F59L8G81KSA-25BIG2R

8Gb NAND Flash Ind.
Part Description

SLC NAND Flash, 8.59 Gbit, Industrial BGA

Quantity 1,368 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageBGA-63Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size8 GbitAccess Time20 nsGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page200 µsPackaging63-BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization512M x 8 x 2 die
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.71

Overview of F59L8G81KSA-25BIG2R – SLC NAND Flash, 8.59 Gbit, Industrial BGA

The F59L8G81KSA-25BIG2R from ESMT is an 8.59 Gbit SLC NAND Flash device organized as 512M × 8 × 2 die. Built for industrial applications, it provides parallel x8 NAND flash architecture with support for large page sizes and block erase granularity for file storage, code storage and robust non-volatile data retention.

Designed for systems requiring wide operating voltage tolerance and extended temperature range, the device combines SLC endurance and data retention features with a 63-ball BGA surface-mount package for compact board-level integration.

Key Features

  • Memory & Organization 8.59 Gbit SLC NAND organized as 512M × 8 × 2 die with a page size of (4K + 256) bytes and block size of 64 pages (256K + 16K bytes).
  • Performance Parallel x8 interface with documented access/read timing (Access Time: 20 ns) and listed 25 ns speed option; supports cache read and cache program operations and copy-back operation for efficient data movement.
  • Program & Erase Timing Page program and block erase operations are supported with documented timings in the datasheet (typical page program and erase timings and maximums available in product documentation).
  • Power & Voltage Single-supply operation at 3.3 V with an allowed range of 2.7 V to 3.6 V to support common system power rails.
  • Reliability & Endurance SLC 1-bit-per-cell technology with endurance up to 60K program/erase cycles and uncycled data retention specified at 10 years (real time at 55°C); ECC requirement of 8-bit per 512 bytes is specified for reliable operation.
  • System Features Hardware data protection, program/erase lockout during power transitions, automatic program/erase operations, automatic page 0 read at power-up option, and boot-from-NAND support as detailed in the datasheet.
  • Package & Temperature 63-ball BGA (BGA-63) surface-mount package and industrial-grade operating range of −40°C to 85°C for deployment in temperature-sensitive environments.
  • Standards & Compliance JEDEC qualification and RoHS compliance are documented for the product series.

Typical Applications

  • Embedded Storage Non-volatile program and file storage in devices that require robust SLC endurance and long data retention.
  • Industrial Control Firmware and logging storage for controllers and instrumentation operating across −40°C to 85°C.
  • Boot/Code Storage Boot-from-NAND support and automatic page read at power-up make this device suitable for system boot and code shadowing.
  • Imaging & Recording Storage of image or audio data where high write endurance and reliable erase/program cycles are required.

Unique Advantages

  • Industrial Temperature Range: Rated for −40°C to 85°C, enabling use in a wide set of industrial environments.
  • SLC Endurance and Retention: 60K program/erase cycles with specified 10-year data retention at 55°C supports long-term field reliability.
  • Flexible Power Range: 2.7 V to 3.6 V operation accommodates common 3.3 V systems and tolerates supply variation.
  • Compact BGA Package: 63-ball BGA provides a space-efficient surface-mount solution for high-density designs.
  • System-Level Reliability Features: Hardware data protection and program/erase lockout during power transitions help protect data integrity during power events.
  • JEDEC-Qualified Series: Conforms to JEDEC specifications for predictable integration into established designs.

Why Choose F59L8G81KSA-25BIG2R?

The F59L8G81KSA-25BIG2R is positioned for engineers who need industrial-grade SLC NAND flash with documented endurance, long-term retention and system-level protections. Its parallel x8 interface, large page/block organization and compact 63-ball BGA package make it suitable for embedded storage, boot code retention and industrial control applications where board space and reliability matter.

Backed by ESMT’s NAND feature set—automatic program/erase, cache operations, ECC guidance and JEDEC qualification—this device delivers a practical balance of performance, integration and long-term data robustness for designs targeting extended field life.

If you would like pricing, availability or a formal quotation for F59L8G81KSA-25BIG2R, request a quote or submit an inquiry and our team will respond with details to support your evaluation and procurement process.

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