F59L8G81KSA-25BG2R
| Part Description |
8.59 Gbit SLC NAND Flash, x8, 63-ball BGA |
|---|---|
| Quantity | 916 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | BGA-63 | Memory Format | FLASH | Technology | NAND Flash - SLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 8 Gbit | Access Time | 20 ns | Grade | Commercial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C – 70°C | Write Cycle Time Word Page | 200 µs | Packaging | 63-BGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 512M x 8 x 2 die | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of F59L8G81KSA-25BG2R – 8.59 Gbit SLC NAND Flash, x8, 63-ball BGA
The F59L8G81KSA-25BG2R is an 8.59 Gbit single-level cell (SLC) NAND Flash memory device organized as 512M × 8 × 2 die. It provides parallel x8 I/O and operates from a 2.7 V to 3.6 V supply, delivering high-density non-volatile storage for embedded and consumer applications.
Designed for applications such as solid-state file storage, voice recording and image file memory for still cameras, this device combines SLC endurance and retention characteristics with page/block management and cache operations to support reliable data storage and system boot scenarios.
Key Features
- Density & Organization — 8.59 Gbit total capacity, organized as 512M × 8 × 2 die for stacked-memory operations and large addressable capacity.
- SLC Flash Technology — Single-level cell architecture (1 bit/cell) for higher endurance and data retention compared with multi-level cell technologies.
- Page and Block Architecture — Page size (4K + 256) bytes and block size of 64 pages (256K + 16K bytes) to support efficient program/erase and large transfer operations.
- Performance — Parallel x8 interface with an access time of 20 ns and supported cache program/read and copy-back operations to improve effective throughput in system designs.
- Program/Erase Timing — Page program typical and maximum timings documented (page program times and block erase times available in datasheet) to help design predictable write/erase cycles.
- Endurance & Retention — Endurance rated to 60K program/erase cycles with uncycled data retention specified at 10 years (at 55 °C) for long-term storage reliability.
- ECC Requirement — ECC requirement of 8 bit per 512 bytes, enabling appropriate error management in host designs.
- Power and Interface — Supply voltage range 2.7 V to 3.6 V and parallel command/address/data multiplexed DQ port for conventional NAND host controllers.
- Package & Mounting — Surface-mount 63-ball BGA package (BGA-63) for compact board integration.
- Compliance & Grade — Commercial grade device with RoHS compliance; designed for standard embedded and consumer environments.
Typical Applications
- Solid-State File Storage — High-density non-volatile storage for removable or embedded file systems where reliable program/erase cycles are required.
- Still Cameras & Imaging — Image file memory for cameras, leveraging large page/block architecture and cache program/read to manage large file transfers.
- Voice Recorders & Audio Recording — Persistent storage for audio data with robust SLC endurance for frequent write cycles.
- Embedded Consumer Devices — Firmware storage and boot-from-NAND support for consumer electronics and embedded controllers within specified commercial temperature range.
Unique Advantages
- SLC Reliability: Single-level cell design (1 bit/cell) and 60K P/E cycle endurance provide robust lifecycle characteristics for frequent write/erase use cases.
- Large, Efficient Data Units: 4K+256 byte page and 64-page block structure simplify large-file programming and block erase operations.
- Built-in Boot and Cache Support: Boot-from-NAND option plus cache program/read and copy-back operations streamline system boot and improve effective program/read throughput.
- Host-Level Error Management: Specified ECC requirement (8-bit/512-byte) lets system designers implement appropriate error correction strategies for reliable data integrity.
- Flexible Supply Range: 2.7 V–3.6 V operation supports typical 3.3 V system supplies, easing integration into existing designs.
- Compact BGA Footprint: 63-ball BGA package enables high-density board layouts and surface-mount assembly.
Why Choose F59L8G81KSA-25BG2R?
The F59L8G81KSA-25BG2R positions as a high-density SLC NAND solution for designs requiring durable, long-retention non-volatile memory with established page/block management and host ECC requirements. Its parallel x8 interface, stacked die organization and BGA-63 package allow compact integration into consumer and embedded systems that need reliable file storage and boot support.
With documented program/erase timings, endurance, and retention guidance, the device is suited to designers who require predictable lifecycle behavior and straightforward NAND management in commercial-grade applications.
Request a quote or submit a purchase inquiry to receive pricing and availability information for the F59L8G81KSA-25BG2R.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
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