F59L8G81KSA (2R)

The ESMT F59L8G81KSA (2R) is an automotive-grade SLC NAND Flash memory device offering 8.59 Gbit of non-volatile storage in a multi-die organization. It provides a parallel memory interface and is supplied for use with 3.3V-class systems.

Designed for embedded storage in automotive applications, the device combines SLC NAND architecture, AEC-Q100 qualification, and industry-standard package options to support robust integration and reliable operation in vehicle electronic systems.

Key Features

• Memory Core 8.59 Gbit SLC NAND Flash organized as 512M x 8 x 2 die, delivering non-volatile storage in an industry-familiar organization.
• Performance Fast access with a 20 ns access time and a write cycle time (word/page) of 400 µs to support typical embedded storage operations.
• Interface Parallel memory interface for straightforward integration into systems that require parallel NAND connectivity.
• Power Supports a voltage supply range of 2.7V to 3.6V and is labeled for 3.3V operation, enabling compatibility with common automotive and embedded power rails.
• Reliability & Qualification Automotive grade device with AEC-Q100 qualification to meet automotive electronic qualification requirements.
• Package & Mounting Available in 48-pin TSOPI and 63-ball BGA packages, both supplied as surface-mount devices to fit a range of PCB assembly choices.
• Operating Temperature Specified operating temperature: -40 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Automotive data logging — Use as non-volatile storage for vehicle event or sensor data where automotive-grade qualification is required.
• ECU firmware and calibration storage — Store firmware images and calibration tables for electronic control units that require SLC NAND Flash memory.
• In-vehicle infotainment and telematics — Provide solid-state storage for embedded multimedia and telematics subsystems in automotive platforms.

Unique Advantages

• AEC-Q100 qualified — Meets automotive qualification criteria to support deployment in vehicle electronic systems.
• SLC NAND architecture — Single-level cell design with clear die organization (512M x 8 x 2) for straightforward capacity planning and integration.
• Wide supply range — 2.7V–3.6V supply window supports 3.3V-class designs and provides flexibility across automotive power environments.
• Multiple package options — Choice of 48-pin TSOPI or 63-ball BGA packages enables board-level design flexibility for different form-factor and assembly requirements.
• Surface-mount compatibility — Designed for standard SMD assembly processes to simplify manufacturing integration.
• RoHS compliant — Conforms to lead-free and environmental compliance expectations.

Why Choose F59L8G81KSA (2R)?

The F59L8G81KSA (2R) positions itself as a reliable automotive-grade SLC NAND Flash option that balances performance, qualification, and practical integration features. With an 8.59 Gbit capacity, parallel interface, and AEC-Q100 qualification, it is suited for designers specifying non-volatile storage for automotive electronic control units, infotainment, and data logging systems.

Its 2.7V–3.6V supply range, standard package options, and RoHS compliance provide predictable integration and manufacturing behavior, supporting longer-term deployment in production vehicle programs and embedded applications.

Request a quote or submit an inquiry to get pricing and availability for the F59L8G81KSA (2R) for your design requirements.