F59L8G81KSA-25BIG2R
| Part Description |
SLC NAND Flash, 8.59 Gbit, Industrial BGA |
|---|---|
| Quantity | 1,368 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | BGA-63 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 8 Gbit | Access Time | 20 ns | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C – 85°C | Write Cycle Time Word Page | 200 µs | Packaging | 63-BGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 512M x 8 x 2 die | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59L8G81KSA-25BIG2R – SLC NAND Flash, 8.59 Gbit, Industrial BGA
The F59L8G81KSA-25BIG2R from ESMT is an 8.59 Gbit SLC NAND Flash device organized as 512M × 8 × 2 die. Built for industrial applications, it provides parallel x8 NAND flash architecture with support for large page sizes and block erase granularity for file storage, code storage and robust non-volatile data retention.
Designed for systems requiring wide operating voltage tolerance and extended temperature range, the device combines SLC endurance and data retention features with a 63-ball BGA surface-mount package for compact board-level integration.
Key Features
- Memory & Organization 8.59 Gbit SLC NAND organized as 512M × 8 × 2 die with a page size of (4K + 256) bytes and block size of 64 pages (256K + 16K bytes).
- Performance Parallel x8 interface with documented access/read timing (Access Time: 20 ns) and listed 25 ns speed option; supports cache read and cache program operations and copy-back operation for efficient data movement.
- Program & Erase Timing Page program and block erase operations are supported with documented timings in the datasheet (typical page program and erase timings and maximums available in product documentation).
- Power & Voltage Single-supply operation at 3.3 V with an allowed range of 2.7 V to 3.6 V to support common system power rails.
- Reliability & Endurance SLC 1-bit-per-cell technology with endurance up to 60K program/erase cycles and uncycled data retention specified at 10 years (real time at 55°C); ECC requirement of 8-bit per 512 bytes is specified for reliable operation.
- System Features Hardware data protection, program/erase lockout during power transitions, automatic program/erase operations, automatic page 0 read at power-up option, and boot-from-NAND support as detailed in the datasheet.
- Package & Temperature 63-ball BGA (BGA-63) surface-mount package and industrial-grade operating range of −40°C to 85°C for deployment in temperature-sensitive environments.
- Standards & Compliance JEDEC qualification and RoHS compliance are documented for the product series.
Typical Applications
- Embedded Storage Non-volatile program and file storage in devices that require robust SLC endurance and long data retention.
- Industrial Control Firmware and logging storage for controllers and instrumentation operating across −40°C to 85°C.
- Boot/Code Storage Boot-from-NAND support and automatic page read at power-up make this device suitable for system boot and code shadowing.
- Imaging & Recording Storage of image or audio data where high write endurance and reliable erase/program cycles are required.
Unique Advantages
- Industrial Temperature Range: Rated for −40°C to 85°C, enabling use in a wide set of industrial environments.
- SLC Endurance and Retention: 60K program/erase cycles with specified 10-year data retention at 55°C supports long-term field reliability.
- Flexible Power Range: 2.7 V to 3.6 V operation accommodates common 3.3 V systems and tolerates supply variation.
- Compact BGA Package: 63-ball BGA provides a space-efficient surface-mount solution for high-density designs.
- System-Level Reliability Features: Hardware data protection and program/erase lockout during power transitions help protect data integrity during power events.
- JEDEC-Qualified Series: Conforms to JEDEC specifications for predictable integration into established designs.
Why Choose F59L8G81KSA-25BIG2R?
The F59L8G81KSA-25BIG2R is positioned for engineers who need industrial-grade SLC NAND flash with documented endurance, long-term retention and system-level protections. Its parallel x8 interface, large page/block organization and compact 63-ball BGA package make it suitable for embedded storage, boot code retention and industrial control applications where board space and reliability matter.
Backed by ESMT’s NAND feature set—automatic program/erase, cache operations, ECC guidance and JEDEC qualification—this device delivers a practical balance of performance, integration and long-term data robustness for designs targeting extended field life.
If you would like pricing, availability or a formal quotation for F59L8G81KSA-25BIG2R, request a quote or submit an inquiry and our team will respond with details to support your evaluation and procurement process.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A