JESD47G (see qualification report).
  • Power & Temperature Supply voltage range 2.7 V to 3.6 V; commercial operating temperature 0 °C to +70 °C.
  • Package & Mounting Surface-mount TSOPI-48 package (12 mm × 20 mm body, 0.5 mm pin pitch), Pb-free option available.
  • Factory & Initialization First block shipped with factory ECC; RESET (FFh) required as the first command after power-on or an alternative device initialization method can be used.

Typical Applications

  • Embedded Storage Non-volatile program and data storage in embedded systems using a parallel x8 NAND interface and 3.3 V supply range.
  • Firmware & Code Store Reliable SLC storage for firmware images where endurance (60,000 P/E cycles) and data retention are required.
  • Consumer & Industrial Devices Local flash storage in commercial-grade electronics operating between 0 °C and +70 °C, benefiting from the TSOPI-48 surface-mount package.

Unique Advantages

  • SLC Endurance: Rated to 60,000 program/erase cycles, providing robust write-cycle longevity for firmware and frequent-update storage.
  • ONFI 1.0 Compliance: Standardized NAND protocol support for compatibility with ONFI-aware controllers and toolchains.
  • Flexible Interface & Controls: Parallel x8 bus with CE#, CLE, ALE, WE#, RE#, R/B# and WP# signals for straightforward hardware integration and status monitoring.
  • Advanced Command Support: Program/read page cache modes, two-plane commands and multi-die operations enable efficient data transfer and parallelism within the device.
  • Wide Voltage Range: 2.7 V to 3.6 V supply window supports common 3.3 V system rails and tolerant operation across typical commercial designs.
  • Compact Surface-Mount Package: TSOPI-48 package provides a low-pin-count footprint for board-level integration without redesign across densities.

Why Choose F59L8G81XA-25TG2Y?

The F59L8G81XA-25TG2Y combines an 8.59 Gbit SLC NAND array with ONFI 1.0 compatibility and a compact TSOPI-48 package, delivering a balance of endurance, predictable latency, and a standard parallel interface. Its documented timing (access time and RC/WC) and internal features such as page cache modes, two-plane operations, and hardware Ready/Busy# support make it suitable for designs that require controlled NAND behavior and straightforward hardware status handling.

This device is positioned for commercial embedded designs needing reliable non-volatile storage with a 2.7 V–3.6 V supply range, commercial temperature operation, and factory-provisioned ECC in the first block. It is well suited to developers and procurement teams seeking a specification-driven SLC NAND solution with documented endurance and array organization.

Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the F59L8G81XA-25TG2Y.

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