FBFS064GBA-EB40

BGA UFS 3.1
Part Description

FBFS064GBA-EB40 64GB UFS 3.1

Quantity 908 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153 FBGAMemory FormatFLASHTechnology3D TLC
Memory Size512 GbitGradeAutomotive grade 3Clock FrequencyN/A
VoltageN/AMemory TypeNon-VolatileOperating Temperature-40°C - 85°C
Packaging11.5x13x1.4mmMounting MethodSurface MountMemory InterfaceUFS 3.1
Memory Organization64G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationAEC-Q100 Grade 3ECCNEAR99
HTS Code8542.32.00.71

Overview of FBFS064GBA-EB40 – 64GB Automotive-Grade UFS 3.1 Flash Memory

The FBFS064GBA-EB40 is a 64GB Universal Flash Storage (UFS) 3.1 memory device from Flexxon, delivering high-performance non-volatile flash storage in a compact 153-ball FBGA package. Built on 3D TLC NAND technology, this device offers 512 Gbit of storage organized as 64G × 8, providing an optimal balance of capacity, speed, and reliability for embedded systems requiring fast sequential and random access performance.

Designed for automotive and industrial applications, the FBFS064GBA-EB40 meets AEC-Q100 Grade 3 qualification standards and operates reliably across an extended temperature range of -40°C to 85°C. Its UFS 3.1 interface enables significantly higher bandwidth compared to legacy eMMC solutions, making it ideal for infotainment systems, advanced driver assistance platforms, industrial controllers, and other demanding embedded applications where performance and environmental resilience are critical.

Key Features

  • High-Capacity 3D TLC Flash Storage
    512 Gbit (64GB) of non-volatile flash memory utilizing advanced 3D TLC NAND technology, delivering robust storage capacity for data-intensive embedded applications while maintaining cost efficiency.
  • UFS 3.1 Interface
    Universal Flash Storage 3.1 interface provides superior read/write performance and lower latency compared to eMMC, enabling faster boot times, quicker application loading, and enhanced system responsiveness.
  • Automotive-Grade Qualification
    AEC-Q100 Grade 3 qualified for automotive applications, ensuring reliability and performance in demanding vehicular environments. Suitable for infotainment, telematics, navigation systems, and other automotive electronics.
  • Extended Temperature Range
    Operating temperature range of -40°C to 85°C supports deployment in harsh environmental conditions, including automotive under-hood applications, industrial automation, and outdoor equipment.
  • Compact Surface-Mount Package
    153-ball FBGA package measuring just 11.5 × 13 × 1.4mm enables space-efficient board designs, critical for space-constrained embedded systems and portable devices.
  • RoHS Compliant
    Fully compliant with RoHS environmental standards, supporting green manufacturing initiatives and global regulatory requirements.

Typical Applications

  • Automotive Infotainment Systems
    Provides high-speed storage for multimedia content, navigation databases, and user interface applications in modern vehicle cockpit systems, delivering smooth performance and quick data access.
  • Advanced Driver Assistance Systems (ADAS)
    Stores map data, sensor calibration parameters, and system logs for ADAS platforms requiring fast, reliable access to critical information in real-time driving scenarios.
  • Industrial Control and Automation
    Serves as reliable non-volatile storage for industrial controllers, HMI panels, and edge computing devices operating in factory floors and harsh industrial environments.
  • Medical and Healthcare Equipment
    Offers dependable storage for patient data, diagnostic images, and system configurations in medical devices requiring both performance and long-term data retention.
  • Edge Computing and IoT Gateways
    Enables high-performance local data storage and processing in edge computing nodes and IoT gateway devices managing large volumes of sensor data and analytics workloads.

Unique Advantages

  • Performance Leap Over eMMC:
    UFS 3.1 interface architecture delivers significantly higher throughput and lower command latency compared to eMMC 5.1, enabling faster system boot times and improved application performance without requiring major architectural changes.
  • Automotive-Ready Reliability:
    AEC-Q100 Grade 3 qualification ensures the device meets stringent automotive reliability standards for temperature cycling, moisture resistance, and operational longevity, reducing validation time and deployment risk in vehicular applications.
  • Wide Operating Temperature Window:
    Extended -40°C to 85°C temperature range provides robust operation across diverse environments, from extreme cold-weather automotive scenarios to high-temperature industrial enclosures, without requiring additional thermal management.
  • Space-Efficient Integration:
    The compact 11.5 × 13mm FBGA footprint and surface-mount design minimize PCB real estate requirements, enabling denser board layouts and supporting miniaturization trends in modern embedded systems.
  • Advanced 3D NAND Technology:
    3D TLC NAND architecture delivers improved endurance and reliability compared to planar NAND, while maintaining competitive cost-per-gigabyte economics for capacity-intensive applications.
  • Future-Proof Storage Solution:
    UFS 3.1 standard provides a forward-compatible storage architecture aligned with industry trends, offering a clear upgrade path from legacy eMMC systems while maintaining compatibility with modern embedded processors and SoCs.

Why Choose FBFS064GBA-EB40?

The FBFS064GBA-EB40 combines the performance advantages of UFS 3.1 technology with automotive-grade reliability and an extended temperature range, making it an ideal storage solution for next-generation automotive, industrial, and edge computing designs. Engineers benefit from significantly improved throughput and response times compared to eMMC-based systems, while the AEC-Q100 Grade 3 qualification reduces validation overhead for automotive deployments. The compact FBGA package and surface-mount design streamline integration into space-constrained layouts without sacrificing performance or reliability.

For design teams seeking to future-proof their embedded systems with high-performance storage that can withstand demanding environmental conditions, the FBFS064GBA-EB40 from Flexxon delivers proven 3D TLC NAND technology in an automotive-qualified package. Its combination of 64GB capacity, UFS 3.1 interface, and wide operating temperature range makes it particularly well-suited for automotive infotainment, ADAS platforms, industrial controllers, and other mission-critical applications where storage performance and environmental resilience are non-negotiable requirements.

Ready to upgrade your embedded storage solution? Contact our sales team today to request a quote for the FBFS064GBA-EB40 and discover how Flexxon's automotive-grade UFS 3.1 memory can enhance your next design. Our technical specialists are available to discuss your specific application requirements and provide samples for evaluation.

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